industry news
Subscribe Now

RS Components augments portfolio of powerful processing solutions with FPGA and SoC modules from Trenz Electronic

Easy-to-use development boards and modules target industrial and educational applications

LONDON, UK, 6 November, 2018 – RS Components (RS), the trading brand of Electrocomponents plc (LSE:ECM), a global multi-channel distributor, has added a new portfolio of advanced modules based on FPGAs and system-on-chip (SoC) ICs from Trenz Electronic, a leading developer and manufacturer of module-based solutions for the industrial and science market sectors.

The ability of FPGAs and other powerful semiconductor devices to perform efficient processing in parallel is becoming very important to meet the demands of applications that are gathering and storing increasing amounts of data – and these are rapidly mounting in number with trends such as the internet of things. RS has therefore added the Trenz line of easy-to-use development boards and system-on-a-module solutions (SoMs) to help educate engineers and researchers working in industry or academia and get them up and running in a relatively short timeframe.

Targeting use in a range of industrial applications, in addition to many scientific research areas, the Trenz modules are suitable for embedded vision, industrial cameras for monitoring and control, medical instruments, AFM (atomic force microscopy), and ASIC-emulation applications, among many others.

Initial products in the Trenz range available from RS include a series of Xilinx FPGA-based boards, such as a Kintex-7 FPGA module with multi-Gigabit transceivers, an Artix-7 35T FPGA module with dual 100-Mbit Ethernet transceivers, and an Artix-7 based module offering 32MB of Quad SPI Flash memory and a large number of configurable I/Os.

These boards will also shortly be joined by a range of Xilinx Zynq SoC modules and starter kits, including: the ZynqBerry FPGA module, which comes in the Raspberry Pi form-factor and is based on the Zynq-7010 SoC; and the UltraSOM+ module, which integrates the powerful Zynq UltraScale+ MPSoC.

“As a long-term customer of RS, we were very satisfied with its customer liaison and support, as well as its large selection of in-stock components and short-delivery times,” said Thorsten Trenz, CEO at Trenz Electronic. “Now, with RS as a distributor of our products, we are confident our customers will benefit as we did.”

“We are thrilled to be working with Trenz Electronic to offer our customers FPGA support and development in their designs,” added Adrian Gurr, RS’ Global Product Group Manager for Semiconductors. “As FPGAs become more complex, these Trenz system-on-chip modules provide easy-to-use components that enable fast integration into customers’ systems.”

The Trenz FPGA and SoC modules are now in stock at RS for businesses and educational establishments in the EMEA and Asia Pacific regions.

About RS Components
RS Components, Allied Electronics & Automation and IESA are the trading brands of Electrocomponents plc, a global multi-channel distributor. We offer more than 500,000 industrial and electronics products, sourced from over 2,500 leading suppliers, and provide a wide range of value-added services to over one million customers. With operations in 32 countries, we ship more than 50,000 parcels a day.

Electrocomponents is listed on the London Stock Exchange and in the last financial year ended 31 March 2018 had revenues of £1.71bn.

For more information, please visit the website at www.rs-online.com.

Leave a Reply

featured blogs
Apr 19, 2024
In today's rapidly evolving digital landscape, staying at the cutting edge is crucial to success. For MaxLinear, bridging the gap between firmware and hardware development has been pivotal. All of the company's products solve critical communication and high-frequency analysis...
Apr 18, 2024
Are you ready for a revolution in robotic technology (as opposed to a robotic revolution, of course)?...
Apr 18, 2024
See how Cisco accelerates library characterization and chip design with our cloud EDA tools, scaling access to SoC validation solutions and compute services.The post Cisco Accelerates Project Schedule by 66% Using Synopsys Cloud appeared first on Chip Design....

featured video

MaxLinear Integrates Analog & Digital Design in One Chip with Cadence 3D Solvers

Sponsored by Cadence Design Systems

MaxLinear has the unique capability of integrating analog and digital design on the same chip. Because of this, the team developed some interesting technology in the communication space. In the optical infrastructure domain, they created the first fully integrated 5nm CMOS PAM4 DSP. All their products solve critical communication and high-frequency analysis challenges.

Learn more about how MaxLinear is using Cadence’s Clarity 3D Solver and EMX Planar 3D Solver in their design process.

featured chalk talk

Electromagnetic Compatibility (EMC) Gasket Design Considerations
Electromagnetic interference can cause a variety of costly issues and can be avoided with a robust EMI shielding solution. In this episode of Chalk Talk, Amelia Dalton chats with Sam Robinson from TE Connectivity about the role that EMC gaskets play in EMI shielding, how compression can affect EMI shielding, and how TE Connectivity can help you solve your EMI shielding needs in your next design.
Aug 30, 2023
28,241 views