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Cadence is a pivotal leader in electronic design, building upon more than 30 years of computational software expertise. The company applies its underlying Intelligent System Design strategy to deliver software, hardware and IP that turn design concepts into reality.

 
 

Cadence Blog – Latest Posts

Learn Fast and Make Things
“Move fast and break things,” a motto coined by Mark Zuckerberg, captures the ethos of Silicon Valley where creative disruption remakes the world through the invention of new technologies. From social media to autonomous cars, to generative AI, the disruptions have reverb...
Mar 28, 2024
Women in CFD with Morna Baillie
In this edition of the Women in CFD series, we are excited to feature Morna Baillie , a product engineer for Cadence Celsius EC Solver . Morna is a multi-talented woman, skilled in engineering and rock climbing, demonstrating exceptional determination, focus, and expertise in...
Mar 28, 2024
Intel and Cadence Partner to Build Out the Foundry Ecosystem in America
As a result of the largest public-private investment ever made in the U.S. semiconductor industry, Intel Foundry has announced plans to expand semiconductor facilities in Arizona, Ohio, New Mexico, and Oregon. The investment is aimed at building up a resilient domestic and gl...
Mar 28, 2024
SJSU Is Providing Hands-On Rocketry Experience to Its Students
In most engineering programs around the world, students only learn how to design things on paper. But the rocketry program at San José State University (SJSU) is different. Not only do its students get to design airplanes and spacecraft rockets, but they also have an opp...
Mar 28, 2024
From Sundials to Smartwatches: The Evolution of Olympic Timekeeping!
The difference between Olympic glory and missing out on the podium is often measured in mere fractions of a second, highlighting the pivotal role of timing in sports. But what's the chronometric secret to those photo finishes and record-breaking feats? In this comprehens...
Mar 28, 2024
Podcast: PCB 3.0: A New Design Methodology
The current state of PCB design is in the middle of a trifecta; there’s an evolution, a revolution, and an exodus. There are better tools and material changes, there’s the addition of artificial intelligence and machine learning (AI/ML), but at the same time, people are l...
Mar 27, 2024
Honda Is Propelling Forward in the EV and eVTOL Race
In the world of vehicles, Honda is a household name. Founded in 1948, they’ve been the world’s largest motorcycle manufacturer since 1959, they produce millions of internal combustion engines (ICEs) every year, and they’re the eighth largest automobile manufacturer in t...
Mar 21, 2024
Cadence Introduces the Industry’s First GDDR7 Verification Solution
GDDR7 Introduction In February 2024, JEDEC announced the successor to GDDR6 with many new features and a big leap in terms of operating speed. GDDR7 is a high-speed synchronous graphic DRAM with a semi-independent row and column command address bus and two modes of data signa...
Mar 20, 2024

 

Chalk Talks Featuring Cadence

Faster, More Predictable Path to Multi-Chiplet Design Closure
The challenges for 3D IC design are greater than standard chip design - but they are not insurmountable. In this episode of Chalk Talk, Amelia Dalton chats with Vinay Patwardhan from Cadence Design Systems about the variety of challenges faced by 3D IC designers today and how Cadence’s integrated, high-capacity Integrity 3D IC Platform, with its 3D design planning and implementation cockpit, flow manager and co-design capabilities will not only help you with your next 3D IC design.
Mar 3, 2022
43,979 views
Enabling Digital Transformation in Electronic Design with Cadence Cloud
With increasing design sizes, complexity of advanced nodes, and faster time to market requirements - design teams are looking for scalability, simplicity, flexibility and agility. In today’s Chalk Talk, Amelia Dalton chats with Mahesh Turaga about the details of Cadence’s end to end cloud portfolio, how you can extend your on-prem environment with the push of a button with Cadence’s new hybrid cloud and Cadence’s Cloud solutions you can help you from design creation to systems design and more.
Mar 3, 2022
44,033 views
Machine-Learning Optimized Chip Design -- Cadence Design Systems
New applications and technology are driving demand for even more compute and functionality in the devices we use every day. System on chip (SoC) designs are quickly migrating to new process nodes, and rapidly growing in size and complexity. In this episode of Chalk Talk, Amelia Dalton chats with Rod Metcalfe about how machine learning combined with distributed computing offers new capabilities to automate and scale RTL to GDS chip implementation flows, enabling design teams to support more, and increasingly complex, SoC projects.
Oct 14, 2021
43,193 views
Cloud Computing for Electronic Design (Are We There Yet?)
When your project is at crunch time, a shortage of server capacity can bring your schedule to a crawl. But, the rest of the year, having a bunch of extra servers sitting around idle can be extremely expensive. Cloud-based EDA lets you have exactly the compute resources you need, when you need them. In this episode of Chalk Talk, Amelia Dalton chats with Craig Johnson of Cadence Design Systems about Cadence’s cloud-based EDA solutions.
May 8, 2020
54,285 views

 

Featured Content from Cadence

featured video
Faster Path to Multi-Chiplet Design Closure with Better Predictability
Discover how Cadence Integrity 3D-IC is reinventing multi-chiplet design. The Integrity™ 3D-IC Platform provides an industry-first holistic and comprehensive 3D-IC design planning, implementation, and analysis platform to take the full system view and perform system-driven optimization of performance, power, and area (PPA) for chiplets and co-design of interposers, packages, and PCBs for 3D-IC applications
Jan 4, 2024
26,137 views
featured paper
3D-IC Design Challenges and Requirements
While there is great interest in 3D-IC technology, it is still in its early phases. Standard definitions are lacking, the supply chain ecosystem is in flux, and design, analysis, verification, and test challenges need to be resolved. Read this paper to learn about design challenges, ecosystem requirements, and needed solutions. While various types of multi-die packages have been available for many years, this paper focuses on 3D integration and packaging of multiple stacked dies.
Nov 20, 2023
featured video
Dramatically Improve PPA and Productivity with Generative AI
Discover how you can quickly optimize flows for many blocks concurrently and use that knowledge for your next design. The Cadence Cerebrus Intelligent Chip Explorer is a revolutionary, AI-driven, automated approach to chip design flow optimization. Block engineers specify the design goals, and generative AI features within Cadence Cerebrus Explorer will intelligently optimize the design to meet the power, performance, and area (PPA) goals in a completely automated way.
Nov 20, 2023
23,655 views
featured paper
Industry’s First LLM Technology for Chip Design
Read about the first robust proof of concept of a large language model (LLM) in chip design. To focus on this LLM’s conversation skills would be to misunderstand just how powerful this technology stands to be in solving some of chip design’s most pressing challenges—automating the workflow to reduce errors introduced by humans in creating the design specification, the design itself, and all the project documents needed to create a complex semiconductor device.
Oct 19, 2023