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A New Crop of Wafer Inspection Tools
KLA-Tencor Announces Upgrades All Around
Nothing can ruin a die like a hunk of debris landing someplace inopportune.
Of course, it all depends on what constitutes “debris.” Not from a material standpoint – a chunk of anything that you didn’t put there on purpose is likely to be a problem – but rather from the point of view of size. Looked at in a Zen way, if a mote lands someplace in the middle of something bigger than itself without disturbing anything, does a production manager make any noise? Read More
Recent Product News
February 22, 2012
Energy Micro introduces first energy friendly ARM Cortex-M4 products
February 21, 2012
Molex Presents Global Distributor of the Year Award to Avnet Electronics Marketing
February 17, 2012
February 16, 2012
The Importance of Being Modular
Xilinx Rolls a Huge Wave of Kits
A Passive Magic Wand
The EPIC Sensor Hits the Market
Bridging the Gap
The Real World Meets Innovation At The Avnet Tech Games
Welcome to the beta version of EE Journal's new product section. When you start designing something awesome and need information on specific components, we want EEJournal to be your go-to resource. If you have an idea that would make this section more useful in your next design project, Let us know, and we'll get working on it.
On Demand
Hardware Accelerated H.264 Video Encoding using VAAPI on the Intel® Atom™ Processor E6xx Series
White Paper sponsored by Arrow
SoC FPGA Product Overview Advance Information Brief
Product Bulletin sponsored by Altera
Digital Predistortion for Base Station Power Amplifiers
Chalk Talk sponsored by Linear Technology
Balancing Power, Performance, and Cost with Arria V FPGAs
Smartphone and Tablet Accessory Design
Chalk Talk sponsored by Mouser
