Automated Benchmark Tuning
Benchmarking is a great way to measure the performance of computing resources, but benchmark tuning can be a very complicated problem to solve. In this episode of Chalk Talk, Nozar Nozarian from Synopsys and Amelia Dalton investigate Synopsys’ Optimizer Studio that combines an evolution search algorithm with a powerful user interface that can help you quickly setup and run benchmarking experiments with much less effort and time than ever before.
Product Blocked by Supply Chain Woes? Digi XBee® RR to the Rescue!
Sponsored by Mouser Electronics and Digi
In this episode of Chalk Talk, Amelia Dalton and Quinn Jones from Digi investigate the benefits that the Digi XBee RR wireless modules can bring to your next design. We also take a closer look at the migration path from Digi XBee 3 to XBee RR, the design aspects you should keep in mind when moving from the Digi XBee 3 to the RR and how the Digi XBee Multi-programmer can help you get exactly the configuration you need in your next design.
Analog in a Digital World: TRIMPOT® Trimming Potentiometers
Sponsored by Mouser Electronics and Bourns
Trimmer potentiometers are a great way to fine tune the output of an analog circuit and can be found used in a wide variety of applications. In this episode of Chalk Talk, Patricia Moorman from Bourns and Amelia Dalton break down the what, where, how, and why of trimpots and the benefits that Bourns trimpots can bring to your next design.
Sponsored by Mouser Electronics and Analog Devices
In order to move forward with innovations on the intelligent edge, we need to take a close look at isolation and how it can help foster the adoption of high voltage charging solutions and reliable and robust high speed communication. In this episode of Chalk Talk, Amelia Dalton is joined by Allison Lemus, Maurizio Granato, and Karthi Gopalan from Analog Devices and they examine benefits that isolation brings to intelligent edge applications including smart building control, the enablement of Industry 4.0, and more. They also examine how Analog Devices iCoupler® digital isolation technology can encourage innovation big and small!
Latest Feature Articles
Is the Future of AI Sparse?
I think we’re all familiar with the old riddle joke that starts with the question, “Why did the chicken cross the road?” and ends with the answer, “To get to the other side!” This is one of the things we seem to learn by some form of sociological osmosis without ever being able to recall … Read More → "Aaron Test"
Winston Kock: Right Place, Right Time, Right Idea
During research for my recent 6-part article series on the early transistor makers, I tried to find information on the companies that attended the 1952 Bell Labs Transistor Symposium, yet clearly never made transistors. One of those companies was listed as “The Baldwin Company.” Searching the Internet, the closest match I could find for that … Read More → "Aaron Test"
The Soft Robot Revolution: imec Develops Robotic Systems That Can Self Heal and Feel Pain
Did you know imec and VUB have teamed up to develop soft robotic systems that can feel pain and self-heal? Bram Vanderborght (imec) joins me this week to chat all about it! We investigate the challenges inherent to soft robotics, how an integrated approach and several breakthrough innovations made these robotic systems possible, and where … Read More → "Aaron Test"
100+ AI-Designed SoCs and Counting!
Way back in the mists of time we used to call 2020, the guys and gals at Synopsys launched DSO.ai (Design Space Optimization AI), which they described as being “The industry’s first autonomous artificial intelligence (AI) application for chip design.” As they said at that time, “DSO.ai searches for optimization targets in very large solution … Read More → "Aaron Test"
Latest Sponsored Content
featured chalk talk
Spectral and Color Sensors
Sponsored by Mouser Electronics and ams OSRAM
There has been quite a bit of advancement in the world of spectrometers of the last several years. In this episode of Chalk Talk, Amelia Dalton and Jim Archibald from ams OSRAM investigate how multispectral sensing solutions are driving innovation in a variety of different fields. They also explore the functions involved with multispectral sensing, the details of ams OSRAM’s AS7343 spectral sensor, and why smoke detection is a great application for this kind of multispectral sensing.
