industry news
Subscribe Now

TSMC Expands IP Alliance to Include Soft IP

HSINCHU, Taiwan, R.O.C., Oct. 5 — TSMC (TWSE: 2330, NYSE: TSM) today expanded its IP Alliance to incorporate a soft IP program that will improve soft IP readiness for advanced technology nodes and drive earlier time-to-market.

TSMC is expected to provide specific design documents and technology information  through the program so that partners can optimize their soft IP to TSMC’s technology. TSMC will also collaborate with these companies to expedite soft IP readiness by aligning their development with TSMC’s process technology roadmap.

Soft IP has historically been process technology independent and therefore was not optimized for power, performance and area considerations. Given the ever-increasing need of first time silicon success and early time-to-market for highly integrated circuits such as System-on-Chip (SoC), close technical collaboration between the foundry and the IP provider is imperative to optimize this critical trade-off.

The new program enriches TSMC’s IP alliance portfolio, encourages soft IP innovation and reuse through TSMC’s Open Innovation Platform™ initiative, and helps deliver power, performance and area optimization that are a particularly important consideration to the success of products at advanced technology nodes.

“Understanding power, performance and area trade-off inherent in large SoC designs early in the design cycle is essential,” said Dan Kochpatcharin, deputy director, IP Portfolio Marketing at TSMC. “We work with soft IP partners to combine TSMC’s foundry-leading technologies and manufacturing capability with their soft IP cores to address this concern.”

TSMC kicked off the soft IP program by working with EDA and IP companies Arteris, Atrenta Inc., Cadence Design Systems, Inc., Chips&Media, Imagination Technologies, Intrinsic-ID, MIPS Technologies, Sonics, Inc., Synopsys, Inc. and Vivante Corporation.

About the Open Innovation Platform™

The TSMC Open Innovation Platform ™ promotes timeliness-driven innovation among the semiconductor design community, ecosystem partners, and TSMC’s complete technology portfolio. The Open Innovation Platform includes a set of ecosystem interfaces and collaborative components initiated and supported by TSMC that efficiently empowers innovation throughout the supply chain thereby enabling creation and sharing of newly created revenue and profitability. TSMC’s Active Accuracy Assurance (AAA) initiative is a critical part of the Open Innovation Platform, providing the accuracy and quality required by ecosystem interfaces and collaborative components.

About TSMC  

TSMC is the world’s largest dedicated semiconductor foundry, providing the industry’s leading process technology and the foundry’s largest portfolio of process-proven libraries, IPs, design tools and reference flows. The company’s managed capacity in 2009 totaled 9.96 million (8-inch equivalent) wafers, including capacity from two advanced 12-inch GigaFabs™, four eight-inch fabs, one six-inch fab, as well as TSMC’s wholly owned subsidiaries, WaferTech and TSMC China, and its joint venture fab, SSMC. TSMC is the first foundry to provide 40nm production capabilities. Its corporate headquarters are in Hsinchu, Taiwan. For more information about TSMC please visit http://www.tsmc.com.

Leave a Reply

featured blogs
Mar 28, 2024
The difference between Olympic glory and missing out on the podium is often measured in mere fractions of a second, highlighting the pivotal role of timing in sports. But what's the chronometric secret to those photo finishes and record-breaking feats? In this comprehens...
Mar 26, 2024
Learn how GPU acceleration impacts digital chip design implementation, expanding beyond chip simulation to fulfill compute demands of the RTL-to-GDSII process.The post Can GPUs Accelerate Digital Design Implementation? appeared first on Chip Design....
Mar 21, 2024
The awesome thing about these machines is that you are limited only by your imagination, and I've got a GREAT imagination....

featured video

We are Altera. We are for the innovators.

Sponsored by Intel

Today we embark on an exciting journey as we transition to Altera, an Intel Company. In a world of endless opportunities and challenges, we are here to provide the flexibility needed by our ecosystem of customers and partners to pioneer and accelerate innovation. As we leap into the future, we are committed to providing easy-to-design and deploy leadership programmable solutions to innovators to unlock extraordinary possibilities for everyone on the planet.

To learn more about Altera visit: http://intel.com/altera

featured chalk talk

Addressing the Challenges of Low-Latency, High-Performance Wi-Fi
In this episode of Chalk Talk, Amelia Dalton, Andrew Hart from Infineon, and Andy Ross from Laird Connectivity examine the benefits of Wi-Fi 6 and 6E, why IIoT designs are perfectly suited for Wi-Fi 6 and 6E, and how Wi-Fi 6 and 6E will bring Wi-Fi connectivity to a broad range of new applications.
Nov 17, 2023
17,258 views