News – Page 1389 – EEJournal

PowerbyProxi Announces Availability of Wireless Power Evaluation Kits for Consumer Electronic Devices

August 13, 2014

PLEASANTON, Calif., August 12, 2014 – PowerbyProxi, developer of the world’s most advanced and safest wireless power solutions, today announced the release of Proxi-2D EVK-1, an evaluation kit for wireless charging of consumer electronic devices. The evaluation kit enables customers to test the capabilities of PowerbyProxi’s resonant technology features such as full spatial freedom, 7.5W power transfer per receiver (the highest power delivery available on the market) and multi-device charging up to 15W.

PowerbyProxi recently demonstrated this system at Computex in June, showing significant improvements over the 3.5 to 5 … Read More → "PowerbyProxi Announces Availability of Wireless Power Evaluation Kits for Consumer Electronic Devices"

TI introduces multiphase Vcore solutions with advanced PMBus™ interface and smart power stage

August 13, 2014

DALLAS (August 12, 2014) – Texas Instruments (TI) (NASDAQ: TXN) today introduced a complete multiphase core voltage (Vcore) power management system solution for enterprise servers, storage and high-end desktop applications. Compliant with Intel’s VR12.5 and VR12 voltage regulation specifications, the TPS53661, TPS53641 and TPS53631 DC/DC controllers and CSD95372B and CSD95373B NexFET smart power stages are a state-of-the-art, digital multiphase solution to power the latest Intel^® Xeon^® processors. The complete solution features industry-leading efficiency at up to 95-percent in the smallest footprint. For more information, samples and an evaluation module, visit Read More → "TI introduces multiphase Vcore solutions with advanced PMBus™ interface and smart power stage"

Florida Polytechnic University, Flagship Solutions Group and IBM Announce Supercomputing Center

August 13, 2014

ARMONK, NY and Lakeland, Fla. – August 13, 2014 – Florida Polytechnic University, Flagship Solutions Group, and IBM (NYSE: IBM) today announced a new supercomputing center at the University composed of IBM high performance systems, software and cloud-based storage, to help educate students in emerging technology fields.

Florida Polytechnic University is the newest addition to the State University System of Florida and the only one dedicated exclusively to science, technology, engineering and mathematics (STEM). Florida Polytechnic University will welcome its inaugural class of 500 students in August.

The center, which is being developed with the support of premier IBM Business … Read More → "Florida Polytechnic University, Flagship Solutions Group and IBM Announce Supercomputing Center"

CLIK-Mateä1.50mm Wire-to-Board Connector System from Molex Offers Widest Range of Mechanical and Electrical Options

August 13, 2014

LISLE, IL – August 13, 2014 – Molex Incorporated solves common design challenges faced by electronic engineers with its CLIK-Mateä1.50mm Wire-to-Board Connector System, which offers a variety of circuit sizes, mounting styles and wire gauges to meet next-generation power and signal needs. In addition to the original top-mount options, the CLIK-Mate 1.50mm family now … Read More → "CLIK-Mateä1.50mm Wire-to-Board Connector System from Molex Offers Widest Range of Mechanical and Electrical Options"

CUI Expands DIN Rail Dc-Dc Converter Line up to 600 W

August 12, 2014

TUALATIN, Ore. – August 12, 2014 – CUI Inc announced the expansion of their DIN rail dc-dc product line with the addition of over 90 new high wattage models ranging from 50~600 W. The VHK and VFK DIN families are high efficiency isolated dc-dc converters packaged in a rugged aluminum case that feature an ultra-wide 4:1 input. With efficiencies as high as 92% and an integrated aluminum heat sink, the units are able to operate at higher temperatures with a minimal amount of air flow. They have been designed for applications where the convenience … Read More → "CUI Expands DIN Rail Dc-Dc Converter Line up to 600 W"

Allegro MicroSystems, LLC Announces New High Accuracy Current Sensor ICs

August 12, 2014

Worcester, MA – August 2014 – Allegro MicroSystems, LLC announces two new current sensor IC devices that are true ±5 A sensor ICs or uni-directional 10 A sensor ICs for use in low power applications that require higher output swings at lower current. Allegro’s ACS722 and Read More → "Allegro MicroSystems, LLC Announces New High Accuracy Current Sensor ICs"

Micro Digital Announces Free SMX® Learning Kits

August 12, 2014

Costa Mesa, California, August 8, 2014 – Micro Digital is pleased to announce Free SMX Learning Kits, for non-commercial use, available at www.smxrtos.com/lk

< … Read More →

CommAgility’s rugged VPX module now shipping

August 12, 2014

CommAgility today announced that its VPX-D16A4 module is now shipping to early customers. The module has also now been tested across its full conduction cooled, -40C to +70C temperature range.

The VPX-D16A4 is a rugged high performance DSP and FPGA based card, and is CommAgility’s first board in the compact VITA™ 65, 3U OpenVPX™ form factor. The module is ideal for applications such as software defined radio (SDR) (including LTE, Remote Radio Head (RRH), WiMax and Cloud RAN), imaging or radar, and is well suited to military or other harsh field deployment environments. It … Read More → "CommAgility’s rugged VPX module now shipping"

Convert PWM Inputs to 12-Bit Accurate Voltage Outputs with No Software, No Ripple & No Delay

August 12, 2014

MILPITAS, CA – August 12, 2014 – Linear Technology Corporation introduces the LTC2645, a quad-channel 12-bit/10-bit/8-bit PWM-to-voltage output digital-to-analog converter (DAC) with 10ppm/°C reference. These … Read More → "Convert PWM Inputs to 12-Bit Accurate Voltage Outputs with No Software, No Ripple & No Delay"

Atmel Introduces Next Generation System-on-Chip Solution for Smart Metering

August 12, 2014

SAN JOSE, CALIF, Aug.12, 2014 — Atmel^®Corporation (NASDAQ: ATML), a global leader in microcontroller and touch technology solutions, today announced the introduction of its latest Power Line Communication System-on-Chip (SoC) solution designed for smart metering applications.

The Atmel SAM4CP16B is an extension of Atmel’s SAM4Cx smart energy platform built on a dual-core 32-bit ARM® Cortex®-M4 architecture. Fully compatible with Atmel’s ATPL230A OFDM physical layer (PHY) device compliant with PRIME standard specification, this highly flexible solution addresses OEM’s requirements for various system partitioning, BOM reduction and time-to-market requirements by … Read More → "Atmel Introduces Next Generation System-on-Chip Solution for Smart Metering"