News – Page 619 – EEJournal

Vishay Intertechnology IHCM Common Mode Choke Offers Low Profile, High Shock and Vibration Resistance for 35 A Commercial Applications

Available With SMD or Through-Hole Mounting Options, Customizable Device Delivers Saturation Current to 35 A and Low DCR Losses Across Temps to +155 °C

December 9, 2021

MALVERN, Pa., Dec. 08, 2021 (GLOBE NEWSWIRE) — Vishay Intertechnology, Inc. (NYSE: VSH) today introduced a new IHCM common mode choke for high current commercial applications to 35 A. Available with a low profile surface-mount construction, the Vishay Custom Magnetics Read More → "Vishay Intertechnology IHCM Common Mode Choke Offers Low Profile, High Shock and Vibration Resistance for 35 A Commercial Applications"

Keysight First to Deliver CTIA Authorized 5G mmWave Over-the-Air Test System

Accelerates roll-out of wireless broadband connectivity using high-band spectrum in the U.S.

December 8, 2021

SANTA ROSA, Calif. December 8, 2021

Keysight Technologies, Inc. (NYSE: KEYS), a leading technology company that delivers advanced design and validation solutions to help accelerate innovation to connect and secure the world, announced that the company is first to deliver a complete CTIA authorized 5G mmWave over-the-air (OTA) test system for validating device transceiver performance in a laboratory environment, accelerating the … Read More → "Keysight First to Deliver CTIA Authorized 5G mmWave Over-the-Air Test System"

Sylvac adds advanced connectivity to precision tools using Insight SIP RF modules, enabling Industry 4.0 solutions

Sylvac SA, a Swiss based manufacturer of class leading measuring tools, has incorporated BLE modules from Insight SIP, the specialist in ultra-miniature RF modules, to enable enhanced connectivity features within its range class leading digital measuring instruments.

December 8, 2021

Sylvac SA is a family-owned Swiss company based in Yverdon-les-Bains, 30 minutes from Lausanne. Over 50 years, it has developed into a leading manufacturer of professional measuring tools. This includes hand-held and portable/benchtop instruments with digital readouts such as callipers, micrometres and depth gauges

Connectivity Benefits

Sylvac has long had a reputation for quality. Its digital readouts on its instruments offer clear and precise readings. However, within any industrial or research process, there remained the issue of logging the data from the instruments, with the inevitable possibility of … Read More → "Sylvac adds advanced connectivity to precision tools using Insight SIP RF modules, enabling Industry 4.0 solutions"

Tellabs FlexSym ONT202 Excels Connecting Wi-Fi and IP Cameras over 10 Gigabit Optical LAN

Purpose-built Tellabs FlexSym ONT202 offers flexible design choices for connecting Wi-Fi 6 access points and IP Security Cameras over a 10 Gigabit Passive Optical LAN using Multi-Gigabit Ethernet.

December 8, 2021

CARROLLTON, Texas, Dec. 07, 2021 (GLOBE NEWSWIRE) — Tellabs, the leading provider of Passive Optical Network (PON) solutions, announces that Tellabs FlexSym® Optical Network Terminal 202 (ONT202), and System Release 31.4 (SR31.4) software is moving forward with initial customer deployments.

Seoul Robotics Introduces First-of-its-Kind LiDAR Deployment Kit

Endeavor, the first multi-sensor LiDAR solution to offer edge processing with deep learning, further streamlines implementation of 3D systems

December 8, 2021

IRVINE, Calif., Dec. 07, 2021 (GLOBE NEWSWIRE) — Seoul Robotics, the first 3D computer vision company to commercialize deep learning AI to … Read More → "Seoul Robotics Introduces First-of-its-Kind LiDAR Deployment Kit"

Lam Research Unveils Syndion GP to Help Chipmakers Meet Demand for Advanced Power Devices

Expanding Company’s Leadership in Deep Silicon Etch Technology, New Semiconductor Manufacturing Solution Supports Development of Chips for Automotive and Smart Technologies

December 8, 2021

FREMONT, Calif., Dec. 07, 2021 (GLOBE NEWSWIRE) — Lam Research Corp. (NASDAQ: LRCX) today announced Syndion® GP: a new product that provides deep silicon etch capabilities to chipmakers developing next generation power devices and power management integrated circuits used in the automotive, electric power delivery and energy industries.

As technologies in these sectors become more advanced, the need for higher power, improved performance and greater density at the chip level increases, requiring greater cross-wafer uniformity for higher aspect-ratio structures. These enhancements can be achieved by moving to an advanced device structure without sacrificing form factor. To do that, device manufacturers … Read More → "Lam Research Unveils Syndion GP to Help Chipmakers Meet Demand for Advanced Power Devices"

Melexis development kit: effortless contactless current sensing evaluation

Magnetic evaluation made easy with a comprehensive modular platform

December 8, 2021

Tessenderlo, Belgium, 7 December 2021 – Melexis introduces its latest development kits (DVKs) for current sensor IC evaluation. These DVKs give engineers a real preview of each IC’s features in their own design. At the same time, they optimize the investment and resource allocation.

Melexis, a global microelectronics engineering company, has introduced two new development kits. They enable engineers to study the functional capabilities of Melexis current sensor ICs, thereby shortening customer development times and accelerating project completion. One DVK allows engineers to experiment with arrangements featuring IMC-Hall® technology (with or without inclusion of shielding), while the other does … Read More → "Melexis development kit: effortless contactless current sensing evaluation"

Power Integrations’ New InnoSwitch3-TN ICs Slash Energy Waste in Appliance Power Supplies by 75%

Beyond the buck regulator: Newest InnoSwitch3 IC family delivers simplicity, flexibility, and industry-leading efficiency in high-output-current designs

December 8, 2021

San Jose, Calif. – December 7, 2021 – Power Integrations (Nasdaq: Read More → "Power Integrations’ New InnoSwitch3-TN ICs Slash Energy Waste in Appliance Power Supplies by 75%"

SiLC Technologies Rolls Out First Commercially Available Chip-Integrated FMCW LiDAR Sensor

Eyeonic Vision Sensor Poised to Accelerate Next-Generation Machine Vision in Mobility, Robotics, Security and other Markets

December 7, 2021

MONROVIA, Calif.–(BUSINESS WIRE)–Today, SiLC Technologies, Inc. (SiLC) announces the launch of its powerful, compact vision sensor delivering coherent vision and chip-scale integration to the broader market. The new Eyeonic™ Vision Sensor takes LiDAR to a new level of … Read More → "SiLC Technologies Rolls Out First Commercially Available Chip-Integrated FMCW LiDAR Sensor"

TDK enhances scalability of its SmartAutomotive™ performance platforms with newly expanded IMU portfolio

December 7, 2021

• IAM-20680HT high temperature automotive 6-Axis MotionTracking™ device for non-safety automotive applications
• Extends standard IAM-20680 performance up to 105°C
• Two independent interrupt lines and extended FIFO up to 4096-bytes
• Automotive qualification based on AEC-Q100 grade 2 (operating range -40°C to 105°C)
• Pin-to-pin and register compatible with IAM-20680, IAM-20680HP, IAM-20380, IAM-20381

December 07, 2021 — TDK Corporation (TSE: 6762) announces today the availability of InvenSense IAM-20680HT high temperature automotive monolithic 6-Axis MotionTracking sensor platform solution for non-safety automotive applications, which includes the IAM-20680HT IMU MEMS sensor and the DK-20680HT developer kit.