industry news
Subscribe Now

Infineon launches second-generation of high-reliability non-volatile SRAM

Munich, Germany – 23 March 2021 – Infineon Technologies LLC, an Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) company, today announced the availability of its second-generation non-volatile Static RAMs (nvSRAM). The new generation of devices are qualified for QML-Q and high-reliability industrial specifications to support demanding non-volatile code storage and data-logging applications in harsh environments, including aerospace and industrial applications.

The 256 kb STK14C88C and 1 Mb STK14CA8C nvSRAMs are qualified in 32 pin 300 mil dual in-line ceramic packages for MIL-PRF-38535 QML-Q specifications (-55°C to 125°C) and for Infineon’s industrial standards (-40°C to 85°C). Both 5 V and 3 V versions support boot code, data logging and calibration data storage for aerospace, communications and navigation systems, in addition to industrial furnaces and railroad control systems. Infineon also offers wafer sales to support systems in a package solutions.

“The new generation of nvSRAMs extends Infineon’s leadership in charge trap memories,” said Helmut Puchner, VP Fellow of Aerospace and Defense, at Infineon Technologies LLC. “These QML-Q and high-reliability, industrial-qualified devices in our expanded nvSRAM family demonstrate our commitment to deliver solutions for harsh operating environments that require high performance, high-reliability memories.”

Infineon’s nvSRAM technology combines high-performance SRAM with best-in-class SONOS non-volatile technology. Under normal operating conditions, nvSRAM acts similarly to a conventional asynchronous SRAM. In the event of a power failure, a nvSRAM automatically saves a copy of the SRAM data into non-volatile memory, where the data is protected for over 20 years. Infineon has shipped more than two billion SONOS-based non-volatile embedded or standalone memories.

Availability

The 256 kb STK14C88C and 1 Mb STK14CA8C nvSRAMs can be ordered now. More information is available at www.cypress.com/aero.

Leave a Reply

featured blogs
Apr 19, 2024
In today's rapidly evolving digital landscape, staying at the cutting edge is crucial to success. For MaxLinear, bridging the gap between firmware and hardware development has been pivotal. All of the company's products solve critical communication and high-frequency analysis...
Apr 18, 2024
Are you ready for a revolution in robotic technology (as opposed to a robotic revolution, of course)?...
Apr 18, 2024
See how Cisco accelerates library characterization and chip design with our cloud EDA tools, scaling access to SoC validation solutions and compute services.The post Cisco Accelerates Project Schedule by 66% Using Synopsys Cloud appeared first on Chip Design....

featured video

MaxLinear Integrates Analog & Digital Design in One Chip with Cadence 3D Solvers

Sponsored by Cadence Design Systems

MaxLinear has the unique capability of integrating analog and digital design on the same chip. Because of this, the team developed some interesting technology in the communication space. In the optical infrastructure domain, they created the first fully integrated 5nm CMOS PAM4 DSP. All their products solve critical communication and high-frequency analysis challenges.

Learn more about how MaxLinear is using Cadence’s Clarity 3D Solver and EMX Planar 3D Solver in their design process.

featured chalk talk

Package Evolution for MOSFETs and Diodes
Sponsored by Mouser Electronics and Vishay
A limiting factor for both MOSFETs and diodes is power dissipation per unit area and your choice of packaging can make a big difference in power dissipation. In this episode of Chalk Talk, Amelia Dalton and Brian Zachrel from Vishay investigate how package evolution has led to new advancements in diodes and MOSFETs including minimizing package resistance, increasing power density, and more! They also explore the benefits of using Vishay’s small and efficient PowerPAK® and eSMP® packages and the migration path you will need to keep in mind when using these solutions in your next design.
Jul 10, 2023
31,837 views