industry news
Subscribe Now

PRO DESIGN Expands Prototyping Portfolio with ultra-fast proFPGA Virtex® UltraScale+™ based FPGA Modules

Austin, 19 June 2017 – PRO DESIGN, veteran in the EMS and EDA industry, today releases three new high-speed FPGA modules for its successful and innovative proFPGA product family of FPGA based prototyping solutions at the Design Automation Conference (DAC) in Austin, Texas.

The proFPGA product series are the most modular, flexible and scalable systems on the market based on latest Xilinx Virtex® UltraScale™, UltraScale+™ and Intel® Stratix®10 FPGA technologies. It addresses customers who need a most efficient and high-performance FPGA based prototyping solution for ASIC and IP prototyping, real time system integration and pre-silicon software development to reduce the time to market.

With the proFPGA XCVU9P, XCVU7P and XCVU5P UltraScale+™ FPGA modules PRO DESIGN has added further three products to the existing proFPGA product portfolio. The very elaborate boards are optimized and trimmed to ensure best signal integrity and where designed and produced with special high-end PCB material to reach highest performance and signal rating. In combination with the dedicated high-speed connectors a maximum point to point speed of up to 1 Gbps single ended over the standard FPGA IOs and up to 23 Gbps over the high-speed transceiver IOs can be achieved.

The new FPGA modules can be easily assembled on the proFPGA motherboards and mixed with the existing proFPGA FPGA modules and are fully compatible with all proFPGA accessories like interface boards and interconnection cables.

The new FPGA modules offer with its 6 extension sites, 585 free accessible user IOs and an ASIC equivalent capacity from 7.1 up to 14 million gates. The highlight and distinguishing feature of these FPGA modules is the availability and performance of the 64 high speed transceivers (GTY) which allow to run stable with a superb performance of up to of 23 Gb/s data transfer rate allowing to verify and test high speed interfaces like PCIe Gen4.

Availability

The proFPGA XCVU9P, XCVU7P and XCVU5P FPGA Modules are available since June 2017.

Demonstration

PRO DESIGN will demonstrate the proFPGA UltraScale+™ based FPGA Modules in Austin, Texas at booth #1632 at the DAC, from June 19 to June 21, 2017.

About proFPGA

The proFPGA product family is a complete, scalable, and modular multi-FPGA prototyping solution, which fulfills the highest needs in the areas of ASIC and IP Prototyping and pre-silicon software development. The proFPGA product series consists of different types of motherboards, various Xilinx Virtex® UltraScale™, UltraScale+™, Virtex® 7, Kintex® Zynq™, and Intel® Stratix®-FPGA modules, a set of interconnection boards/cables and a large range of daughter boards like DDR3/4 memory boards or high-speed interface boards (PCIe Gen1/2/3/4, USB 3.0, Gigabit Ethernet, SATA, DVI, etc.). It addresses customers who need a scalable and flexible high-performance FPGA-based prototyping solution for early software development and for IP/ASIC verification. The innovative system concept and technology offers best-in-class reusability across projects, guaranteeing the best return on investment.

About PRO DESIGN

The privately-held company was founded in 1982 and has 100 employees, with various facilities in Germany, France, and the US. PRO DESIGN has more than 34 years of experience in the EDA market, and as a provider in the E²MS market. PRO DESIGN has built extensive knowledge in the areas of FPGA board development, electronic engineering, FPGA design, high performance PCB design, construction, production, assembly and testing.

For more information, please visit: http://www.proFPGA.com

Leave a Reply

featured blogs
Apr 18, 2024
Are you ready for a revolution in robotic technology (as opposed to a robotic revolution, of course)?...
Apr 18, 2024
See how Cisco accelerates library characterization and chip design with our cloud EDA tools, scaling access to SoC validation solutions and compute services.The post Cisco Accelerates Project Schedule by 66% Using Synopsys Cloud appeared first on Chip Design....
Apr 18, 2024
Analog Behavioral Modeling involves creating models that mimic a desired external circuit behavior at a block level rather than simply reproducing individual transistor characteristics. One of the significant benefits of using models is that they reduce the simulation time. V...

featured video

MaxLinear Integrates Analog & Digital Design in One Chip with Cadence 3D Solvers

Sponsored by Cadence Design Systems

MaxLinear has the unique capability of integrating analog and digital design on the same chip. Because of this, the team developed some interesting technology in the communication space. In the optical infrastructure domain, they created the first fully integrated 5nm CMOS PAM4 DSP. All their products solve critical communication and high-frequency analysis challenges.

Learn more about how MaxLinear is using Cadence’s Clarity 3D Solver and EMX Planar 3D Solver in their design process.

featured chalk talk

FleClear: TDK’s Transparent Conductive Ag Film
Sponsored by Mouser Electronics and TDK
In this episode of Chalk Talk, Amelia Dalton and Chris Burket from TDK investigate the what, where, and how of TDK’s transparent conductive Ag film called FleClear. They examine the benefits that FleClear brings to the table when it comes to transparency, surface resistance and haze. They also chat about how FleClear compares to other similar solutions on the market today and how you can utilize FleClear in your next design.
Feb 7, 2024
10,050 views