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A New Advanced IC Packaging Battlefield

 

Today, advanced packaging technology has created a new battleground where 2.5D packaging and heterogeneous design drive constraints that span semiconductor, packaging, board, and even system-level design. In this episode of Chalk Talk, Amelia Dalton chats with John Park of Cadence Design Systems about new techniques and tools for advanced IC packaging design.

Click here for more information about 3D-IC Design Solutions from Cadence Design Systems.

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