LISLE, IL and NEW ALBANY, IN – May 10, 2018 – Two global leaders in the design and manufacture of interconnects for high-performance electronic products today announced a Licensed Source Agreement which brings together innovations that provide a new generation of solutions to meet the evolving needs of 56G and 112G data speeds.
Molex and Samtec are the only suppliers licensed to offer the Molex BiPass™ and Samtec Twinax Flyover™ Systems to meet the needs of the growing number of high-speed applications required as data centers evolve with hyperscale models and increased virtualization. The scope of the Licensed Source Agreement includes next generation high speed cable, cable assemblies and connectors and is intended to offer customers two sources for a complete optimized channel that will allow for a broader base of twinax technology both inside and outside of the box.
As bandwidth requirements rapidly increase, routing signals through lossy PCBs, vias and other components has become one of the most complex challenges designers face. The Molex and Samtec collaboration aims to bring an electrical and mechanical solution with advanced features for improved signal integrity, longer reach, EMI containment and thermal efficiencies.
“Molex is excited to be collaborating with Samtec on this industry challenge,” said Brian Hauge, vice president and general manager of the copper solutions business unit, Molex. “Molex and Samtec have a rich history of delivering unique connectivity solutions to the market. Through this collaboration, we expect these core technology building blocks will enable the industry with a viable platform supporting 112Gbps+ channels.”
“The constant demand for faster data rates in data center equipment, HPC and other applications require the most advanced technologies. The agreement provides the means for Samtec and Molex to offer architecture flexibility and future innovations across the industry,” said Brian Vicich, vice president of engineering, Samtec.
For more information on Samtec Twinax Flyover Systems, please visit www.samtec.com/flyover. For more information on the Molex BiPass system, please visit www.molex.com/bipassassemblies.
About Samtec, Inc.
Founded in 1976, Samtec is a privately held, $713MM global manufacturer of a broad line of electronic interconnect solutions, including High-Speed Board-to-Board, High-Speed Cables, Mid-Board and Panel Optics, Microelectronics, Flexible Stacking, and Micro/Rugged components and cables. With 33 locations in 18 different countries, Samtec’s global presence enables its unmatched customer service. For more information, please visit http://www.samtec.com.
About Molex:
Molex brings together innovation and technology to deliver electronic solutions to customers worldwide. With a presence in more than 40 countries, Molex offers a full suite of solutions and services for many markets, including data communications, consumer electronics, industrial, automotive, commercial vehicle and medical. For more information, please visit www.molex.com.
Molex is a registered trademark of Molex, LLC in the United States of America and may be registered in other jurisdictions.
