industry news
Subscribe Now

OMNIVISION Debuts OAX4600 AI-Enabled ASIC at AutoSens―Industry’s Most Robust Integrated ISP and NPU for Simultaneous DMS/OMS

OAX4600 delivers seamless DMS/OMS functionality and automotive design flexibility with integrated RGB-IR ISPs and two NPUs in a small package size with low power consumption

SANTA CLARA, Calif. – May 4, 2022 – OMNIVISION, a leading global developer of semiconductor solutions, including advanced digital imaging, analog and touch & display technology, announced today the automotive industry’s most advanced AI-enabled application-specific integrated circuit (ASIC) that can seamlessly and simultaneously power dedicated driver and occupant monitoring systems (DMS/OMS). It uses a stacked-die architecture to provide integrated RGB-IR image signal processing (ISP) with two AI neural processing units (NPUs) and embedded DDR3 memory (2Gb) in a single low power, small package chip.

“Driver monitoring solutions that are high performance and low power, with a small package size, are attractive to OEMs looking to comply to regional safety regulations. The flexibility to add additional features and expand into cabin monitoring is a bonus,” says Mark Fitzgerald, director, Autonomous Vehicle Research, Strategy Analytics.

The OAX4600 is a next generation ASIC that uses OMNIVISION’s dedicated NPU with 2 tera operations per second (TOPS). Seeing Machine’s Occula™ NPU is also included for greater application flexibility. The OAX4600 features 2Gb of embedded DDR stacked memory and utilizes the tri-ARM® Cortex® A53 with NEON™ core subsystem.

“Our OAX4600 is set to transform the automotive industry. It integrates a unique set of features developed specifically for interior monitoring systems (IMS), and its small size and low power provide OEMs with the flexibility to place the camera at any location within the car, regardless of space constraints,” said Brian Pluckebaum, automotive product marketing manager at OMNIVISION. “It uses OMNIVISION’s ISP processing technology and dedicated NPU to ensure robust, latency-free image processing, even in the case of RGB-IR. We have also designed this device from the ground up with ASIL B functional safety in mind.”

The OAX4600 is capable of higher resolution processing of up to 5 megapixels. It has fast boot-up time to eliminate any delay between ignition and activation of the interior camera and features integrated cybersecurity.

The OAX4600 comes in a BGA package and will be available for sampling in Q3 2022. For more information, contact your OMNIVISION sales representative: www.ovt.com/contact-sales. Or meet with OMNIVISION at AutoSens Detroit, May 10-12, 2022, schedule a meeting: auto.marketing@ovt.com.

About OMNIVISION

OMNIVISION is a global fabless semiconductor organization that develops advanced digital imaging, analog and touch & display solutions for multiple applications and industries, including mobile phones; security and surveillance; automotive; computing; medical; and emerging applications. Its award-winning innovative technologies enable a smoother human/machine interface in many of today’s commercial devices. Find out more at www.ovt.com.

Leave a Reply

featured blogs
Apr 24, 2024
Diversity, equity, and inclusion (DEI) are not just words but values that are exemplified through our culture at Cadence. In the DEI@Cadence blog series, you'll find a community where employees share their perspectives and experiences. By providing a glimpse of their personal...
Apr 23, 2024
We explore Aerospace and Government (A&G) chip design and explain how Silicon Lifecycle Management (SLM) ensures semiconductor reliability for A&G applications.The post SLM Solutions for Mission-Critical Aerospace and Government Chip Designs appeared first on Chip ...
Apr 18, 2024
Are you ready for a revolution in robotic technology (as opposed to a robotic revolution, of course)?...

featured video

How MediaTek Optimizes SI Design with Cadence Optimality Explorer and Clarity 3D Solver

Sponsored by Cadence Design Systems

In the era of 5G/6G communication, signal integrity (SI) design considerations are important in high-speed interface design. MediaTek’s design process usually relies on human intuition, but with Cadence’s Optimality Intelligent System Explorer and Clarity 3D Solver, they’ve increased design productivity by 75X. The Optimality Explorer’s AI technology not only improves productivity, but also provides helpful insights and answers.

Learn how MediaTek uses Cadence tools in SI design

featured paper

Designing Robust 5G Power Amplifiers for the Real World

Sponsored by Keysight

Simulating 5G power amplifier (PA) designs at the component and system levels with authentic modulation and high-fidelity behavioral models increases predictability, lowers risk, and shrinks schedules. Simulation software enables multi-technology layout and multi-domain analysis, evaluating the impacts of 5G PA design choices while delivering accurate results in a single virtual workspace. This application note delves into how authentic modulation enhances predictability and performance in 5G millimeter-wave systems.

Download now to revolutionize your design process.

featured chalk talk

Accessing AWS IoT Services Securely over LTE-M
Developing a connected IoT design from scratch can be a complicated endeavor. In this episode of Chalk Talk, Amelia Dalton, Harald Kröll from u-blox, Lucio Di Jasio from AWS, and Rob Reynolds from SparkFun Electronics examine the details of the AWS IoT ExpressLink SARA-R5 starter kit. They explore the common IoT development design challenges that AWS IoT ExpressLink SARA-R5 starter kit is looking to solve and how you can get started using this kit in your next connected IoT design.
Oct 26, 2023
23,507 views