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Texas Instruments expands world’s lowest power microcontroller portfolio to take your metering, health and fitness and wearables designs to the next level

DALLAS (August 28, 2014) – Enabling developers to reduce power consumption, bill of materials and product size, Texas Instruments (TI) (NASDAQ: TXN) today released 46 new ultra-low-power MSP430™ FRAM microcontrollers (MCUs) with more memory, features and integration. TI’s MSP430FR69x MCUs are scalable up to 128 KB non-volatile FRAM memory and include smart analog integration, such as an extended scan interface (ESI) and a differential input analog-to-digital converter (ADC) that consumes as little as 140 µA at 200 KSPS. Developers … Read More → "Texas Instruments expands world’s lowest power microcontroller portfolio to take your metering, health and fitness and wearables designs to the next level"

KLA-Tencor Introduces Key Systems for 5D™ Patterning Control Solution

MILPITAS, Calif., August 26, 2014—Today, KLA-Tencor Corporation (NASDAQ: KLAC) introduced the WaferSight™ PWG patterned wafer geometry measurement system, the LMS IPRO6 reticle pattern placement metrology system and the K-T Analyzer® 9.0 advanced data analysis system. These three new products support KLA-Tencor’s unique 5D™ patterning control solution, which addresses five elements of patterning process control—the three geometrical dimensions of device structures, time-to-results and overall equipment efficiency. The 5D patterning control solution is being developed to drive optimal patterning results through the characterization, optimization and monitoring of processes inside and … Read More → "KLA-Tencor Introduces Key Systems for 5D™ Patterning Control Solution"

Renesas Electronics Introduces an IEC 61508 TÜV-Certified RX631, 63N Safety Package to Accelerate Implementation of Safety Systems for Industrial Equipment

Santa Clara, Calif., August 26, 2014 – Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, today announced that it has obtained IEC 61508 (Functional Safety) certification for the RX631, RX63N Safety Package, featuring a robust self-diagnostic software and a safety manual for microcontrollers (MCUs) necessary to implement functional safety in industrial equipment. An RX631, RX63N Safety Solution Evaluation Kit will be available in September 2014, providing a hardware evaluation board with the RX63N MCU, the evaluation version of the self-diagnostic … Read More → "Renesas Electronics Introduces an IEC 61508 TÜV-Certified RX631, 63N Safety Package to Accelerate Implementation of Safety Systems for Industrial Equipment"

TI brings 16-bit ADC precision performance to industrial control applications with new single-core C2000™ Delfino™ F2837xS microcontrollers

Houston (Aug. 26, 2014) – Introducing the powerful, single-core series for industrial real-time control design, Texas Instruments (TI) (NASDAQ: TXN) today launches the new C2000™ Delfino™ 32-bit F2837xS microcontrollers (MCUs). These single-core MCUs are the first in the industry to offer four 16-bit analog-to-digital converters (ADCs), enabling precision feedback in power control applications. They are pin- and software-compatible with the recently introduced dual-core C2000 Delfino F2837xD MCUs and help expedite development when scaling from … Read More → "TI brings 16-bit ADC precision performance to industrial control applications with new single-core C2000™ Delfino™ F2837xS microcontrollers"

Full Compliance with Military Temperature Specification Planned for Altera 20nm FPGA and SoC Devices

San Jose, Calif., – August 26, 2014 – Altera Corporation (NASDAQ: ALTR) today announced military temperature (Mil Temp) qualification plans for its newest 20 nm Arria® 10 FPGAs and SoCs, which will be qualified for extreme temperature environments (-55C to 125C ambient). In addition to the ratings, Altera can provide guidelines on speed grades, protocols, and external memory interfaces best suited to specific applications. All devices will be characterized, qualified and tested by Altera, providing reduced and reliable lead times. Customers can receive notifications, access ratings, and the Military Temperature brochure by setting up an account through the myAltera Military Portal.

< … Read More → "Full Compliance with Military Temperature Specification Planned for Altera 20nm FPGA and SoC Devices"

TI introduces first fully integrated mono, Class-D audio amplifier for eCall, instrument cluster and telematics

DALLAS (Aug. 25, 2014) – Texas Instruments (TI) (NASDAQ: TXN) today introduced the industry’s first automotive Class-D audio amplifier to integrate load-dump protection and diagnostics in a single device for emergency call (eCall) and instrument cluster systems. Designers can eliminate multiple discrete components, simplify automotive-grade diagnostic design and extend battery back-up power with the mono-channel, analog differential input TAS5421-Q1. For more information and to order samples, visit www.ti.com/tas5421q1-pr.

Demand for eCall systems in cars is increasing. In case of a crash, … Read More → "TI introduces first fully integrated mono, Class-D audio amplifier for eCall, instrument cluster and telematics"

Synopsys Announces Results of Robert S. Hilbert Memorial Optical Design Competition

MOUNTAIN VIEW, Calif., Aug. 25, 2014 /PRNewswire/ — Synopsys, Inc., a global leader providing software, IP and services used to accelerate innovation in chips and electronic systems, today announced that four students, Xinda Hu of the University of Arizona, and Anthony Vella, Aaron Bauer, and Nicolas Brown, all of the University of Rochester, are the winners of the 2014 Robert S. Hilbert Memorial Optical Design Competition. The competition was established in 2000 by Optical Research Associates (ORA®), now Synopsys’ Optical Solutions Group, and was named in honor of ORA’s former president and chief executive officer, Robert S. Hilbert. The annual competition is open … Read More → "Synopsys Announces Results of Robert S. Hilbert Memorial Optical Design Competition"

Microchip’s New 2.4 GHz RF High-Power Amplifier Offers Low EVM and Current for 256-QAM and 802.11b/g/n; Extends Range of Ultra-High Data Rate WLANs

CHANDLER, Ariz., Aug. 25, 2014 [NASDAQ:  MCHP] — Microchip Technology Inc., a leading provider of microcontroller, mixed-signal, analog and Flash-IP solutions, today announced its latest 2.4 GHz 256-QAM RF high-power amplifier—the SST12CP21—which offers ultra low EVM and current consumption for 256-QAM and IEEE 802.11n systems.  The SST12CP21 delivers high linear output power of up to 23 dBm at 1.75% dynamic EVM, with MCS9 HT40 MHz bandwidth modulation at 5V and 320 mA current consumption.  Additionally, the SST12CP21 … Read More → "Microchip’s New 2.4 GHz RF High-Power Amplifier Offers Low EVM and Current for 256-QAM and 802.11b/g/n; Extends Range of Ultra-High Data Rate WLANs"

Dongbu HiTek Streamlines Touch Control for Smart Phones

SEOUL, KOREA – August 26, 2014 – Dongbu HiTek today announced it has completed the development of an innovative Capacitive Touch Controller IC for smart phones. The proprietary chip design enables apps to be accessed and controlled via simple touch gestures while the smart phone is in the standby (screen-off) mode, thus streamlining apps access, control and extending battery life.

Current smart phones in the standby mode typically require the user to unlock the phone (activating the screen), navigate to the desired apps icon and then touching the icon to access the app. Next generation smart phones incorporating … Read More → "Dongbu HiTek Streamlines Touch Control for Smart Phones"

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