industry news
Subscribe Now

Extend the Lifecycle of C6C-RYZ Modules with New Drop-In Replacement

PHOENIX – Sept. 19, 2023 – Design engineers and system architects can now effectively extend the operational lifespan of their previous generation AMD Ryzen™-powered C6C-RYZ COM Express® module with Avnet’s (Nasdaq: AVT) latest module called the MSC C6C-RYZ2. This module builds upon the previous generation, allowing enhanced performance, additional functionality, and prolonged usability.

“As a seamless drop-in replacement for the previous generation board, this new module allows designers to easily migrate their application to the new platform,” said Tim Jensen, senior director Embedded Product Innovation, Avnet. “We want to support our customers’ needs throughout the entire lifecycle of their products and this module enables both a performance upgrade and adds at least four years to the application lifecycle.”

The MSC C6C-RYZ2 module is the embedded platform for the AMD Ryzen Embedded R2000 processor family. This versatile system-on-chip (SoC) technology combines processing, graphics and I/O functionality on a single die, allowing for outstanding compute performance in environments with constrained real estate, power and cooling. Designers can choose a variety of quad and dual-core processors to scale performance and capabilities according to application requirements.

This module is ideal for medical equipment (e.g. eye surgery, ultrasound), digital signage, HMI (human machine interface), and automation.

Features

  • Scalable and power efficient platform for compute and graphics intensive applications
  • Compact product providing high processing and graphics performance
  • Four independent graphic streams
  • Rich I/O including Display Ports, eDP, LVDS, USB 3.2, USB 2.0

The board provides support for up to four independent displays with up to 4k x 2k resolution, highest level graphics acceleration and hardware-based video en-/decoding. Fast DDR4 memory and multiple USB 3.2/2.0 interfaces complete the compact and power saving module.

The MSC C6C-RYZ2 offers hardware-based security compliant to the requirements of TCG (Trusted Computing Group) and features TPM 2.0 capability.

The Type 6 pin-out allows direct access to the latest digital display interfaces like DisplayPort, HDMI 2.0b and DVI as well as up to four USB 3.2 interfaces.

The MSC C6C-RYZ2 is available for orders now. For more information, please visit https://embedded.avnet.com/com-express

Leave a Reply

featured blogs
Sep 21, 2023
Wireless communication in workplace wearables protects and boosts the occupational safety and productivity of industrial workers and front-line teams....
Sep 26, 2023
5G coverage from space has the potential to make connectivity to the Internet truly ubiquitous for a broad range of use cases....
Sep 26, 2023
Explore the LPDDR5X specification and learn how to leverage speed and efficiency improvements over LPDDR5 for ADAS, smartphones, AI accelerators, and beyond.The post How LPDDR5X Delivers the Speed Your Designs Need appeared first on Chip Design....
Sep 26, 2023
The eighth edition of the Women in CFD series features Mary Alarcon Herrera , a product engineer for the Cadence Computational Fluid Dynamics (CFD) team. Mary's unwavering passion and dedication toward a career in CFD has been instrumental in her success and has led her ...
Sep 21, 2023
Not knowing all the stuff I don't know didn't come easy. I've had to read a lot of books to get where I am....

Featured Video

Chiplet Architecture Accelerates Delivery of Industry-Leading Intel® FPGA Features and Capabilities

Sponsored by Intel

With each generation, packing millions of transistors onto shrinking dies gets more challenging. But we are continuing to change the game with advanced, targeted FPGAs for your needs. In this video, you’ll discover how Intel®’s chiplet-based approach to FPGAs delivers the latest capabilities faster than ever. Find out how we deliver on the promise of Moore’s law and push the boundaries with future innovations such as pathfinding options for chip-to-chip optical communication, exploring new ways to deliver better AI, and adopting UCIe standards in our next-generation FPGAs.

To learn more about chiplet architecture in Intel FPGA devices visit https://intel.ly/45B65Ij

featured paper

Intel's Chiplet Leadership Delivers Industry-Leading Capabilities at an Accelerated Pace

Sponsored by Intel

We're proud of our long history of rapid innovation in #FPGA development. With the help of Intel's Embedded Multi-Die Interconnect Bridge (EMIB), we’ve been able to advance our FPGAs at breakneck speed. In this blog, Intel’s Deepali Trehan charts the incredible history of our chiplet technology advancement from 2011 to today, and the many advantages of Intel's programmable logic devices, including the flexibility to combine a variety of IP from different process nodes and foundries, quicker time-to-market for new technologies and the ability to build higher-capacity semiconductors

To learn more about chiplet architecture in Intel FPGA devices visit: https://intel.ly/47JKL5h

featured chalk talk

dsPIC33CH DSCs: Two dsPIC33Cs on a Single Chip
Sponsored by Mouser Electronics and Microchip
In this episode of Chalk Talk, Vijay Bapu from Microchip and Amelia Dalton explore the benefits of dual core digital signal controllers. They discuss the key specifications to keep in mind when it comes to single core and dual core DSCs and how you can reduce your development time, save board space and cost and keep the performance and isolation you need with Microchip’s dsPIC33CH DSCs.
Jan 24, 2023
30,112 views