industry news
Subscribe Now

CEVA and Autotalks Expand Collaboration to Create World’s First 5G-V2X Solution

Autotalks’ latest CEVA-powered V2X chips - TEKTON3 and SECTON3 – already awarded series production by major automotive OEM

LAS VEGAS, NV, – Consumer Electronics Show – January 5, 2023 – CEVA, Inc. (NASDAQ: CEVA), ), the leading licensor of wireless connectivity and smart sensing technologies and co-creation solutions, announced today that Autotalks, a world leader in V2X (Vehicle-to-Everything) communication solutions, has licensed and deployed the CEVA-XC4500 Communication Processor and CEVA-BX1 Digital Signal Controller in its 3rd generation V2X chipsets, TEKTON3 and SECTON3. This latest collaboration follows on from Autotalks 2nd generation chips, SECTON and CRATON2, which are also powered by CEVA DSPs.

ABI Research forecasts that the number of registered vehicles with V2X will surpass 61 million by 2030, growing at a CAGR of 53% from 2023. TEKTON3 and SECTON3 are designed to support all existing and upcoming V2X requirements, with the CEVA DSPs supporting the 5G NR-V2X modem operation of these chips, enabling enhanced V2X capabilities for safety and autonomous driving. TEKTON3 and SECTON3 have already been awarded for series production of a passenger car by a major automotive OEM, set to be available in the market in 2026.

Amos Freund, Autotalks VP R&D, commented: “Autotalks is pleased to expand its collaboration with CEVA and continue to provide the world’s best V2X hardware and software with our TEKTON3 and SECTON3 chips. CEVA’s DSPs play a crucial role in the ability to concurrently support DSRC and C-V2X technologies, including the latest 5G NR-V2X standard. We are excited to see these chips deployed in passenger vehicles in the coming years, helping protect drivers, two-wheelers, and pedestrians.”

Guy Keshet, Vice President and General Manager of the Mobile Broadband Business Unit at CEVA, stated: “Autotalks is widely recognized as a pioneer in V2X chipsets, constantly pushing the technology forward to achieve mass market adoption. We are proud to work closely with them to provide our best-in-class DSPs for two generations of their V2X technology. We look forward to safer roads in the future, thanks in part to Autotalks lifesaving V2X solutions.”

About Autotalks
Autotalks (www.auto-talks.com), a V2X chipset market pioneer and leader, helps reduce collisions on roadways and improve mobility with its automotive qualified chipsets. The company’s chipsets offer the most advanced, truly secure and highest performing global V2X communication solution. Autotalks’ advanced technology, to be mass deployed in the coming years, complements the information coming from other sensors, specifically in non-line-of-sight scenarios, rough weather, or poor lighting conditions. It significantly improves overall road safety, effectively coordinating vehicles, self-driving cars, motorcyclists, and pedestrians.

About CEVA, Inc.
CEVA is the leading licensor of wireless connectivity and smart sensing technologies and co-creation solutions for a smarter, safer, connected world. We provide Digital Signal Processors, AI engines, wireless platforms, cryptography cores and complementary software for sensor fusion, image enhancement, computer vision, voice input and artificial intelligence. These technologies are offered in combination with our Intrinsix IP integration services, helping our customers address their most complex and time-critical integrated circuit design projects. Leveraging our technologies and chip design skills, many of the world’s leading semiconductors, system companies and OEMs create power-efficient, intelligent, secure and connected devices for a range of end markets, including mobile, consumer, automotive, robotics, industrial, aerospace & defense and IoT.

Our DSP-based solutions include platforms for 5G baseband processing in mobile, IoT and infrastructure, advanced imaging and computer vision for any camera-enabled device, audio/voice/speech and ultra-low-power always-on/sensing applications for multiple IoT markets. For sensor fusion, our Hillcrest Labs sensor processing technologies provide a broad range of sensor fusion software and inertial measurement unit (“IMU”) solutions for markets including hearables, wearables, AR/VR, PC, robotics, remote controls and IoT. For wireless IoT, our platforms for Bluetooth (low energy and dual mode), Wi-Fi 4/5/6 (802.11n/ac/ax), Ultra-wideband (UWB), NB-IoT and GNSS are the most broadly licensed connectivity platforms in the industry.

Visit us at www.ceva-dsp.com and follow us on TwitterYouTubeFacebookLinkedIn and Instagram.

Leave a Reply

featured blogs
Apr 24, 2024
Learn about maskless electron beam lithography and see how Multibeam's industry-first e-beam semiconductor lithography system leverages Synopsys software.The post Synopsys and Multibeam Accelerate Innovation with First Production-Ready E-Beam Lithography System appeared fir...
Apr 24, 2024
Diversity, equity, and inclusion (DEI) are not just words but values that are exemplified through our culture at Cadence. In the DEI@Cadence blog series, you'll find a community where employees share their perspectives and experiences. By providing a glimpse of their personal...
Apr 18, 2024
Are you ready for a revolution in robotic technology (as opposed to a robotic revolution, of course)?...

featured video

How MediaTek Optimizes SI Design with Cadence Optimality Explorer and Clarity 3D Solver

Sponsored by Cadence Design Systems

In the era of 5G/6G communication, signal integrity (SI) design considerations are important in high-speed interface design. MediaTek’s design process usually relies on human intuition, but with Cadence’s Optimality Intelligent System Explorer and Clarity 3D Solver, they’ve increased design productivity by 75X. The Optimality Explorer’s AI technology not only improves productivity, but also provides helpful insights and answers.

Learn how MediaTek uses Cadence tools in SI design

featured paper

Designing Robust 5G Power Amplifiers for the Real World

Sponsored by Keysight

Simulating 5G power amplifier (PA) designs at the component and system levels with authentic modulation and high-fidelity behavioral models increases predictability, lowers risk, and shrinks schedules. Simulation software enables multi-technology layout and multi-domain analysis, evaluating the impacts of 5G PA design choices while delivering accurate results in a single virtual workspace. This application note delves into how authentic modulation enhances predictability and performance in 5G millimeter-wave systems.

Download now to revolutionize your design process.

featured chalk talk

Power High-Performance Applications with Renesas RA8 Series MCUs
Sponsored by Mouser Electronics and Renesas
In this episode of Chalk Talk, Amelia Dalton and Kavita Char from Renesas explore the first 32-bit MCUs based on the new Arm® Cortex® -M85 core. They investigate how these new MCUs bridge the gap between MCUs and MPUs, the advanced security features included in this new MCU portfolio, and how you can get started using the Renesas high performance RA8 series in your next design. 
Jan 9, 2024
15,043 views