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Kane Computing supports 3L Diamond TI C6000 Multicore Tool Suite

Northwich, Cheshire, 2nd August 2010. Kane Computing Ltd (KCL) has signed up to the 3L Affiliate Programme to support the sales of the latest Version 4 3L Diamond Multiprocessor/Multicore Software Tools, that has been launched to coincide with the availability of the new Texas Instruments TMS320C6472 multicore DSP.

Diamond’s proven multiprocessor model now extends to multicore DSPs, bridging the conceptual gap between multi and single-core development. With Diamond, multicore DSPs are available as collections of several independent processors and implied connections between them. Diamond enables development to scale smoothly as cores per DSP and multicore DSPs per system increase. Expanding a system from six cores on one multicore DSP to more on a cluster of independent DSPs is trivially easy as actual code is unaffected as Diamond removes the need to include explicit information about shared resources.

Diamond I/O API functions are always the same irrespective of the actual connection mechanism used and Diamond channels always behave in the same way, whether between two tasks on the same core, on different cores in the same DSP, on different cores in different DSPs, or even across combinations of DSPs and FPGAs channel by channel, Diamond automatically chooses the correct I/O implementation and optimises the communication settings.

Diamond also manages time-consuming chores such as loading complex multicore systems, memory allocation across a range of shared and private memories and handling the complexities of caches and their non-obvious interactions with multiple cores.

3L Diamond TI C6000 multicore includes multiprocessor RTOS, integrated development environment and multiprocessor configure to delivery highly efficient multiprocessor/multicore applications in the quickest time.

3L offer two 3L Diamond 4.0 products; Diamond Core is a low cost one year licence targeted at prototyping and educational use supporting the C6472 hardware products available from KCL. Diamond Premium is a perpetual licence and offers additional functionality plus support for other C6000 DSPs and Xilinx Virtex and Spartan FPGAs.

Kane Computing Ltd sell a number of C6472 based boards, including the Texas Instruments C6472 based EVM and also a hybrid multiprocessor board from Sundance, the EVP6472 with two C6472s and a Virtex-5 FPGA.

Richard White, Managing Director of KCL said “3L Diamond C6000 multicore is the perfect tool for our customers using these hardware products to enable them to programme faster and more efficiently”.

Flemming Christensen, Managing Director of Sundance said “By delivering the optimal balance of automation with designer control, 3L Diamond is outstanding in its productivity and application efficiency. Customers can reuse their code and IP and very quickly see efficient designs working across multiple FPGAs and DSPs”.

About Kane Computing

KCL (www.kanecomputing.co.uk) has been providing Image Processing, DSP and high performance computing products for use in industry, education and research since 1987 and is a Texas Instruments Third Party Partner specialising in consultancy and advice on TI development tools/platforms and image processing applications. KCL have extensive knowledge and experience of providing video compression solutions for many industries particularly for digital video security and high quality broadcast applications. KCL has a policy of continual improvement and operates its business in accordance with the requirements of ISO9001:2000.

About 3L

3L Ltd is The Multiprocessor Design Company that provides the design tools, software and IP that is used by application developers to create multiprocessor systems that feature DSP, FPGA & GPP. Its Diamond multiprocessor tool suite is used by some of the world’s leading electronics companies and provides an easy to use, flexible environment where very high performance processing technologies can be quickly leveraged and applied to demanding signal processing applications. Founded in 1987 the company’s products are used in the telecom, video and signal processing, and defense markets. It is headquartered in Edinburgh, UK, and operates internationally. For more information visit www.3l.com.

About Sundance

Sundance designs, develops, manufactures and markets internationally high performance signal processing and reconfigurable systems for original equipment manufacturers in the wireless and signal processing markets. Leveraging its multiprocessor expertise and experience, Sundance provides OEM with modular DSP and FPGA-based systems as well as data acquisition, I/O, communication and interconnectivity products that are essential to multiprocessor systems where scalability and performance are essential. With over fifty different modules and carriers for PCI, cPCI VME and Stand Alone platforms, Sundance is a solution provider to semiconductor, pharmaceutical and factory automation industries. Sundance, founded in 1989 by the current directors, is a member of the TI Third Party Program, Xilinx Alliance Partner and MathWorks’ Connection programs. For more information visit www.sundance.com.

About the Texas Instruments and the DSP Third Party Network

Texas Instruments Incorporated (www.ti.com) is the world leader in digital signal processing and analogue technologies, the semiconductor engines of the Internet age. The company’s businesses also include sensors and controls, and educational and productivity solutions. TI is headquartered in Dallas, Texas, and has manufacturing or sales operations in more than 25 countries. The TI DSP Third Party Network is a worldwide organization of independent companies that offer products and services supporting TI DSPs. TI third parties provide expertise across a variety of applications, including audio, control, telecom, video and imaging and wireless communications. Third party products and services include a broad range of application software, development hardware and software, and consulting services that support original equipment manufacturers’ efforts to bring differentiated products to the market quickly. For more information about the TI DSP Third Party Network, please visit http://www.ti.com/3p.

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