industry news
Subscribe Now

TSMC Recognizes Synopsys with Four Partner Awards at the Open Innovation Platform Forum Event

Synopsys Recognized for Collaboration on Interface IP, Joint Development of 5-nm Design Infrastructure, Joint Development of VDE Cloud Solution, and Joint Delivery of WoW Design Solution

MOUNTAIN VIEW, Calif., Oct 3, 2018 /PRNewswire/ —

Highlights:

  • TSMC selects Synopsys as its “Partner of the Year” for interface IP and tool enablement for 8th consecutive year
  • TSMC has certified Synopsys’ digital and custom implementation platforms and reference flows for the Synopsys Design Platform, including IC Compiler II place-and-route for 5-nm design infrastructure and WoW Design Solution
  • TSMC and Synopsys collaborate to develop and deliver VDE Cloud Solution
  • Synopsys’ portfolio of high-quality DesignWare® Interface IP has achieved close to 100 successful tapeouts in TSMC’s advanced FinFET processes from 16nm to 7nm

Synopsys, Inc. (Nasdaq: SNPS) today announced that TSMC has recognized Synopsys with four “2018 Partner of the Year” awards for Interface IP and joint development of 5-nanometer (nm) design infrastructure and Virtual Design Environment (VDE) Cloud Solution, plus joint delivery of the Wafer-on-Wafer (WoW) Design Solution. Synopsys and TSMC have collaborated for more than 18 years, most recently to accelerate the adoption of FinFET technology for optimum power, performance, and area for the 5-nm process. This is the eighth consecutive year Synopsys has received both IP and electronic design automation (EDA) accolades from TSMC.

“We are honored to receive these prestigious awards from TSMC,” said Dr. Michael Jackson, corporate vice president of Synopsys’ Design Group. “Through this kind of deep engineering collaboration with TSMC on its 5-nanometer processes, WoW Design Solution, VDE Cloud Solution, and interface IP, we have enabled a state-of-the-art design platform and IP portfolio in a proven path that designers can take to accelerate their time-to-market goals.”

“We have presented the 2018 Partner of the Year award to Synopsys in recognition of our collaboration to deliver important innovations in the field of semiconductor design,” said Suk Lee, senior director of TSMC’s Design Infrastructure Marketing Division. “With its extensive high-quality DesignWare IP portfolio, certified Design Platform, and Cloud Solution, Synopsys and TSMC are addressing our customers’ needs to achieve their design goals and accelerate production.”

About Synopsys

Synopsys, Inc. (Nasdaq: SNPS) is the Silicon to Software partner for innovative companies developing the electronic products and software applications we rely on every day. As the world’s 15th largest software company, Synopsys has a long history of being a global leader in electronic design automation (EDA) and semiconductor IP, and is also growing its leadership in software security and quality solutions. Whether you’re a system-on-chip (SoC) designer creating advanced semiconductors, or a software developer writing applications that require the highest security and quality, Synopsys has the solutions needed to deliver innovative, high-quality, secure products. Learn more at www.synopsys.com/.

Leave a Reply

featured blogs
Apr 19, 2024
Data type conversion is a crucial aspect of programming that helps you handle data across different data types seamlessly. The SKILL language supports several data types, including integer and floating-point numbers, character strings, arrays, and a highly flexible linked lis...
Apr 18, 2024
Are you ready for a revolution in robotic technology (as opposed to a robotic revolution, of course)?...
Apr 18, 2024
See how Cisco accelerates library characterization and chip design with our cloud EDA tools, scaling access to SoC validation solutions and compute services.The post Cisco Accelerates Project Schedule by 66% Using Synopsys Cloud appeared first on Chip Design....

featured video

MaxLinear Integrates Analog & Digital Design in One Chip with Cadence 3D Solvers

Sponsored by Cadence Design Systems

MaxLinear has the unique capability of integrating analog and digital design on the same chip. Because of this, the team developed some interesting technology in the communication space. In the optical infrastructure domain, they created the first fully integrated 5nm CMOS PAM4 DSP. All their products solve critical communication and high-frequency analysis challenges.

Learn more about how MaxLinear is using Cadence’s Clarity 3D Solver and EMX Planar 3D Solver in their design process.

featured chalk talk

Accessing AWS IoT Services Securely over LTE-M
Developing a connected IoT design from scratch can be a complicated endeavor. In this episode of Chalk Talk, Amelia Dalton, Harald Kröll from u-blox, Lucio Di Jasio from AWS, and Rob Reynolds from SparkFun Electronics examine the details of the AWS IoT ExpressLink SARA-R5 starter kit. They explore the common IoT development design challenges that AWS IoT ExpressLink SARA-R5 starter kit is looking to solve and how you can get started using this kit in your next connected IoT design.
Oct 26, 2023
22,862 views