industry news
Subscribe Now

Ampleon’s “New” standard for L Band, GaN-SiC HEMT

High Output Power, High Efficiency of >700W GaN-SiC HEMT transistor for Long Pulse Radar Applications

Nijmegen, The Netherlands, 26 September 2022 – Ampleon will showcase at the European Microwave Week (held in Milan between 27 thru 29 September) our latest solutions and innovative products in GaN and LDMOS technologies. Among the products on display will be ones aimed at wireless infrastructure, avionics/defence, non-cellular communication, cooking/ defrosting, and ISM-related applications.

A key highlight for visitors to the Ampleon booth (#B36) will be the brand new CLL3H0914L-700 GaN-SiC HEMT. This rugged GaN transistor is optimised for radar implementations where long pulse width and high-duty cycles are required. The transistor was engineered to achieve over 700W of peak output power from a single transistor while operating at a voltage of 50V with industry-leading efficiency of over 70% as well as designed thermally for long pulse applications, such as pulse widths (~2 milliseconds) and 20% duty cycles.

These L Band GaN HEMT superior performance capabilities are demonstrated in a variety of application reference designs shown at the booth – including ones for defence/aerospace bands (960-1250MHz and 1030-1090MHz), plus an L band ground base radar (1200-1400MHz).

A datasheet for the CLL3H0914LS-700 can be accessed here. This high-power density and low-thermal resistance HEMT is now in full volume production. Units are available directly from Ampleon or authorised distribution partners, RFMW and Digi-Key. Large signal models in ADS and MWO can be sourced via the Ampleon website.

You can also learn more by coming to Booth #B36 at European Microwave Week.

+++Ends

For further information and reader inquiries:

Natascha Jellema, Corporate Communications
Ampleon Netherlands B.V., Halfgeleiderweg 8, 6534 AV Nijmegen, The Netherlands
Tel: +31 6 208 14 771, Email: natascha.jellema@ampleon.com,
www.ampleon.com

About Ampleon:

Created in 2015, Ampleon is shaped by 50 years of RF power leadership and is set to exploit the full potential of data and energy transfer in RF. Ampleon has more than 1,650 employees worldwide, dedicated to creating optimal value for customers. Its innovative, yet consistent portfolio offers products and solutions for a wide range of applications, such as mobile broadband infrastructure, radio & TV broadcasting, CO2 lasers & plasma, MRI, particle accelerators, radar & air-traffic control, non-cellular communications, RF cooking & defrosting, RF heating and plasma lighting. For details on the leading global partner in RF Power, visit www.ampleon.com

Leave a Reply

featured blogs
Dec 6, 2023
Optimizing a silicon chip at the system level is crucial in achieving peak performance, efficiency, and system reliability. As Moore's Law faces diminishing returns, simply transitioning to the latest process node no longer guarantees substantial power, performance, or c...
Dec 6, 2023
Explore standards development and functional safety requirements with Jyotika Athavale, IEEE senior member and Senior Director of Silicon Lifecycle Management.The post Q&A With Jyotika Athavale, IEEE Champion, on Advancing Standards Development Worldwide appeared first ...
Nov 6, 2023
Suffice it to say that everyone and everything in these images was shot in-camera underwater, and that the results truly are haunting....

featured video

Dramatically Improve PPA and Productivity with Generative AI

Sponsored by Cadence Design Systems

Discover how you can quickly optimize flows for many blocks concurrently and use that knowledge for your next design. The Cadence Cerebrus Intelligent Chip Explorer is a revolutionary, AI-driven, automated approach to chip design flow optimization. Block engineers specify the design goals, and generative AI features within Cadence Cerebrus Explorer will intelligently optimize the design to meet the power, performance, and area (PPA) goals in a completely automated way.

Click here for more information

featured paper

3D-IC Design Challenges and Requirements

Sponsored by Cadence Design Systems

While there is great interest in 3D-IC technology, it is still in its early phases. Standard definitions are lacking, the supply chain ecosystem is in flux, and design, analysis, verification, and test challenges need to be resolved. Read this paper to learn about design challenges, ecosystem requirements, and needed solutions. While various types of multi-die packages have been available for many years, this paper focuses on 3D integration and packaging of multiple stacked dies.

Click to read more

featured chalk talk

Advancements in Motor Efficiency Enables More Sustainable Manufacturing
Climate change is encouraging the acceleration of sustainable and renewable manufacturing processes and practices and one way we can encourage sustainability in manufacturing is with the use of variable speed drive motor control. In this episode of Chalk Talk, Amelia Dalton chats with Maurizio Gavardoni and Naveen Dhull from Analog Devices about the wide ranging benefits of variable speed motors, the role that current feedback plays in variable speed motor control, and how precision measurement solutions for current feedback can lead to higher motor efficiency, energy saving and enhanced sustainability.
Oct 19, 2023
5,916 views