industry news
Subscribe Now

Nexperia introduces the first application-specific MOSFETs (ASFETs) for hotswap in SMD copper-clip LFPAK88 packaging for 60% reduced footprint

Additional 40% lower RDS(on) and increase power density by 58x for telecom & computing hot-swap computing applications

Nijmegen, March 22, 2023: Nexperia, the expert in essential semiconductors, today announced the release of its first 80 V and 100 V application-specific MOSFETs (ASFETs) for hotswap with enhanced safe operating area (SOA) in a compact 8×8 mm LFPAK88 package. These new ASFETs are fully optimized for demanding hotswap and soft-start applications and are qualified to 175°C for use in advanced telecom and computing equipment.

By applying decades of expertise in both advanced silicon and package development, Nexperia’s PSMN2R3-100SSE (100 V, 2.3 mΩ N-channel ASFET) is the leading addition in the portfolio, delivering low RDS(on) and strong linear-mode (safe operating area) performance in a compact 8×8 mm footprint, tailored to meet the requirements of demanding hotswap applications. Nexperia has also released PSMN1R9-80SSE (80 V, 1.9 mΩ), an 80 V ASFET which responds to the growing trend for using 48 V power rails in computing servers and other industrial applications where environmental conditions allow for MOSFETs with a lower BVDS rating.

ASFETs with enhanced SOA are becoming increasingly popular within hotswap and soft start applications. Their strong linear mode performance is essential to manage in-rush current effectively and reliably when capacitive loads are introduced to the live backplane. Low RDS(on) is also important to minimize I2R losses when the ASFET is fully turned on. Despite the lower RDS(on) and compact package size, Nexperia’s third generation of enhanced SOA technology also achieves 10% SOA improvement compared to previous generations in D2PAK packages (33 A vs 30 A @ 50 V @ 1 ms).

Another innovation from Nexperia is that the new ASFETs for hotswap have fully characterized SOA at both 25 °C and 125 °C. Fully tested, hot SOA curves are provided within the datasheets, removing the need for design engineers to perform thermal de-rating calculations, and significantly extending the useful hot SOA performance.

Until now, ASFETs for hotswap and computing applications were limited to much bigger D2PAK packages (16×10 mm). LFPAK88 packages are the ideal replacement for D2PAK, providing up to 60% space efficiency. The PSMN2R3-100SSE has an RDS(on) of only 2.3 mΩ, representing at least a 40% reduction on currently available devices. This results not only in industry leading power density improvements of 58x, LFPAK88 also offers two times higher ID (max) current rating, ultra-low thermal and electrical resistance. This release combines the best features of Nexperia’s advanced silicon and copper clip packaging technologies, including a smaller footprint, lower RDS(on) and improved SOA performance. Nexperia also offers a range of 25 V, 30 V, 80 V & 100 V ASFETs in a 5×6 mm LFPAK56E package, optimized for lower power applications where smaller PCB footprint is needed.

For more details about these new ASFETs, visit: nexperia/com/asfets-for-hotswap-and-soft-start

About Nexperia

Nexperia is a leading expert in the high-volume production of essential semiconductors, components that are required by every electronic design in the world. The company’s extensive portfolio includes diodes, bipolar transistors, ESD protection devices, MOSFETs, GaN FETs and analog & logic ICs. Headquartered in Nijmegen, the Netherlands, Nexperia annually ships more than 100 billion products, meeting the stringent standards set by the automotive industry. These products are recognized as benchmarks in efficiency – in process, size, power and performance — with industry-leading small packages that save valuable energy and space.

Leave a Reply

featured blogs
Jun 2, 2023
Diversity, equity, and inclusion (DEI) are not just words but values that are exemplified through our culture at Cadence. In the DEI@Cadence blog series, you'll find a community where employees share their perspectives and experiences. By providing a glimpse of their personal...
Jun 2, 2023
I just heard something that really gave me pause for thought -- the fact that everyone experiences two forms of death (given a choice, I'd rather not experience even one)....
Jun 2, 2023
Explore the importance of big data analytics in the semiconductor manufacturing process, as chip designers pull insights from throughout the silicon lifecycle. The post Demanding Chip Complexity and Manufacturing Requirements Call for Data Analytics appeared first on New Hor...

featured video

The Role of Artificial Intelligence and Machine Learning in Electronic Design

Sponsored by Cadence Design Systems

In this video, we talk to Paul Cunningham, Senior VP and GM at Cadence, about the transformative role of artificial intelligence and machine learning (AI/ML) in electronic designs. We discuss the transformative period we are experiencing with AI and ML and how Cadence is revolutionizing how we design and verify chips through “computationalizing intuition” and building intuitive systems that learn and adapt to the world around them. With human lives at stake, reliability, and safety are paramount.

Learn More

featured paper

EC Solver Tech Brief

Sponsored by Cadence Design Systems

The Cadence® Celsius™ EC Solver supports electronics system designers in managing the most challenging thermal/electronic cooling problems quickly and accurately. By utilizing a powerful computational engine and meshing technology, designers can model and analyze the fluid flow and heat transfer of even the most complex electronic system and ensure the electronic cooling system is reliable.

Click to read more

featured chalk talk

EiceDRIVER™ F3 Enhanced: Isolated Gate Driver with DESAT
Sponsored by Mouser Electronics and Infineon
When it comes to higher power applications, galvanically isolated gate drivers can be great solution for power modules and silicon carbide MOSFETS. In this episode of Chalk Talk, Amelia Dalton and Emanuel Eni from Infineon examine Infineon’s EiceDRIVER™ F3 Enhanced isolated gate driver family. They take a closer look at advantages of galvanic isolation and the key features and benefits that this gate driver family can bring to your next design.
Sep 12, 2022
30,308 views