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Complete Packaging for IIoT Devices — Phoenix Contact and Mouser Electronics

 

Industrial Internet of Things (IIoT) design brings a new level of demands to the engineering team, particularly in areas like thermal performance, reliability, and scalability. And, packaging has a key role to play. In this episode of Chalk Talk, Amelia Dalton chats with Joel Boone of Phoenix Contact about challenges and solutions in IIoT design packaging.

Click here for more information about Phoenix Contact ICS 50 Enclosure System.

Click here for more information about Phoenix Contact ICS Modular Housing Systems

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