a techfocus media publication

November 18, 2018


Privacy by Design

IoT and Challenges of Cybersecurity Today

by Amelia Dalton

Did you know that the United States is the world’s biggest target for cybersecurity attacks? According to Ponemon’s 2018 Cost of a Data Breach Study, 38% of the global cyber attacks were aimed at the United States. This study also found that the average time it takes to identify a data breach is 196 days. Yeah, let that just sink in for a second. So can we turn around this whole situation? In this week’s episode of Fish Fry, my guest Cynthia 

 Read More

The Radio Shack at the End of the Universe
Field Trip to the Last Radio Shack in (Near) Silicon Valley
by Steven Leibson
CPU Security Gets Hardcore
Dover’s CoreGuard Aims to Make Systems Hacker-Proof
by Jim Turley
Ye Olde FPGA Acceleration
Bittware/Nallatech Way Ahead of the Curve
by Kevin Morris
Watching AI Evolve
A Common Trajectory?
by Bryon Moyer

Articles Archive



Samtec, Inc.
Nov 16, 2018
If you aren'€™t from the packaging world, then chances are likely you might think '€œpacking'€ refers to objects being placed in to a box instead of packaging integrated circuits (IC'€™s) on a substrate. Packaging has advanced since it began, and as with many areas i...

More from Samtec, Inc....

EE Journal Editors Blog
Nov 14, 2018
  People of a certain age, who mindfully lived through the early microcomputer revolution during the first half of the 1970s, know about Bill Godbout. He was that guy who sent out crudely photocopied parts catalogs for all kinds of electronic components, sold from a Quon...

More from EE Journal Editors Blog...

EMA Design Automation
Nov 13, 2018
Podcast Interview with the authors of The Hitchhikers Guide to PCB Design eBook by Mike Beutow with PCB Chat....

More from EMA Design Automation...


Thousands of Swedes are inserting microchips under their skin

Sony can keep its plastic dog, this robotic raptor is the perfect pet

Jaguar Land Rover gives self-driving cars googly eyes to put pedestrians at ease

3D ‘microbatteries’ that could power ultra-low energy wearables

Here’s how 3D printing could help save us from trade wars

Engineers develop computerized camera without optics that uses an ordinary window as the lens

Body modded cyborg demonstrates how RFID and NFC Chips implanted in his hands allow him to live a key-free life

Where’s Waldo? This robot knows

What will quantum computer games really be like?

Rolling robots 3D print a bridge, inching their way along as they lay it



November 16, 2018

Maxim’s Wearable MAXREFDES101 Health Sensor Platform 2.0, Now at Mouser, Enables Advanced Health Monitoring

Hoffmann + Krippner Launches New Miniature P53 Ultrasonic Sensor

Xilinx Advances State-of-the-Art in Integrated and Adaptable Solutions for Aerospace and Defense with Introduction of 16nm Defense-Grade UltraScale+ Portfolio

Bosch provides customized IoT and Industry 4.0 solutions

DesignSpark Mechanical 3D CAD design software gets an upgrade from RS Components

Newark element14 Announces the Launch of the New Raspberry Pi 3 Model A+

RS Components announces significant extension of schematic and footprint parts library

November 15, 2018

USB Type-C/PD Controller IC Enables 3A Current Delivery

Mouser Partners with SamacSys to Offer Engineers Free PCB Footprints, Schematic Symbols and 3D Models

Wind River and CENGN Assist Open Source Developers in Accelerating StarlingX Adoption for Edge Computing Applications

Rugged Ethernet cable offers high-performance in harsh military, aerospace and marine environments

Adesto’s EcoXiP Supports New JEDEC Standards to Pave the Way for a New Era of Smart Devices and Edge Processing

New ams gas sensor module for kitchens enables automatic control of cooker hoods and ventilation fans

Imec demonstrates first secure passive keyless entry solution for automotive using Bluetooth Low Energy


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AutoSens: Automotive Sensor Design Enablement

Sponsored by Cadence Design Systems

Learn about the multiple design enablement tools and IP that can help you achieve smart automotive and lidar designs. Automotive demands are now driving a boom in image, lidar, and radar sensor design, driving design of silicon photonics, MEMS, uW/RF, advanced-node SoC, and advanced SiP. Smart, connected automotive sensors also demand IP for AI, DSP, and Ethernet. High-performance emulation of sensor SoCs enable early software development and accelerated entry into automotive markets. Watch now.

