News – Page 618 – EEJournal

STMicroelectronics Drives the Future of EVs and Industrial Applications with New Silicon-Carbide Devices

December 10, 2021

ST’s latest-generation silicon-carbide (SiC) power devices extend leadership
in performance and reliability for e-mobility and energy-efficient industry
Continued long-term investment in SiC positions ST for future growth

Geneva, Switzerland, December 9, 2021 – STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, is introducing its third generation of STPOWER silicon-carbide (SiC) MOSFETs[1], advancing the state-of-the-art in power devices for electric-vehicle (EV) powertrains and other applications where power density, energy efficiency, and reliability are important target criteria.

The market … Read More → "STMicroelectronics Drives the Future of EVs and Industrial Applications with New Silicon-Carbide Devices"

Avery Design Systems Offers Comprehensive Verification Support for the New HBM3 Interface Standard

Rambus uses Avery HBM3 memory model to verify its HBM3 PHY and Controller Subsystem

December 10, 2021

Tewksbury, MA – December 8, 2021 – Avery Design Systems, a leader in functional verification solutions, today announced comprehensive support for the new HBM3 interface standard. Rambus uses Avery’s high-quality HBM3 memory models to verify the new Rambus HBM3 Memory Subsystem.

The Rambus HBM3 Memory Subsystem, comprised of an HBM3 PHY and HBM3 Controller, is optimized for systems … Read More → "Avery Design Systems Offers Comprehensive Verification Support for the New HBM3 Interface Standard"

Point One Navigation and Quectel Bring Precise Location to Robotics and Agriculture Markets

Point One and Quectel partnership creates highly affordable, small and easy to use high precision GNSS module integrating RTK for mass market applications

December 9, 2021

San Francisco, December 9, 2021 –Point One Navigation, a leader in precision location technology, and Quectel Wireless Solutions, a global supplier of IOT modules and antennas, today announced the LG69T-AM, the latest addition to the LG69T GNSS Module Series. Point One’s positioning … Read More → "Point One Navigation and Quectel Bring Precise Location to Robotics and Agriculture Markets"

Industrial Smart-Sensor Evaluation Kit from STMicroelectronics Accelerates Design with IO-Link Transceiver and STM32 MCU

December 9, 2021

Geneva, December 8, 2021 – Featuring a slim, 45.8mm x 8.3mm main board, the STMicroelectronics STEVAL-IOD04KT1 industrial-sensor kit simplifies the development of compact IO-Link (IEC 61131-9) sensors for fieldbus-independent point-to-point bi-directional communication.

The main board integrates an STM32G0 microcontroller with ST’s Read More → "Industrial Smart-Sensor Evaluation Kit from STMicroelectronics Accelerates Design with IO-Link Transceiver and STM32 MCU"

NI and Silicon Catalyst Partner to Empower Startup Company Innovations

December 9, 2021

Silicon Valley, CA and Austin, TX, December 8, 2021 – Silicon Catalyst, the world’s only incubator focused exclusively on accelerating semiconductor solutions announced today that NI is now a member of its In-Kind Partner (IKP) ecosystem. NI (NASDAQ: NATI) is a leading provider of software-centric automated semiconductor test solutions.

With over 40 years of experience developing automated test and measurement systems, NI’s goal has always been to help engineers solve the world’s toughest challenges. Within the semiconductor community, NI offers industry-leading, software-centric solutions for RFIC and mixed signal testing, from the lab to manufacturing. Companies in … Read More →

element14 Launches Thermal Switches Design Challenge

Community members are invited to put their thermal switch knowledge to the test

December 9, 2021

Chicago – December 8, 2021: element14, an Avnet Community, is hosting a design challenge around thermal switches (also called thermal sensors) to celebrate the new generation of temperature sensors that deliver greater accuracy, faster response times, and better stability. Participants will be given a kit of thermal switches and encouraged to experiment with their uses, applications, responses, and more.

“Traditional, bimetallic thermal switches have been a mainstay for … Read More → "element14 Launches Thermal Switches Design Challenge"

ADLINK and Pixus Technologies Build a Strategic Partnership to Develop Highly Integrated, SOSA-Aligned OpenVPX System Solutions for Aerospace and Defense Applications

System developers can capitalize on the non-proprietary, open-architecture embedded computing capabilities to deliver ruggedness in harsh operating environments and speed time-to-market while achieving cost-effectiveness

December 9, 2021

Summary:
● The strategic partnership leverages ADLINK’s more than two decades of experience in rugged embedded computing for mission-critical applications, and Pixus’ deep expertise in military standards-compliant design for system backplane and chassis platforms
● The two companies will jointly develop SOSA™-aligned OpenVPX Proof of Concept (PoC) demonstration units and engage with global system integrators to develop advanced C4ISR applications
● ADLINK’s SOSA™-aligned OpenVPX building blocks include one of the industry’s first Intel Tiger Lake processor-based 3U VPX blades, the VPX3-TL

San Jose, California – December 8, 2021

TDK offers high-precision NTC chips for embedding into IGBT modules

December 9, 2021

December 8, 2021

TDK Corporation (TSE:6762) presents the new L860 NTC thermistor chip which can be directly embedded into power modules and used within sintering and AI-heavy wire bonding. Its characteristics correspond to the common MELF-R/T curve with R100 of 493 Ω. The lead-free chip with ordering code B57860L0522J500 is designed for a wide temperature range of -55 °C to +175 °C, has dimensions of 1.6 x 1.6 x 0.5 mm.

Unlike conventional SMD NTC chips, the leadless NTC chip is mounted horizontally. For electrical bonding, the product is fitted on the bottom with a Ni/Ag thin-film electrode for … Read More → "TDK offers high-precision NTC chips for embedding into IGBT modules"

DVCon U.S. 2022 Advance Program Available

Keynote to focus on Artificial Intelligence & Machine Learning

December 9, 2021

Gainesville, FL – December 8, 2021 – The advance program is now available for the 2022 Design and Verification Conference and Exhibition United States (DVCon U.S.), sponsored by Accellera Systems Initiative. The virtual conference and exhibition will be held February 28-March 3, 2022.

“We have an exciting technical program in store for attendees,” stated John Dickol, DVCon U.S. 2022 Program Chair. “This year we added another layer to our already rigorous paper review process, helping to ensure attendees receive the quality program they’ve come to expect from DVCon. Attendees can look forward to sessions covering low power, RISC-V, … Read More → "DVCon U.S. 2022 Advance Program Available"

Microchip to Provide Silicon Carbide MOSFETs and Digital Gate Drivers for Mersen’s SiC Power Stack Reference Design

Electric vehicle, commercial transportation, renewable energy and storage system designers can benefit from silicon carbide stack solution that drives performance and cost efficiencies and accelerates time to market by up to six months

December 9, 2021

CHANDLER, Ariz., Dec. 08, 2021 (GLOBE NEWSWIRE) — E-mobility and renewable energy systems require power management solutions that drive performance and cost efficiencies in addition to speeding up development time. To keep pace with these requirements, Microchip Technology Inc. (Nasdaq: MCHP) today announced the collaboration with Mersen on their 150 kilovolt-ampere (kVA) three-phase silicon carbide Read More → "Microchip to Provide Silicon Carbide MOSFETs and Digital Gate Drivers for Mersen’s SiC Power Stack Reference Design"

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