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Huawei Brings World’s First Multi-Carrier eMTC Module ME309 to North America

PLANO, Texas, July 20, 2017 /PRNewswire/ — Huawei, a leading telecommunications solutions provider, today announced the availability of the LTE CAT M ME309-562 LGA module in North America in Q3 2017. Designed to provide 4G LTE connections specifically for Internet of Things (IoT), the new ME309-562 delivers exceptionally low power consumption and wide area coverage with low cost. The module supports enhanced Machine Type Communication (eMTC) and machine-to-machine (M2M) applications.

The ME309-562 is based on industry-leading IoT chipset supplier Sequans Monarch platform, providing customers with greater flexibility at a lower cost. The new … Read More → "Huawei Brings World’s First Multi-Carrier eMTC Module ME309 to North America"

Cadence Genus Synthesis Solution Enables Toshiba to Complete a Successful ASIC Tapeout with a 2X Logic Synthesis Runtime Improvement

SAN JOSE, Calif., July 20, 2017—Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced that Toshiba Electronic Devices & Storage Corporation used the Cadence® Genus™ Synthesis Solution to complete a successful ASIC design tapeout. The solution, used with the CPF-based low-power flow, enabled Toshiba to reduce logic synthesis runtime by 2X versus its previous logic synthesis solution. Toshiba also experienced a 5.7 percent leakage power reduction for a standard cell portion during a trial evaluation of the Genus Synthesis Solution’s physical optimization flow, which reduced low Vth cell usage while … Read More → "Cadence Genus Synthesis Solution Enables Toshiba to Complete a Successful ASIC Tapeout with a 2X Logic Synthesis Runtime Improvement"

Diving into MEMS, Sensors and Imaging Technologies for a Smart, Connected World at SEMI|MSIG European Summit

GRENOBLE, France ─ July 20, 2017 – STMicroelectronics CEO Carlo Bozotti will kick off SEMI® and MEMS & Sensors Industry Group®’s(MSIG) co-located European … Read More → "Diving into MEMS, Sensors and Imaging Technologies for a Smart, Connected World at SEMI|MSIG European Summit"

New Line of PCI Express Mini Cards for Easy and Flexible Digital I/O Expansion

July 18, 2017—SAN DIEGO, CA — ACCES I/O Products, Inc., is pleased to announce the release of a new family of mini PCI Express (mPCIe) digital I/O cards—the mPCIe-DIO Family with Digital Integration Features. These small, low-priced, PCI Express Mini cards feature a large selection of digital I/O functions for compact control and monitoring applications. Choose up to 24 channels offering various voltage, isolation, speed, and counter/timer options. Easily integrate additional I/O functions in systems without board modifications or customization. This highly flexible and efficient design provides system integrators numerous off-the-shelf I/O configurations for new … Read More → "New Line of PCI Express Mini Cards for Easy and Flexible Digital I/O Expansion"

ams launches smallest available XYZ tri-stimulus sensor for True Color consumer applications

Premstaetten, Austria (19 July, 2017) — ams (SIX: AMS), a leading worldwide supplier of high performance sensor solutions, today released the TCS3430, the first XYZ tri-stimulus True Color sensor IC to be offered with a small footprint suitable for consumer devices such as notebooks, smartphones and tablets.

Providing digital measurements of illuminance (brightness) and chromaticity matching the CIE 1931 “Standard Observer” XYZ scale enabling True Color functionalities – which is the industry standard for quantifying the average human’s perception of light – the miniature TCS3430 may be used for functions such as display management, automatic white color balancing … Read More → "ams launches smallest available XYZ tri-stimulus sensor for True Color consumer applications"

Sundance announces the SMT6657 – the highest performance PC/104 embedded processing module ever

  • Chosen for the SIS100 Proton Accelerator at the new Facility for Antiproton and Ion Research in Europe (FAIR)
  • Digital processing provided by on-board TI Keystone® DSP
  • Versatility, pre/post processing and I/O provided by on-board Xilinx Kintex® Ultrascale KU35 FPGA

Chesham, UK – July 19, 2017. Sundance Multiprocessor Technology Ltd., an established supplier and manufacturer of embedded modules, has announced the Read More → "Sundance announces the SMT6657 – the highest performance PC/104 embedded processing module ever"

STMicroelectronics’ ESD-Clamping Diodes in 0201 Package Bring Industry-Best Performance Protection to Tiny Smart Objects

New miniature (0201-size) single-line ESD-protection diodes from STMicroelectronics quickly clamp transients to a voltage as low as 7V, and handle 7A peak pulse current, to provide superior protection and design flexibility for space-constrained smart objects. This diode drops the bar with the lowest clamping voltage available at this level of capacitance and stand-off voltage.

The unidirectional ESDZL5-1F4 and bidirectional ESDZV5-1BF4 have a snap-back characteristic, with 5.8V trigger voltage and low dynamic resistance, to provide outstanding protection in a device measuring only 0.58mm x 0.28mm (typical). Also, with as little as 6pF capacitance, they … Read More → "STMicroelectronics’ ESD-Clamping Diodes in 0201 Package Bring Industry-Best Performance Protection to Tiny Smart Objects"

Cadence Functional Safety Verification Solution Adopted for ISO 26262-Compliant Automotive IC Development Flow at ROHM


SAN JOSE, Calif., July 19, 2017—Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced that the Cadence® Functional Safety Verification Solution was adopted by ROHM CO., Ltd. in its design flow for ISO 26262-compliant ICs and LSIs for the automotive market. The Cadence fault simulation technology and seamless reuse of functional and mixed-signal verification environments enables an ISO 26262-compliant development flow that can reduce the effort required to complete the safety verification process up to 50 percent. For more information about automotive solutions from Cadence, visit Read More → "Cadence Functional Safety Verification Solution Adopted for ISO 26262-Compliant Automotive IC Development Flow at ROHM
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BrainChip Launches New AI-powered Software that Accelerates Pattern Search and Facial Classification

Aliso Viejo, California – July 19th, 2017 BrainChip Holdings Ltd., (ASX: BRN) (“BrainChip” or “the Company”), a leading developer of software and hardware accelerated solutions for advanced artificial intelligence and machine learning applications, today announced the release of its new software product, BrainChip Studio.

BrainChip Studio is the result of more than 10 years development and uses an artificial intelligence technology called a spiking neural network, a type of neuromorphic computing that simulates the functionality of the human visual tract. Powered by this technology, BrainChip Studio aids law enforcement and intelligence organizations to rapidly search vast amounts of video footage … Read More → "BrainChip Launches New AI-powered Software that Accelerates Pattern Search and Facial Classification"

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