News – Page 1366 – EEJournal

Saelig Introduces All-In-One USB-Serial Controller

October 6, 2014

Fairport, NY, USA. Sept. 5, 2014: Saelig Company, Inc.(www.saelig.com) has introduced the Prolific PL2303RA, an all-in-one IC that provides a convenient, low-chip-count solution for connecting an RS232 full-duplex asynchronous serial device to any USB-capable host. This on-chip solution with its built-in charge-pump RS232 transceiver and widely compatible Virtual COM Port drivers, compact and low power serial devices can be made USB-ready easily.

The PL2303RA integrates a high baud rate RS-232 transceiver that meets the EIA/TIA-232F and CCITT V.28 communications interface specifications. The RS-232 transceiver is a three-transmitter/five-receiver design with a built-in … Read More → "Saelig Introduces All-In-One USB-Serial Controller"

Microchip Partners with LDRA for Functional Safety

October 6, 2014

Wirral, U.K. October 6?LDRA, the leader in standards compliance, automated software verification, source code analysis and test tools, has become a partner and trusted adviser toMicrochip Technology Inc., enabling customers to meet functional-safety requirements. Microchip, a leading provider of microcontroller, mixed-signal, analog, and Flash-IP solutions, recommends LDRA tools for applications that must comply with functional-safety standards, including Read More → "Microchip Partners with LDRA for Functional Safety"

Intersil Announces High Efficiency Buck-Boost and Boost+Bypass Switching Regulators for Smartphones and Tablets

October 6, 2014

MILPITAS, CALIF. – Oct. 6, 2014 – Intersil Corporation (NASDAQ: ISIL), a leading provider of innovative power management and precision analog solutions, today announced five new additions to the ISL911xx family of market leading buck-boost and boost switching regulators, optimized to support system power supplies and peripherals such as Wi-Fi or 3G/4G RF power amplifiers. Intersil’s proprietary four-switch buck-boost architecture extends battery life by enabling industry leading efficiency of up to 96% and providing smooth transitions from buck to boost to prevent glitches and noise in smartphones, tablets … Read More → "Intersil Announces High Efficiency Buck-Boost and Boost+Bypass Switching Regulators for Smartphones and Tablets"

New Cactus Semiconductor Medical Chip Eval Board Offers Lower Profile, Better Manufacturability

October 6, 2014

CHANDLER, Ariz. – Oct. 6, 2014 – Cactus Semiconductor™ has updated its microprocessor evaluation board for its application-specific standard product (ASSP) medical chip to provide new microcontroller unit (MCU) packaging for easier manufacturability, new inductors for a lower profile, and more. The EB1CSI021™ evaluation board is ideal for electronics engineers seeking to develop battery-powered neurostimulation medical applications.

The MCU for the EB1CSI021 now uses an ultra-fine pitch quad flat no-lead 28 pin UFQFPN28 package. It replaces a WLCSP package and the change improves manufacturability and simplifies reworking. The small 4x4mm MCU footprint and ultra-low power work well with the … Read More → "New Cactus Semiconductor Medical Chip Eval Board Offers Lower Profile, Better Manufacturability"

Elliptic Labs Launches First Multi Layer Interaction Making Mobile Devices More Intuitive to Use

October 6, 2014

San Francisco, CA and CEATEC, Japan – October 6, 2014 – Elliptic Labs, the leader in ultrasonic touchless gesturing for consumer electronic devices, today announced a market first; “Multi Layer Interaction.” It enables mobile devices to display different content depending on the location and distance a user’s hand is from a device. Visitors to CEATEC Japan, October 7-11 will have a chance to try out the technology live for the first time at the Murata booth #6K197. See video.

