industry news
Subscribe Now

Imagination and Telechips drive automotive display diversity with hardware virtualization

Dolphin3 automotive processor with Imagination GPU technology for advanced graphics and compute on show at Embedded World

London, England – 14th March 2023 – Imagination Technologies and Telechips, a global fabless semiconductor company for connectivity and multimedia in automotive and smart homes, are showing the future of rich and vivid user interfaces for in-vehicle infotainment (IVI), cockpit and advanced driver assistance systems (ADAS) at Embedded World 2023.

The Telechips TCC805x (Dolphin3) processor family is built on extensive market knowledge accumulated over a decade of Telechips’ leadership in the market and utilises Imagination’s PowerVR Series9XTP graphics core to provide great performance for both 2D and 3D graphics. The technology will be on display at Embedded World 2023 in Nuremberg, Hall 4 Booth 558.

Stanley Kim, VP Worldwide Business, Telechips, says: “With electric vehicles expected to take a significant market share in the next five years, the focus for embedded automotive SoCs is shifting towards high-efficiency and high-performance solutions. This means the place to start the design journey is at the IP level. We chose Imagination for its rich history in market-leading power, performance and area (PPA) for automotive GPU solutions. By integrating PowerVR technology within our Dolphin3 chip we’ve added robust virtualization capabilities on top of efficient graphics.”

The Dolphin3 processor makes use of the Series9XTP’s HyperLane hardware virtualization technology to enable a hypervisor-less cockpit (HLC) solution. This solution manages multi-display and multi-channel camera inputs and handles both the image signal processing sub-systems and the built-in microcontroller systems to support an isolated safety island to ensure functional safety.

Jake Kochnowicz, Senior Director of Product Management, Imagination, says: “It is an exciting time in the automotive industry, as increasing consumer demands on user experience drive innovation at all levels, and companies such as Telechips rise to the challenge with great smart cockpit solutions such as the Dolphin3. As a hypervisor-less solution (HLS), the Dolphin3 makes it possible for manufacturers to deploy different operating systems affordably and securely on a single chip. Imagination’s PowerVR GPU fully complements Telechips’ SoC design, ensuring OEMs can safely run critical tasks by priority, giving them a dynamic edge in a highly competitive market.”

PowerVR Series9XTP, based on Imagination’s renowned tile-based deferred rendering architecture, includes a wider ALU design, visually lossless PVRIC4 image compression, an advanced scalable compute cluster architecture and high-efficiency compression technology including parameter compression and PVRTC™ texture compression. It also offers an enhanced scheduling architecture and dedicated housekeeping processors.

Imagination will be at Embedded World showcasing its latest solutions for embedded systems. In addition to GPU, Imagination will also be exhibiting its Catapult RSIC-V CPUsconnectivity and AI accelerator solutions, as part of its heterogeneous approach to chip design. Visit booth Hall 4 Booth 558.

Find out more about Imagination’s collaboration with Telechips.

Read more about Imagination’s automotive solutions.

Leave a Reply

featured blogs
Mar 24, 2023
With CadenceCONNECT CFD less than a month away, now is the time to make your travel plans to join us at the Santa Clara Convention Center on 19 April for our biggest CFD event of the year. As a bonus, CadenceCONNECT CFD is co-located with the first day of CadenceLIVE Silicon ...
Mar 23, 2023
Explore AI chip architecture and learn how AI's requirements and applications shape AI optimized hardware design across processors, memory chips, and more. The post Why AI Requires a New Chip Architecture appeared first on New Horizons for Chip Design....
Mar 10, 2023
A proven guide to enable project managers to successfully take over ongoing projects and get the work done!...

featured video

First CXL 2.0 IP Interoperability Demo with Compliance Tests

Sponsored by Synopsys

In this video, Sr. R&D Engineer Rehan Iqbal, will guide you through Synopsys CXL IP passing compliance tests and demonstrating our seamless interoperability with Teladyne LeCroy Z516 Exerciser. This first-of-its-kind interoperability demo is a testament to Synopsys' commitment to delivering reliable IP solutions.

Learn more about Synopsys CXL here

featured chalk talk

Twinax Flyover Systems for Next Gen Speeds
Sponsored by Samtec
As the demand for higher and higher speed connectivity increases, we need to look at our interconnect solutions to help solve the design requirements inherent with these kinds of designs. In this episode of Chalk Talk, Amelia Dalton and Matthew Burns from Samtec discuss how Samtec’s Flyover technology is helping solve our high speed connectivity needs. They take closer look at how Samtec’s Flyover technology helps solve the issue with PCB reach, the details of FLYOVER® QSFP SYSTEM, and how this cost effective, high–performance and heat efficient can help you with the challenges of your 56 Gbps bandwidths and beyond design.
May 17, 2022