industry news
Subscribe Now

PICMG ratifies COM-HPC FuSa extensions Supporting high-performance mixed-criticality systems

WAKEFIELD, MA., NOVEMBER 16, 2022. PICMG, a leading consortium for the development of open embedded computing specifications, has announced major extensions to the COM-HPC Computer-on-Module (COM) standard with the ratification of COM-HPC 1.15 for Functional Safety (FuSa). COM HPC 1.15 supports workload consolidated high-performance mixed-criticality for real-time edge servers and clients that must execute not only safety controls but also vision, AI and IIoT gateway logic or even TSN based 5G communication.

COM-HPC 1.15 is a set of safety extensions that expand the FuSa capabilities of “safety island” blocks on modern chipsets out to the broader system. Available on all COM-HPC form factors – including the upcoming COM-HPC Client Mini – COM-HPC FuSa extensions define a dedicated SPI signal that connects health and status monitoring features of such blocks to a FuSa “safety controller” located on a COM-HPC carrier board where any findings can be processed for external use.

The COM-HPC 1.15 architecture thus enables the creation of multicore embedded mixed-criticality systems by providing a direct path to redundancy and fail-safe process implementation for developers of robotics and industrial machine controls, train and wayside controls, autonomous vehicles, avionics, and other critical systems.

“With the small size definition of the upcoming Mini specification and the FuSa extensions, COM-HPC covers all use cases I can think of,” says Christian Eder, Chairman of the COM-HPC technical committee and Director Product Marketing at congatec. “COM-HPC is the most complete computer module definition ever. I expect extremely fast growth for scalable and compute-power-hungry embedded applications based on COM-HPC technology.”

The COM-HPC 1.15 specification effort is sponsored by ADLINK, congatec, and Kontron.

For more information on the COM-HPC FuSa specification, visit www.picmg.org/openstandards/com-hpc, or purchase the specification for $750 from www.picmg.org/product/com-hpc-module-base-specification-revision-1-15.
More on PICMG’s range of open, modular computing standards can be found at https://www.picmg.org.

About PICMG
Founded in 1994, PICMG is a not-for-profit 501(c) consortium of companies and organizations that collaboratively develop open standards for high performance industrial, Industrial IoT, military & aerospace, telecommunications, test & measurement, medical, and general-purpose embedded computing applications. There are over 130 member companies that specialize in a wide range of technical disciplines, including mechanical and thermal design, single board computer design, high-speed signaling design and analysis, networking expertise, backplane, and packaging design, power management, high availability software and comprehensive system management.
Key standards families developed by PICMG include COM Express, COM-HPC, ModBlox7, IoT.1, CompactPCI, AdvancedTCA, MicroTCA, AdvancedMC, CompactPCI Serial, COM Express, SHB Express, MicroSAM, and HPM (Hardware Platform Management). For more information visit https://www.picmg.org.

Leave a Reply

featured blogs
Apr 19, 2024
Data type conversion is a crucial aspect of programming that helps you handle data across different data types seamlessly. The SKILL language supports several data types, including integer and floating-point numbers, character strings, arrays, and a highly flexible linked lis...
Apr 18, 2024
Are you ready for a revolution in robotic technology (as opposed to a robotic revolution, of course)?...
Apr 18, 2024
See how Cisco accelerates library characterization and chip design with our cloud EDA tools, scaling access to SoC validation solutions and compute services.The post Cisco Accelerates Project Schedule by 66% Using Synopsys Cloud appeared first on Chip Design....

featured video

MaxLinear Integrates Analog & Digital Design in One Chip with Cadence 3D Solvers

Sponsored by Cadence Design Systems

MaxLinear has the unique capability of integrating analog and digital design on the same chip. Because of this, the team developed some interesting technology in the communication space. In the optical infrastructure domain, they created the first fully integrated 5nm CMOS PAM4 DSP. All their products solve critical communication and high-frequency analysis challenges.

Learn more about how MaxLinear is using Cadence’s Clarity 3D Solver and EMX Planar 3D Solver in their design process.

featured chalk talk

TE Connectivity MULTIGIG RT Connectors
In this episode of Chalk Talk, Amelia Dalton and Ryan Hill from TE Connectivity explore the benefits of TE’s Multigig RT Connectors and how these connectors can help empower the next generation of military and aerospace designs. They examine the components included in these solutions and how the modular design of these connectors make them a great fit for your next military and aerospace design.
Mar 19, 2024
4,399 views