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CUI Devices Adds Highly Economical Dc Fans with Industry-Best Lead Times

LAKE OSWEGO, Ore. — December 14, 2021 — CUI Devices’ Thermal Management Group today announced the recent expansion of its dc fans and blowers product line with the addition of over 30 new series and over 500 new SKUs. These highly economical models include a range of sleeve bearing and ball bearing options as well as CUI Devices’ Read More → "CUI Devices Adds Highly Economical Dc Fans with Industry-Best Lead Times"

MICLEDI Announces 300mm MicroLED Production Breakthrough Poised to Set the High-Water Mark for Augmented Reality Glasses

LEUVEN, Belgium, Dec. 14, 2021 (GLOBE NEWSWIRE) — MICLEDI Microdisplays, a leading technology company in the field of microLED displays for high-end Augmented Reality (AR) glasses, has demonstrated the industry’s first microLED arrays-for-AR built on a 300mm CMOS manufacturing platform. The unparalleled manufacturing precision, performance and cost-efficiency offered by the 300mm product strategy distinguishes MICLEDI as a display partner of choice for AR glasses manufacturers.

MICLEDI’s solution is uniquely positioned to address the needs of future AR glasses in terms of the display size, resolution, brightness, image quality, … Read More → "MICLEDI Announces 300mm MicroLED Production Breakthrough Poised to Set the High-Water Mark for Augmented Reality Glasses"

MIPI M-PHY Update Doubles Peak Data Rate for Next-Generation Flash Memory Storage Applications

The MIPI M-PHY Version 5.0 physical-layer specification addresses
increasing data rate requirements and provides engineers with design flexibility for advanced 5G smartphone, wearable, PC and automobile flash memory storage use cases

PISCATAWAY, N.J., December 14, 2021—The Read More → "MIPI M-PHY Update Doubles Peak Data Rate for Next-Generation Flash Memory Storage Applications"

Butterfly Network Leverages Cadence Clarity 3D Solver for Advanced Mobile Ultrasound Design

Highlights:

● Clarity 3D Solver speeds advanced package model characterization five-fold over alternative solution

● Complete Cadence front-to-back system design process shortens design turnaround time

● Cadence system design and analysis technology is a key contributor to Butterfly’s ultrasound-on-a-chip system

SAN JOSE, Calif., December 14, 2021—Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced that Butterfly Network, Inc. has successfully deployed the Cadence® Clarity™ 3D Solver to support and enhance the design of its handheld, single-probe, whole-body ultrasound system. The Clarity 3D Solver is used as part of Butterfly’s system design and analysis workflow … Read More → "Butterfly Network Leverages Cadence Clarity 3D Solver for Advanced Mobile Ultrasound Design"

Kandou Delivers USB-C Multiprotocol Retimer Product Family for USB4 Support

LAUSANNE, Switzerland, Dec. 14, 2021 (GLOBE NEWSWIRE) — Kandou, an innovative leader in high-speed, energy-efficient chip-to-chip link solutions to improve the way the world connects and communicates, today announced volume production of its … Read More → "Kandou Delivers USB-C Multiprotocol Retimer Product Family for USB4 Support"

Atmosic Partners with Primax to Bring Ultra-Low Power Connectivity Solutions to Human Interface Devices

CAMPBELL, Calif. and TAIPEI CITY, Taiwan– December 15, 2021, Primax Electronics Ltd. developer and manufacturer of advanced Human Machine Interface devices have selected the Atmosic Technologies ATM2 series Bluetooth 5 system-on-chips (SoCs) for their TKB Series product line. … Read More → "Atmosic Partners with Primax to Bring Ultra-Low Power Connectivity Solutions to Human Interface Devices"

Infineon expands wireless portfolio to support Matter with multiprotocol solutions including Bluetooth LE and 802.15.4 low-power SoC for smart homes

Munich, Germany – 14 December 2021 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) today announced the launch of the new AIROC™ Bluetooth® LE and 802.15.4 family to help companies quickly bring low-power, high-performing Matter products to market. Infineon’s AIROC CYW30739 Bluetooth LE & 802.15.4 system on chip (SoC) is a reliable, secure and scalable solution to connect low-power devices in the smart home. The powerful combination of complementary Bluetooth LE and 802.15.4 protocols enhances the performance of smart home products with seamless … Read More → "Infineon expands wireless portfolio to support Matter with multiprotocol solutions including Bluetooth LE and 802.15.4 low-power SoC for smart homes"

e-con Systems launches 100 fps Full HD SONY STARVIS™ IMX462 camera that stands out in its superior near-infrared performance.

San Jose and Chennai (October 20, 2021) – e-con Systems has launched See3CAM_CU27, a Full HD ultra-low light USB 3.1 Gen 1 camera with superior near-infrared performance.

See3CAM_CU27 is a low light camera based on the SONY STARVIS IMX462 image sensor. It stands out in its superior near-infrared performance. The high sensitivity of this Full … Read More → "e-con Systems launches 100 fps Full HD SONY STARVIS™ IMX462 camera that stands out in its superior near-infrared performance."

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