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Featured Paper


Why Choosing the Right Spring-Loaded Connector Saves Long-Term Cost and Reputations 

Sponsored by Mill-Max

Spring-loaded contacts possess unique features and properties that often contribute significantly to overall cost savings in a variety of design situations. They facilitate single-sided connections, require less space and reduce BOM cost. They also compensate for mechanical variances while reducing the need for precision alignment. When considering all the benefits that spring-loaded contacts provide it is obvious that they can be a significant cost and time saver in any electronic design.

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Shift Left for Fewer PCB Re-Spins

Sponsored by Mentor

Design rule checking (DRC) is becoming more important with today’s complex PCB designs. With the complexity of today’s designs, the old ad-hoc methods just don’t cut it. In this episode of Chalk Talk, Amelia Dalton chats with Rory Riggs from Mentor about how Hyperlynx DRC can help get your next design out on time without those pesky re-spins.

Click here for more information about HyperLynx Design Rule Checking (DRC)

Accelerating a Smart and Connected World — Intel and Mouser Electronics

  With the rapid pace of change in IoT designs these days, the flexibility, power efficiency, and low latency of FPGAs can be major advantages. In this episode of Chalk Talk, Amelia Dalton chats with Tom Schultz of Intel about applying FPGA technology to IoT systems. Click here for more information about Intel® FPGAs (formerly … Read More → "Accelerating a Smart and Connected World — Intel and Mouser Electronics"

A New Advanced IC Packaging Battlefield

  Today, advanced packaging technology has created a new battleground where 2.5D packaging and heterogeneous design drive constraints that span semiconductor, packaging, board, and even system-level design. In this episode of Chalk Talk, Amelia Dalton chats with John Park of Cadence Design Systems about new techniques and tools for advanced IC packaging design. Click here … Read More → "A New Advanced IC Packaging Battlefield"

Analog to Digital Converters: A Resolution Revolution — Maxim Integrated and Mouser Electronics

   Today’s IoT designs rely on massive amounts of data from a wide range of sensors. One thing most of these systems have in common is the need for high-resolution data converters that can operate on limited power budgets. In this episode of Chalk Talk, Amelia Dalton chats with David Andeen from Maxim Integrated … Read More → "Analog to Digital Converters: A Resolution Revolution — Maxim Integrated and Mouser Electronics"

Optoelectronics: SensorXplorer — Vishay and Mouser Electronics

   Many IoT designs require limited vision capabilities – without a full-blown camera interface. Edge devices may need to be able to see light, recognize colors or gestures, or sense presence. In this episode of Chalk Talk, Amelia Dalton chats with Samy Ahmed of Vishay about using optoelectronics to give enhanced capabilities to your … Read More → "Optoelectronics: SensorXplorer — Vishay and Mouser Electronics"

Introducing the SAML10 and SAML11 MCUs — Microchip and Mouser Electronics

   Security and power are key considerations in just about every IoT design these days. And, if you don’t start with a microcontroller that has robust security and power features, it can be an uphill battle. In this episode of Chalk Talk, Amelia Dalton chats with Ram Konreddy of Microchip Technology about the new … Read More → "Introducing the SAML10 and SAML11 MCUs — Microchip and Mouser Electronics"

Designing High-Reliability Analog and Mixed-Signal ICs for Mission-Critical Applications

  Designing products for reliability and longevity requires a different mindset – and a different tool set from the more common “just get it out the door” engineering methodology. We need to focus on all phases of product life, and do a diligent analysis of the mechanisms that can lead to premature failure in the … Read More → "Designing High-Reliability Analog and Mixed-Signal ICs for Mission-Critical Applications"

Ye Olde FPGA Acceleration
Bringing Bittware and Nallatech is a good move. They both have great respect for each other and they are more than 2x better together than apart. I just came back from the Supercomputer show in Dallas and there is a lot of FPGA activity. Many more people know what a ...

posted by Beercandyman on Nov 17 at 9:36am

Ye Olde FPGA Acceleration
Thanks for a very nice article Kevin. Glad to see that true editorial isn’t quite dead yet.

posted by acantle on Nov 14 at 4:57am

Ye Olde FPGA Acceleration
The lack of movement in the ability to compile code for heterogeneous computing isn't new, for me it goes back to Inmos in the 1980s. Here's my solution - http://parallel.cc Interestingly, Xilinx blew me off when I said I knew how to speed up the SystemC (C++) modeling ...

posted by Kev on Nov 13 at 9:06pm

Ye Olde FPGA Acceleration
Yes, Kevin, the programming model for FPGAs is a big hurdle. In fact, it's the focus of my startup. I've recently picked up a focus on cloud FPGAs and I'm building momentum for an open-source project to make them more accessible. This project (regardless of which is your favorite h/...

posted by Steve Hoover on Nov 13 at 11:33am

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