Halloween saw the latest Linley Fall Processor Conference. It is only a few years ago that processors were fairly boring. Intel and Arm would regularly come out with new designs, and some specialized processor families like Tensilica would update their offerings. I ...
The new release of the Virtuoso platform (ICADVM18.1) offers groundbreaking analysis capabilities and an innovational new simulation-driven layout for more robust and efficient design implementation as well as extending our support for the most advanced process technologies. With this solution, we are ...
Back in the days when Roger Moore was James Bond, there were various criticisms of his acting style (or lack of it): I am so surprised, I shall raise my left eyebrow. I am so amused, I shall raise my right eyebrow. ...
Primes are really important in encryption. In fact, the foundation of internet security depends on a couple of things that seem somewhat impossible could both be true at once: It is easy to decide whether a number has factors or not There ...
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Cadence Chalk Talks
A New Advanced IC Packaging Battlefield
Today, advanced packaging technology has created a new battleground where 2.5D packaging and heterogeneous design drive constraints that span semiconductor, packaging, board, and even system-level design. In this episode of Chalk Talk, Amelia Dalton chats with John Park of Cadence Design Systems about new techniques and tools for advanced IC packaging design.
Click here for more information about 3D-IC Design Solutions from Cadence Design Systems.
Designing High-Reliability Analog and Mixed-Signal ICs for Mission-Critical Applications
Designing products for reliability and longevity requires a different mindset – and a different tool set from the more common “just get it out the door” engineering methodology. We need to focus on all phases of product life, and do a diligent analysis of the mechanisms that can lead to premature failure in the field. In this episode of Chalk Talk, Amelia Dalton chats with Art Schaldenbrand of Cadence Design Systems about designing for reliability with Cadence’s Legato Reliability Solution.
Click here for more information about Cadence’s Legato Reliability Solution.
Scaling Up Vision and AI DSP Performance
For high-performance, low-power processing of AI and machine vision algorithms, latency can be critical. In this episode of Chalk Talk, Amelia Dalton chats with Pulin Desai from Cadence Design Systems about the using the new Vision Q6 processor core for embedded vision and AI applications.
Click here for more information about Vision DSPs for Imaging and Neural Networks.