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High Quality Test Lead Sets from Cliff Electronics now available from Major Electrical Wholesalers and Distributors

CLIFF Electronics has been manufacturing test leads for a number of market-leading electrical test equipment OEMs for many years and is now making a wide range of test leads available direct to end users via major electrical wholesalers nationwide.

In response to increasing numbers of enquiries for replacement test leads and enquiries for types of lead sets not available from other suppliers Cliff will be offering a very comprehensive range of standard test lead sets and are happy to provide custom solutions where required. More information is available at Read More → "High Quality Test Lead Sets from Cliff Electronics now available from Major Electrical Wholesalers and Distributors"

Dedicated Computing Delivers Leading-edge, High Performance, Power-Efficient Reference Designs

WAUKESHA, Wis., Aug. 7, 2014 /PRNewswire/ — Dedicated Computing announced the release of several new embedded computers based on 4th Generation Intel® Core™ Processors.   Dedicated Computing’s reference design for Intel processor-based technology provides a full range of products that are fully qualified to meet specific requirements of imaging, modeling, visualization and simulation applications. 

Examples of these solutions include the Edge Series™ 7342, a short depth 4U platform that is flexible enough to support high end graphics applications, high density storage use cases, or a wide variety of demanding I/O … Read More → "Dedicated Computing Delivers Leading-edge, High Performance, Power-Efficient Reference Designs"

Open-Silicon Establishes High-Speed SerDes Technology Center of Excellence

MILPITAS, CA–(Marketwired – August 07, 2014) – Open-Silicon today announced it has established a SerDes Technology Center of Excellence (TCoE) to ensure rapid, cost-effective design and production of ASICs integrating high-speed serial technologies. The SerDes TCoE will enable new ASIC products with capabilities such as PCI Express (PCIe Gen 1/2/3/4), SATA, Hybrid Memory Cube (HMC), Interlaken and networking up to 100G.

The TCoE provides access to unparalleled front-end and back-end design capabilities, IP integration, and packaging and test services – all intended to improve product time-to-market and quality. Open-Silicon applies its unique, high-speed serial design … Read More → "Open-Silicon Establishes High-Speed SerDes Technology Center of Excellence"

Microchip Introduces New PIC32 Bluetooth® Starter Kit

CHANDLER, Ariz., Aug. 6, 2014 [NASDAQ:  MCHP] — Microchip Technology Inc., a leading provider of microcontroller, mixed-signal, analog and Flash-IP solutions, today announced the new PIC32 Bluetooth® Starter Kit.  The full-featured kit boasts a PIC32 microcontroller (MCU), HCI-based Bluetooth radio, Cree high-output multi-color LED, 3 standard single-color LEDs, an analog 3-axis accelerometer, analog temperature sensor and 5 push buttons for user-defined inputs.  Additionally, a PICkit™ On Board (PKOB) which eliminates the need for an external debugger/programmer, USB connectivity and GPIOs for rapid development of Bluetooth Serial Port Profile (SPP), USB and general-purpose applications.   … Read More → "Microchip Introduces New PIC32 Bluetooth® Starter Kit"

MIPI Alliance Enhances its Battery Interface Specification with “Smart Battery” Capabilities for Mobile Devices

PISCATAWAY, NJ, August 6, 2014 – The MIPI®Alliance, an international organization that develops interface specifications for mobile and mobile-influenced industries, today announced updates to its Battery Interface Specification (BIF) for mobile devices. The new specification, MIPI BIF v1.1, makes it more practical and convenient for manufacturers to implement “smart” features in device batteries, facilitates the use of newhigh-performance batteries, and adds communications methods that improve battery safety and overall performance.

“The battery is a critical component in a mobile device and its deployment … Read More → "MIPI Alliance Enhances its Battery Interface Specification with “Smart Battery” Capabilities for Mobile Devices"

ADLINK Releases SMARC Module LEC-BT Running Intel® Atom™ Processor E3800 Series System-on-Chip

ADLINK Technology Inc. today introduces a new SMARC form factor computer-on-module running on Intel x86 processors. Using a single, dual, or quad core Intel® Atom™ processor E3800 series system-on-chip from 1.3 to 2.2 GHz with soldered memory up to 4GB DDR3L at 1066/1333 MHz including ECC, the ADLINK LEC-BT product delivers top-of-the-line performance in efficient power use that targets a new generation of mobile applications with industrial-grade stability and reliability

< … Read More → "ADLINK Releases SMARC Module LEC-BT Running Intel® Atom™ Processor E3800 Series System-on-Chip"

Microsemi Continues its FPGA Security Leadership for Secure Boot with Extension of Cryptography Research Differential Power Analysis Patent License

ALISO VIEJO, Calif.—Aug. 5, 2014—Microsemi Corporation (Nasdaq: MSCC), a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, today announced the company has obtained an extension of its existing Differential Power Analysis (DPA) patent license from the Cryptography Research division of Rambus. The patent license extension allows Microsemi to continue providing industry-leading solutions for the secure booting of third-party processors and FPGAs using the Cryptography Research portfolio of patented breakthrough DPA countermeasures.

Microsemi is the only major FPGA company that currently has a license to use the patented DPA countermeasures, and … Read More → "Microsemi Continues its FPGA Security Leadership for Secure Boot with Extension of Cryptography Research Differential Power Analysis Patent License"

World’s Most Highly-Integrated Octal Ultrasound Pulser from STMicroelectronics Simplifies Design for Ultrasound Equipment

Geneva, August 6, 2014 – The cost and size of ultrasound imaging machines can be reduced with the new STHV800 8-channel ultrasound pulser from STMicroelectronics. The proprietary SOI-BCD6[1] process technology enables the combination of low-voltage CMOS logic, precise analog circuitry, and robust power stages on the same chip, offering unprecedented level of integration. The monolithic, high-voltage, high-speed pulse generator with eight independent channels integrates … Read More → "World’s Most Highly-Integrated Octal Ultrasound Pulser from STMicroelectronics Simplifies Design for Ultrasound Equipment"

Zuken Opens Global Automotive and Transportation Competence Center in Erlangen, Germany

5 August 2014 – Yokohama, Japan; Munich, Germany and Westford, MA, USA  Zuken, a global leader in electrical and electronic design automation software, announces plans to extend its global competencies in transportation and to provide electronic architecture and wiring harness tools to meet the future challenges of OEMs and their suppliers.

This expansion will be underpinned by a new technology competence center for transportation in Erlangen, a well-known research and electronics hotspot in Germany. Located within the fertile technology environment of the IGZ Innovation and Incubation … Read More → "Zuken Opens Global Automotive and Transportation Competence Center in Erlangen, Germany"

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