Low-Power 1.8V, 2.5Gbps, 4 Data Lane ReDriver from Diodes Incorporated Supports MIPI D-PHY Protocols

Plano, Texas – September 27, 2022 – Diodes Incorporated (Diodes) (Nasdaq: DIOD) today announced the latest addition to its broad portfolio of ReDrivers™ with the release of a 1.8V low-power, 4 data lanes 2.5Gbps ReDriver. The DIODES™ PI2MEQX2505 is the first ReDriver in the industry to support the MIPI D-PHY 1.2 protocol and is targeted at mobile and IoT applications.

The PI2MEQX2505 consumes 135mW in active mode, 5mW in low-power mode, 2mW in ultra-low power mode, and only 0.2mW in standby mode. This low-power consumption helps to extend the battery life of portable devices that include MIPI cameras, such as laptops and personal computers.

This ReDriver has four differential channels providing programmable receiver equalization, output swing, and pre-emphasis. These features enable longer PCB trace lengths while reducing signal latency and minimizing cost and power.

The PI2MEQX2505 is supplied in a tiny TQFN-28L (ZH) package, measuring only 3.5mm x 5.5mm, to enable high-density channel routing. It is available at $0.70 in 3500 piece quantities.

###

About Diodes Incorporated
Diodes Incorporated (Nasdaq: DIOD), a Standard and Poor’s SmallCap 600 and Russell 3000 Index company, delivers high-quality semiconductor products to the world’s leading companies in the consumer electronics, computing, communications, industrial, and automotive markets. We leverage our expanded product portfolio of discrete, analog, and mixed-signal products and leading-edge packaging technology to meet customers’ needs. Our broad range of application-specific solutions and solutions-focused sales, coupled with worldwide operations of 32 sites, including engineering, testing, manufacturing, and customer service, enables us to be a premier provider for high-volume, high-growth markets. For more information visit www.diodes.com.

Chiplet Architecture Accelerates Delivery of Industry-Leading Intel® FPGA Features and Capabilities

Intel's Chiplet Leadership Delivers Industry-Leading Capabilities at an Accelerated Pace

Sponsored by Intel

We're proud of our long history of rapid innovation in #FPGA development. With the help of Intel's Embedded Multi-Die Interconnect Bridge (EMIB), we’ve been able to advance our FPGAs at breakneck speed. In this blog, Intel’s Deepali Trehan charts the incredible history of our chiplet technology advancement from 2011 to today, and the many advantages of Intel's programmable logic devices, including the flexibility to combine a variety of IP from different process nodes and foundries, quicker time-to-market for new technologies and the ability to build higher-capacity semiconductors

To learn more about chiplet architecture in Intel FPGA devices visit: https://intel.ly/47JKL5h

featured chalk talk

NXP GoldVIP: Integration Platform for Intelligent Connected Vehicles

Sponsored by Mouser Electronics and NXP Semiconductors

Today’s intelligent connected vehicle designs are smarter and safer than ever before and this has a lot to do with a rapidly increasing technological convergence of sensors, machine learning, over the air updates, in-vehicle high bandwidth networking and more. In this episode of Chalk Talk, Amelia Dalton chats with Brian Carlson from NXP about NXP’s new GoldVIP Platform. They examine the benefits that this kind of software integration platform can bring to automotive designs and how you can take a test drive of the GoldVIP for yourself.

Click here for more information about NXP Semiconductors GoldBox for Vehicle Networking (S32G-VNP-GLDBOX)

Nov 29, 2022

36,183 views

Low-Power 1.8V, 2.5Gbps, 4 Data Lane ReDriver from Diodes Incorporated Supports MIPI D-PHY Protocols

Related