News – Page 1258 – EEJournal

STMicroelectronics Launches Voice-Over-Bluetooth Low Energy for Wearable and Remote-Control Applications

June 10, 2015

Geneva, June 10, 2015 – Voice control that can make wearable technology simpler and more battery-friendly just became easier to add with software-based innovations from STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications.

The wearables sector is taking off, with the arrival of sophisticated new products such as smart watches. Research firm IHS predicts^{^[1]} the market will reach 135 million units by 2019 and sees designs becoming smarter and more sensor-rich to support advanced functions. Ease of … Read More → "STMicroelectronics Launches Voice-Over-Bluetooth Low Energy for Wearable and Remote-Control Applications"

LeddarTech introduces LeddarCore sensor ICs for high-volume applications

June 10, 2015

QUEBEC CITY, CANADA, June 10, 2015 – LeddarTech today announced the upcoming launch of LeddarCore™, a new line of sensor ICs designed to offer unmatched integration capabilities for the development and production of high-volume applications.

LeddarCore is intended to give integrators and OEMs the flexibility to develop fully optimized sensor solutions or systems perfectly adapted to their specific applications. Combining … Read More → "LeddarTech introduces LeddarCore sensor ICs for high-volume applications"

Precision Set & Readback PMBus-Compatible, Dual 9A or Single 18A µModule Regulator

June 10, 2015

MILPITAS, CA – June 10, 2015 – Linear Technology Corporation announces the LTM4675, dual 9A or single 18A, µModule^® (micromodule) step-down DC/DC regulator with PMBus serial digital … Read More → "Precision Set & Readback PMBus-Compatible, Dual 9A or Single 18A µModule Regulator"

High-Side Current/Power Sensor From Microchip is World’s First to Feature Both a Configurable Analog Output and a 2-Wire Digital Bus

June 9, 2015

CHANDLER, Ariz., June 9, 2015 [NASDAQ: MCHP] — Microchip Technology Inc., a leading provider of microcontroller, mixed-signal, analog and Flash-IP solutions, today announced from the Sensors Expo a combined analog and digital current sensor—the PAC1921. This new device is the world’s first high-side current sensor with both a digital output, as well as a configurable analog output that can present power, current or voltage over the single output pin. Simultaneously, all power related output values are also available over … Read More → "High-Side Current/Power Sensor From Microchip is World’s First to Feature Both a Configurable Analog Output and a 2-Wire Digital Bus"

Tektronix Adds Advanced Analysis, Characterization Support for HDMI Receiver Testing

June 9, 2015

BEAVERTON, Ore., June 9, 2015 – Tektronix, Inc., the world’s leading manufacturer of oscilloscopes, today announced that it has expanded its portfolio of HDMI test solution with the addition of advanced analysis and characterization support for HDMI 2.0 receiver testing. The new HDMXpress provides complete support for HDMI test pattern generation, auto-calibration and margin testing, eliminating the needs for manual pattern creation.

HDMI (High-Definition Multimedia Interface) has emerged as the de-facto industry standard for transferring video data to display … Read More → "Tektronix Adds Advanced Analysis, Characterization Support for HDMI Receiver Testing"

Cadence Announces Collaboration with TSMC on IoT IP Subsystem

June 9, 2015

SAN JOSE, Calif., 08 Jun 2015 — Cadence Design Systems, Inc. (NASDAQ: CDNS), today announced that it is collaborating with TSMC on the development of an Internet of Things (IoT) intellectual property (IP) subsystem demonstration platform for TSMC’s ultra-low power (ULP) process. Targeting wearable, home automation, always-on and industrial control applications, this IP subsystem, with the support of the Cadence® suite of digital and custom/analog tools, provides the opportunity to simplify IoT designs and accelerate the time to market for mutual customers.

Initially targeting the TSMC 55ULP process, the flexible Cadence … Read More → "Cadence Announces Collaboration with TSMC on IoT IP Subsystem"

Keysight Technologies to Demonstrate Latest RF Circuit, System and 3D Electromagnetic Design and Simulation, Device Modeling Solutions at 52nd Annual DAC

June 9, 2015

SANTA ROSA, Calif., June 8, 2015 – Keysight Technologies, Inc. (NYSE: KEYS) today announced it will demonstrate its latest electronic design automation software for microwave, RF, high-frequency, high-speed digital, RF system, electronic system level, circuit, 3-D electromagnetic, physical design and device-modeling applications at the Design Automation Conference (DAC) 2015, Booth 2020, San Francisco, June 8-10.

Keysight EEsof EDA technical experts and application engineers will be available to discuss and demonstrate:

New capabilities and productivity improvements … Read More → "Keysight Technologies to Demonstrate Latest RF Circuit, System and 3D Electromagnetic Design and Simulation, Device Modeling Solutions at 52nd Annual DAC"

Xilinx Joins Global Leaders at the 2015 OpenPOWER Foundation China Summit to Accelerate Next Generation Data Center Innovation

June 9, 2015

Jun 7, 2015 — BEIJING, June 7, 2015 /PRNewswire/ — Xilinx, Inc. (NASDAQ: XLNX) today announced it will join global leaders at the 2015 OpenPOWER™ Foundation China Summit to accelerate collaborative innovation on IBM POWER technology. As a member of the OpenPOWER Foundation, Xilinx is delivering FPGA-based acceleration technologies for high performance CAPI-enabled solutions for Power Systems which accelerate applications like big data, Hadoop, machine learning, bioinformatics, networking and storage in the Cloud. At this event, Xilinx will be among a distinguished group of industry users … Read More → "Xilinx Joins Global Leaders at the 2015 OpenPOWER Foundation China Summit to Accelerate Next Generation Data Center Innovation"

Synopsys Continues Innovation Momentum with Latest IC Compiler II Release

June 9, 2015

MOUNTAIN VIEW, Calif., June 9, 2015 /PRNewswire/ —

Highlights:

With 30 active customers since launch already benefiting from the power of 10X, latest release promises to further accelerate broad expansion
Introduces industry’s only multi-level design planning capability for faster design closure
Delivers up to 5 percent smaller area and 10 percent lower total power with advanced total power optimization and context-aware clock tree synthesis techniques
Driven by dramatic productivity advances experienced, Samsung actively deploying IC Compiler II for physical … Read More → "Synopsys Continues Innovation Momentum with Latest IC Compiler II Release"

Hoffmann-Krippner Unveils Sensor Solutions for the Internet of Things and M2M

June 9, 2015

June 9, 2015 – Alpharetta, GA — At Sensors Expo, Hoffmann – Krippner Inc. (http://www.hoffmann-krippner.com/potentiometers-sensofoil.html) will demonstrate how their unique SensoInk and SensoFoil intelligent sensing technologies can be used for Internet of Things applications such as process automation, position tracking and real time supply chain support.

SensoInk is an innovative, reliable and highly accurate sensing solution based on printed polymer pastes. SensoInk is a 5V analog solution with low power requirements and operates at 5V.

By using polymer thick film technology, SensoInk is extremely … Read More → "Hoffmann-Krippner Unveils Sensor Solutions for the Internet of Things and M2M"

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