industry news
Subscribe Now

Concurrent Technologies Announce New Distributor Agreement with SoC-e

Concurrent Technologies Announce New Distributor Agreement with SoC-e

Concurrent Technologies, (AIM: CNC) a world-leading specialist in the design and manufacture of high-end embedded computer solutions and systems for critical applications, announces it has signed a distribution agreement with SoC-e, an internationally recognised provider of advanced equipment for real-time, high-availability Deterministic Ethernet networking for critical sectors.

This significant distribution agreement enables Concurrent Technologies to offer SoC-e’s portfolio of Relyum Advanced Networking Solutions within their home markets of the UK and USA, and additional worldwide territories. The inclusion of SoC-e’s reliable, robust, and field-proven Relyum solutions further strengthens Concurrent Technologies’s position as a market leader in delivering cutting-edge solutions for the aerospace and defence sectors.

In particular, the integration of Time Sensitive Networking (TSN) enables systems that are based on single ethernet fabrics to process real-time traffic with greater efficiency, eliminating the need to use extra legacy real-time data.

Miles Adcock, CEO of Concurrent Technologies, commented:

“Building strong relationships with strategic industry partners is a core focus for our organisation. We are pleased to work alongside the experienced SoC-e team to enhance our product offerings. The collaboration enables us to deliver our leading range of solutions and systems to our home and global markets with greater speed and efficiency than ever before.” 

Mikel Idirin, CEO of SoC-e, commented:

“Working with established partners like Concurrent Technologies is an exciting opportunity for us. Their clear strategy to deliver rugged systems with Advanced Networking capabilities, coupled with their extensive global sales network, aligns with our own ambitions and objectives. We are confident that this partnership will bring mutual success and further strength our positions as leaders in the industry.”

Leave a Reply

featured blogs
Sep 21, 2023
Wireless communication in workplace wearables protects and boosts the occupational safety and productivity of industrial workers and front-line teams....
Sep 26, 2023
5G coverage from space has the potential to make connectivity to the Internet truly ubiquitous for a broad range of use cases....
Sep 26, 2023
Explore the LPDDR5X specification and learn how to leverage speed and efficiency improvements over LPDDR5 for ADAS, smartphones, AI accelerators, and beyond.The post How LPDDR5X Delivers the Speed Your Designs Need appeared first on Chip Design....
Sep 26, 2023
The eighth edition of the Women in CFD series features Mary Alarcon Herrera , a product engineer for the Cadence Computational Fluid Dynamics (CFD) team. Mary's unwavering passion and dedication toward a career in CFD has been instrumental in her success and has led her ...
Sep 21, 2023
Not knowing all the stuff I don't know didn't come easy. I've had to read a lot of books to get where I am....

Featured Video

Chiplet Architecture Accelerates Delivery of Industry-Leading Intel® FPGA Features and Capabilities

Sponsored by Intel

With each generation, packing millions of transistors onto shrinking dies gets more challenging. But we are continuing to change the game with advanced, targeted FPGAs for your needs. In this video, you’ll discover how Intel®’s chiplet-based approach to FPGAs delivers the latest capabilities faster than ever. Find out how we deliver on the promise of Moore’s law and push the boundaries with future innovations such as pathfinding options for chip-to-chip optical communication, exploring new ways to deliver better AI, and adopting UCIe standards in our next-generation FPGAs.

To learn more about chiplet architecture in Intel FPGA devices visit https://intel.ly/45B65Ij

featured paper

Intel's Chiplet Leadership Delivers Industry-Leading Capabilities at an Accelerated Pace

Sponsored by Intel

We're proud of our long history of rapid innovation in #FPGA development. With the help of Intel's Embedded Multi-Die Interconnect Bridge (EMIB), we’ve been able to advance our FPGAs at breakneck speed. In this blog, Intel’s Deepali Trehan charts the incredible history of our chiplet technology advancement from 2011 to today, and the many advantages of Intel's programmable logic devices, including the flexibility to combine a variety of IP from different process nodes and foundries, quicker time-to-market for new technologies and the ability to build higher-capacity semiconductors

To learn more about chiplet architecture in Intel FPGA devices visit: https://intel.ly/47JKL5h

featured chalk talk

High-Voltage Isolation for Robust and Reliable System Operation
In this episode of Chalk Talk, Amelia Dalton and Luke Trowbridge from Texas Instruments examine the benefits of isolation in high voltage systems. They also explore the benefits of TI’s integrated transformer technology and how TI’s high voltage isolations can help you streamline your design process, reduce your bill of materials, and ensure reliable and robust system operation.
Apr 27, 2023
17,504 views