“The new Multi Layer Interaction brings users the latest advance in intuitive device interactions. Without touching the device, as your hand … Read More → "Elliptic Labs Launches First Multi Layer Interaction Making Mobile Devices More Intuitive to Use"

Pentek Doubles Down on Preconfigured A/D XMC Modules for Radar, Communications and Data Acquisition Applications

October 3, 2014

3 or 4 channel 200 MHz 16-bit A/D converter
Digital down converter (DDC), interpolation and beamforming IP
GateFlow Design Kit for Xilinx Virtex-7 FPGA custom IP development
Advanced GateXpress technology for FPGA reconfiguration across PCIe

UPPER SADDLE RIVER, NJ–SEPTEMBER 30, 2014–Pentek, Inc., today announced the newest members of its highly popular Onyx® family of high-speed data converter XMC FPGA modules: the 3-channel Onyx Model 71721 and the 4-channel Onyx Model 71761, 200 MHz 16-bit A/D XMC modules based on the high density Xilinx Virtex-7 … Read More → "Pentek Doubles Down on Preconfigured A/D XMC Modules for Radar, Communications and Data Acquisition Applications"

RFEL adds new Wideband DDC to its signal processing range

October 3, 2014

Newport, Isle of Wight, UK – 3rd October 2014 – RFEL has announced the latest addition to its range of award winning FPGA based signal processing solutions. The flexible Wideband Digital Down-Converter (Wideband DDC) IP core is designed to accept wideband digitised data at sample rates of up to 3.6GS/s, supporting first or second Nyquist bandwidths of up to 1.8GHz.

Signals with bandwidths as high as 180MHz can be down-converted to complex baseband (I/Q) from anywhere within the chosen input Nyquist band, within … Read More → "RFEL adds new Wideband DDC to its signal processing range"

ARM Achieves 50X Faster OS Boot-Up on Mali GPU Development using Cadence Palladium XP Platform with ARM Fast Models

October 3, 2014

SAN JOSE, Calif., October 1, 2014— Cadence Design Systems, Inc. (NASDAQ: CDNS), a leader in global electronic design innovation, today announced that ARM® utilized Cadence® Palladium® Hybrid technology and ARM Fast Models to achieve a 50X faster OS boot-up during the development of its ARM Mali™-T760 GPU.

Compared to the previous emulation only solution, this resulted in up to 10X speed-up of overall hardware-software testing. This increased speed reduced ARM’s time from OS boot-up to test from hours to minutes, improving turnaround time and system quality.

“Early hardware-software co-development is … Read More → "ARM Achieves 50X Faster OS Boot-Up on Mali GPU Development using Cadence Palladium XP Platform with ARM Fast Models"

Mobiles Hear Better in Loud Environments with Advanced MEMS Microphone from STMicroelectronics

October 3, 2014

Geneva, October 1, 2014 – The STMicroelectronics MP23AB02B MEMS microphone maintains ultra-low distortion at less than 10% up to very high external sound-pressure levels, enabling equipment such as smartphones and wearable devices to perform better when placing calls or recording audio in loud environments.

With acoustic overload level of 125dBSPL and signal-to-noise ratio of 64dBA, the 3.35mm x 2.5mm x 0.98mm microphone delivers market-leading performance for its minuscule size. The key is ST’s dedicated pre-amplifier design, which … Read More → "Mobiles Hear Better in Loud Environments with Advanced MEMS Microphone from STMicroelectronics"

Atmel Samples New Family of High-performance ARM Cortex-M7-based MCUs Enabling Next-Generation IoT, Industrial and Automotive Applications

October 3, 2014

Expanding the Atmel | SMART Portfolio, First Devices Run up to 300MHz and Include Up to 384kByte SRAM Configurable as Tightly Coupled Memory (TCM) or System Memory and Up to 2Mbyte On-chip Flash
Combination of Ethernet AVB and Media LB Peripherals with the Cortex-M7 DSP Extensions Make Them Ideal for Automotive Connectivity and Audio Applications

San Jose, Calif., October 2, 2014 – Today at ARM® TechCon 2014, Atmel Corporation ( … Read More → "Atmel Samples New Family of High-performance ARM Cortex-M7-based MCUs Enabling Next-Generation IoT, Industrial and Automotive Applications"

featured blogs

BoardSurfers: Training Insights: Design Effortlessly Using Structures in Allegro X

Apr 25, 2024

Structures in Allegro X layout editors let you create reusable building blocks for your PCBs, saving you time and ensuring consistency. What are Structures? Structures are pre-defined groups of design objects, such as vias, connecting lines (clines), and shapes. You can combi...