First CXL 2.0 IP Interoperability Demo with Compliance Tests
In this video, Sr. R&D Engineer Rehan Iqbal, will guide you through Synopsys CXL IP passing compliance tests and demonstrating our seamless interoperability with Teladyne LeCroy Z516 Exerciser. This first-of-its-kind interoperability demo is a testament to Synopsys' commitment to delivering reliable IP solutions.
featured chalk talk
Advantech Edge Gateways for Equipment Monitoring
Sponsored by Mouser Electronics
One of the biggest challenges with equipment monitoring today includes one critical question: How do I integrate multiple data formats from different devices, equipment, meters, and sensors into my system? In this episode of Chalk Talk, Amelia Dalton chats with Eric Wang from Advantech about how the Advantech WISE-EdgeLink solution can help you navigate the challenges of data collection in edge applications. They also take a closer look at the benefits of the Advantech WISE-EdgeLink smart gateway family and show you how to get started using one of these smart gateways in your next edge application.
Level Up Your Knowledge!
Sponsored by Mouser Electronics
Feeling behind in the game? Mouser's newsletter and technical resource subscriptions will ensure that your skills are next level! Set your preferences and customize your subscription to power up your knowledge today!
Innoscience delivers compact, high-performance SolidGaN integrated half-bridge solution with driver
March 20th, 2023 – Innoscience Technology, the company founded to create a global energy ecosystem based on high-performance, low-cost, gallium-nitride-on-silicon (GaN-on-Si) power solutions, today launched the first in a new family of SolidGaN integrated GaN devices. ISG3201 is a complete half-bridge circuit including two 100V 3.2mΩ InnoGaN HEMTs and the required driver circuitry in an LGA … Read More → "Aaron Test"
New MPLAB® SiC Power Simulator Allows Customers to Test Microchip’s SiC Power Solutions in Design Phase
CHANDLER, Ariz., March 20, 2023 — The electrification of everything is driving the growth of SiC semiconductors as large market segments such as E-Mobility, sustainability and industrial turn to SiC power solutions because of its fast-switching capabilities, lower power loss and higher temperature performance. To help power design engineers transition to SiC power solutions with ease, … Read More → "Aaron Test"
IAR Enables Robust End-to-End Embedded Security Solution with the Launch of IAR Embedded Trust
Uppsala, Sweden; March 9, 2023 – IAR, the world leader in software and services for embedded development, is announcing today the launch of IAR Embedded Trust – the most robust end-to-end security workflow in the embedded industry. With this latest release, IAR delivers on its promise of “Security Made Simple” by helping customers manage, prioritize, … Read More → "Aaron Test"
CUI Devices Introduces M8 Models to Circular Cable Assemblies Line
LAKE OSWEGO, Ore. — March 21, 2023 — CUI Devices’ Interconnect Group today announced the addition of M8 connector types to its line of circular cable assemblies. The CDM8 family offers a range of male or female plug versions with contact position options of 3, 4, 5, 6, or 8 pins. These M8 connectors are A coded to support 1 Gbit Ethernet … Read More → "Aaron Test"
Try This Helpful New Way to Submit Website Feedback
Sponsored by Samtec
One of the ways we continue to hold the #1 spot for several website categories in our industry is by making it easy for customers to get in touch with us and […]
How Synopsys and NVIDIA Are Accelerating Semiconductor Scaling in the AI Age
We explain computational lithography and explore how our partnership with NVIDIA accelerates semiconductor scaling and the chip design flow in the AI age.
Secure DDR DRAM Against Rowhammer, RAMBleed, and Cold-Boot Attacks
Learn how to design security into high-bandwidth DDR memory interfaces and protect DRAM devices & data from memory-scraping attacks like Rowhammer & RAMbleed.
