industry news
Subscribe Now

New 1-slot 3U OpenVPX Backplanes From Pixus in MultiGig™ RT3 Version

Waterloo, Ontario  —  Sept 26, 2024 –  Pixus Technologies, a provider of embedded computing and enclosure solutions, has announced new 3U OpenVPX backplanes in a 1-slot size in various formats.   This includes versions that are VPX only, and designs with VITA 67.3c, VITA 67.3d, and VITA 66.4 cutouts for RF and optical connector inserts.

The suite of 1-slot power and ground only 3U OpenVPX backplanes from Pixus had been expanded to include MultiGig RT3 compatible versions.  The higher speed RT3 supports 25Gbaud/s signal allowing 100GbE cards to be utilized.  Additionally, there are options for Meritec® rear shrouds and cables to be installed.   Pixus will still continue to offer the lower cost MultiGig RT2 versions of these backplanes.

Pixus offers OpenVPX and SOSA aligned backplane/chassis systems in commercial, development, and MIL rugged formats.  The company also provides IEEE and Eurocard components for the embedded computer market.

 About Pixus Technologies

Leveraging over 20 years of innovative standard products, the Pixus team is comprised of industry experts in electronics packaging. Founded in 2009 by senior management from Kaparel Corporation, a Rittal company, Pixus Technologies’ embedded backplanes and systems are focused primarily on  ATCA, OpenVPX, MicroTCA, and custom designs.    Pixus also has an extensive offering of VME-based and cPCI-based solutions.   In May 2011, Pixus Technologies became the sole authorized North and South American supplier of the electronic packaging products previously offered by Kaparel Corporation and Rittal.

Leave a Reply

featured blogs
Oct 3, 2024
Someone with too much time on his hands managed to get Linux to boot on an Intel 4004 in only 4.76 days...

featured paper

A game-changer for IP designers: design-stage verification

Sponsored by Siemens Digital Industries Software

In this new technical paper, you’ll gain valuable insights into how, by moving physical verification earlier in the IP design flow, you can locate and correct design errors sooner, reducing costs and getting complex designs to market faster. Dive into the challenges of hard, soft and custom IP creation, and learn how to run targeted, real-time or on-demand physical verification with precision, earlier in the layout process.

Read more

featured chalk talk

Unlock the Productivity and Efficiency of a Connected Plant
In this episode of Chalk Talk, Amelia Dalton and Patrick Casey from Schneider Electric explore the multitude of benefits that mobility brings to industrial applications. They investigate how Schneider Electric’s Harmony Hub can simplify monitoring and testing, increase operational efficiency and connectivity openness in industrial plants, and how NFC technology can bring new innovation possibilities to IIoT applications.
Apr 23, 2024
30,740 views