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Icera and Magma Collaborate on 28-nm High-Performance, Low-Power Flow to Accelerate Turnaround time for Next-Generation Soft Modem Chipsets

SAN JOSE, Calif., and Bristol, UK, Dec. 2, 2010 – Magma Design Automation Inc. (Nasdaq: LAVA), a provider of chip design software, and Icera Inc., a pioneer in soft modem chipsets for smartphones and mobile broadband devices, today announced joint development of Icera’s 28-nanometer (nm) high-performance, low-power system-on-chip (SoC) design flow for its next-generation chipsets. Icera devices are used by OEMs globally to deliver extremely small, fully software-based multimode 4G LTE/3G/2G cellular modems for smartphones, and mobile broadband devices such as USB sticks, tablets and netbooks. Icera chose Magma’s Talus platform because it provides a … Read More → "Icera and Magma Collaborate on 28-nm High-Performance, Low-Power Flow to Accelerate Turnaround time for Next-Generation Soft Modem Chipsets"

Melfas Uses Magma’s Talus and FineSim SPICE to Tape Out Low-Power, ARM Cortex Processor-Based Mixed-Signal SoCs

SAN JOSE, Calif., Dec. 1, 2010 – Magma Design Automation Inc. (Nasdaq: LAVA), a provider of chip design software, today announced that Melfas, a leader in capacitive-sensing touch input solutions, has used the Talus® platform, including Talus RTL, Talus Vortex and Talus Power Pro, and the FineSim™ SPICE circuit simulation tool to implement two of its next-generation MCS-8000 touch sensor chips, which feature ARM® Cortex™ processors. The Melfas ICs are used in mobile phones, smartphones, MP3 players, monitors and other consumer electronics. With the Talus platform and Magma’s RTL-to-GDSII … Read More → "Melfas Uses Magma’s Talus and FineSim SPICE to Tape Out Low-Power, ARM Cortex Processor-Based Mixed-Signal SoCs"

X-FAB First Pure-Play Foundry to Provide Ready-to-Use Hall Sensor

Erfurt, Germany, November 30, 2010 – X-FAB Silicon Foundries, the leading analog/mixed-signal foundry and expert in “More than Moore” technologies, today became the first pure-play foundry to deliver integrated Hall effect functionality as a fully characterized, documented and ready-to-use Hall sensor device. Implemented in X-FAB’s 0.18 micrometer high-voltage process technology (XH018), the new low-power, highly sensitive magnetic field sensor device is a perfect fit for battery-powered applications. It allows engineers to change the system architecture of the entire sensing application into a more cost-effective single-chip … Read More → "X-FAB First Pure-Play Foundry to Provide Ready-to-Use Hall Sensor"

austriamicrosystems and NXP Semiconductors collaborate to deliver turnkey solution for authentication of fast moving consumer goods

Unterpremstaetten, Austria (November 30, 2010) – austriamicrosystems (SIX: AMS), a leading global designer and manufacturer of high-performance analog ICs, and NXP Semiconductors N.V. (Nasdaq: NXPI), a leading provider of RFID solutions, today announced that they have jointly developed the first in a range of reference solutions for product authentication in embedded consumer applications. Leveraging the AS399x UHF RFID Reader IC, and the UCODE G2iL series, the reference design delivers the industry’s lowest power consumption, lowest solution cost, lowest complexity and highest level of integration – a combination unmatched anywhere in the world.

Read More → "austriamicrosystems and NXP Semiconductors collaborate to deliver turnkey solution for authentication of fast moving consumer goods"

Magma’s FineSim Deployed by Toshiba Corporation for Advanced Flash Memory Sign-off Simulation

SAN JOSE, Calif. and YOKOHAMA, Japan, Nov. 30, 2010 — Magma® Design Automation Inc. (Nasdaq: LAVA), a provider of chip design software, announced today that Toshiba Corporation, a leading provider of flash memory products, has deployed the FineSim™ platform for sign-off simulation. Toshiba uses FineSim Pro with the native multi-CPU technology for its NAND flash memory development.

“Toshiba’s flash products, featuring leading-edge technology and functionality, are highly differentiated and used in wide variety of applications,” said Masaki Momodomi, Memory Technology … Read More → "Magma’s FineSim Deployed by Toshiba Corporation for Advanced Flash Memory Sign-off Simulation"

MoSys to Present at IP-SOC 2010

SANTA CLARA, Calif., November 30, 2010 –

Who:         MoSys (NASDAQ: MOSY), a leading architect of serial chip-to-chip communications solutions that deliver unparalleled bandwidth performance for next generation networking systems and advanced system-on-chip (SoC) designs, is presenting at IP-SOC 2010.

What:       MoSys’ presentation, “SerDes in High Reliability, Long Reach Applications,” explores the challenges … Read More → "MoSys to Present at IP-SOC 2010"

Multi-Channel Amplifier IC for Fast Digital Power Conversion

MAZeT introduces a new MDDC 4-channel sensor signal amplifier for sensors with current output, which also converts small input currents quickly and across a high bandwidth and dynamic range and digitizes them on chip via a transimpedance amplifier. Transimpedance amplifiers are preferred in industrial measurement technology for their rapid and cyclic conversion and amplification of the very small currents used in optoelectronic sensors. The ASIC MDDC is suitable for fast applications in conjunction with detectors and arrays, such as In-Line (Color) Measurement and control in automated processes, such as printing and analysis.

The transimpedance (gain) is independently … Read More → "Multi-Channel Amplifier IC for Fast Digital Power Conversion"

New FlexRay Active Star IC from austriamicrosystems first to fully conform to the FlexRay Standard 2.1 Rev B

Unterpremstaetten, Austria (November 29, 2010) – austriamicrosystems (SIX: AMS), a leading global designer and manufacturer of high-performance analog ICs, has introduced the AS8223, the industry’s first monolithic FlexRay Standard V2.1 Rev B compliant Active Star Device. The AS8223 manages communication traffic among four FlexRay branches of the network, expandable to more branches through an Interstar interface.

The four branches of the AS8223 operate as a FlexRay receiver and transmitter whereby one of the communication paths is … Read More → "New FlexRay Active Star IC from austriamicrosystems first to fully conform to the FlexRay Standard 2.1 Rev B"

HDL Design House appoints Acetronix its representative in Korea

Belgrade, Serbia, November 29th, 2010  HDL Design House announced the appointment of its Korean representative – Acetronix, based in Seoul, Korea. Acteronix will handle sales and promotion of HDL Design House analog and digital IP cores and design and verification services  in South Korea. 

Given the constant growth of the Korean semiconductor industry, HDL Design House views Acetronix as a strong partner with good understanding of the local market who will enable the … Read More → "HDL Design House appoints Acetronix its representative in Korea"

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