AI-Enabled Software Sustainability Helps Drive Electronics Growth
Sponsored by Cadence Design Systems
Electronic design has evolved over the years to provide methods for optimizing power, space, and energy needs for the most demanding market applications in areas including hyperscale computing, consumer, 5G communications, automotive, mobile, aerospace, industrial, and healthcare. Because of these design innovations, electronics have become an essential part of our consumer and industrial daily lives. Sustainability is becoming and important consideration of electronics design and has even risen to the level of corporate governance . Our company and our customers have heard this rallying cry for increased sustainability, and we are significantly revising and enhancing our design projects to do our part to invest in the health of the planet. The pressure is on for organizations to create and adopt long-term sustainability goals and environmental social governance (ESG) goals. Key to decreasing e-waste and increasing sustainability is to design each component of the product right from the very start to extend the product life cycle. We call this intelligent system design, and many electronics companies are using this technology to create products with a lower carbon footprint. Artificial Intelligence (AI) and machine learning (ML) are essential to the advancements made in intelligent system design. They are used to ensure that mistakes are not made in the electronic design automation (EDA) processes for complex electronic systems. And they can find opportunities to save power that might elude human designers. AI is employed in almost every design tool we offer for the entire electronics design chain, from chip design to chip packaging to boards and to systems. AI helps deliver the next generation of power and energy efficiency, accurately predicting power early in the design process. AI helps engineers identify activities that can be eliminated, producing designs with the bare minimum of power required to perform a given function. As the latest chips grow in size and complexity, a vast amount of design data is generated during verification and implementation. The Cadence Joint Enterprise Data and AI (JedAI) Platform harnesses this design data in an open, AI-driven, large-scale data analytics environment optimized for massive, heterogeneous, structured, and unstructured EDA data. By using the Cadence JedAI Platform, designers can quickly identify the most critical power, performance, and area (PPA) objectives and design bottlenecks, resulting in faster design closure with fewer engineering resources. Now designers can use AI-driven optimization and debug to create multiple designs in parallel with fewer engineers. Skycore Semiconductors employed the Cadence Cloud Portfolio of design tools to create a high-voltage switched-capacitor microchip technology that can significantly reduce the size, price, and energy loss of power converters, thereby strengthening the transition towards a sustainable world powered by electricity. Lotus Microsystems designed a power converter with 70% less size and 50% less weight than the state-of-the-art miniature power converter using AI-assisted design tools. They employed eco-friendly materials to drive product development in the direction of a more sustainable future in conjunction with United Nations (UN) sustainability goals . By using pre-designed IP components, design teams can push the boundaries to achieve the lowest power impact in the industry while retaining significant performance advancement. For example, the Tensilica® HiFi 1 digital signal processor (DSP) extends the duration of voice communication and music playback, allowing always listening to voice commands with minimal impact on battery life. This processor for a greener world enables small form factor, low-cost consumer and mobile devices, as well as automotive and industrial devices. Robust computational fluid dynamics (CFD) software uses AI techniques to simulate the behavior of fluids and their thermodynamic properties. Among other uses, this software has been used by Pipistrel Vertical Solutions to redesign for shorter aircraft takeoff and landing, reduced energy consumption for increased flight ranges, and noise reduction. The data center construction and retrofitting market is growing rapidly, resulting in an incredible focus on power and energy efficiency. Data center managers need to both set aggressive emissions and energy reduction goals and then create the measurements to make sure they will meet those goals, which they can report back to investors, government agencies, and other interested parties. By creating a digital twin, a physics-based simulation of an entire data center, managers can make informed decisions about cutting costs, increasing energy efficiency, and safeguarding reliability to meet service level agreement (SLA) requirements. Response to new requests can be evaluated quickly and factually while sustainability goals are measured. These are just a few examples of the AI and ML techniques that are used throughout the electronic design process to provide better, more predictable, and more sustainable outcomes. Tools now suggest solutions to common problems that might otherwise take design teams weeks or months to evaluate. These suggestions help the electronics industry design products that will last longer, take up less space, require fewer valuable resources, and lead us to a sustainable future.