Phoenix, AZ – February 9, 2015Altium Limited, a global leader in Electronic Design Automation, Native 3D PCB design systems (Read More → "Altium Announces New PCB Design Tool for Integrated Solidworks Collaboration"
SAN JOSE, Calif., 09 Feb 2015 — Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced that the Cadence® Tensilica® Xtensa® processor has been designed as the core of the MegaChips frizz always-on sensor hub IC. MegaChips selected the Xtensa processor after completing a competitive benchmark that showed the Xtensa processor offered over 90 percent lower power consumption when used for pedestrian dead reckoning algorithms, which require Kalman filters.
For more information on the Xtensa processor, visit www.cadence.com/news/xtensa/megachips.
frizz is a next-generation always-on sensor hub chip designed for smartphones and Internet-of-Things (IoT) wearable devices. MegaChips took … Read More → "MegaChips Utilizes Cadence Tensilica Xtensa Processor in Ultra-Low Power Internet of Things Sensor Hub IC"
ARC Industry Forum, Orlando, Florida – Feb. 9, 2015
Icon Labs (www.iconlabs.com), a leading provider of embedded networking and security technology, today announced the integration of Icon Labs’ Floodgate security products with Mentor Graphics’ Nucleus® RTOS and Mentor Embedded Linux®. The integrated solution creates a secure platform for industrial automation and extends the Internet of Secure ThingsTM initiative into industrial control systems. This integrated solution is being jointly demonstrated at the ARC Industry Forum
Icon Labs’ Intern.et of Secure Things Initiative defines a … Read More → "Icon Labs and Mentor Embedded Demonstrate Security Platform for Industrial Automation"
MILPITAS, CALIF. – Feb. 9, 2015 – Intersil Corporation (NASDAQ: ISIL), a leading provider of innovative power management and precision analog solutions, today announced that 16 of its radiation-hardened ICs were onboard the Dec. 5, 2014 maiden voyage of NASA’s Orion spacecraft, also known as the uncrewed Exploration Flight Test 1. The Orion spacecraft is designed to go where no man has gone before, including astronauts exploring and collecting asteroid samples from a future planned robotic mission to redirect an asteroid to orbit the moon, and the long sought after manned mission to … Read More → "Intersil’s Rad-Hard ICs Blast off on Orion’s Flight Test"
Unterpremstaetten, Austria (February 9, 2015), ams AG (SIX: AMS), a leading provider of high performance analog ICs and sensors, today released the TCS3490, a color sensor for portable devices which is ideally suited for light source detection when operating under a wide range of light sources.
Providing accurate color and light intensity measurements, the TCS3490 enables designers of portable devices such as smartphones and tablets to implement more sophisticated display management and brightness control.
This integrated five-channel color sensor has extremely accurate measurements of the Correlated Color Temperature (CCT) of light. As sensors continue to proliferate in … Read More → "ams color sensor for mobile devices improves accuracy and offers new light source detection capability"
PITTSBURGH — (February 9, 2015) — MEMS Industry Group (MIG) speakers will explore the integral nature of MEMS/sensors to the Internet of Things/Everything (IoT/E) during MEMS Executive Congress® Europe, 9-10 March, 2015 in Copenhagen, Denmark.
The IHS Internet of Things Report 2014 forecasts a staggering 86 billion connected devices by 2024. According to MIG, these include consumer products, such as wearables and mobile handsets, as well as automobiles, smart home appliances, … Read More → "MEMS Executive Congress Europe speakers explore Internet of Things/Everything in automotive, consumer, industrial markets, 9-10, March in Copenhagen"
Irvine, CA – Pasternack, a leading manufacturer and supplier of RF, microwave and millimeter wave products, introduces a new family of in-stock high-rel electromechanical relay switches with designs that range from 2 to 10 million life cycles, making them uniquely qualified for applications including defense and commercial aviation, semiconductor manufacturing, communications, radar, SATCOM, test instrumentation, medical devices and many others.
Pasternack’s latest release of hi-rel RF switches consists of 42 unique designs which include 38 connectorized models as well as 4 surface-mount devices that boast a small footprint and lower cost than traditional connectorized packages. A unique patented design … Read More → "Pasternack Introduces New Families of High-Rel Electromechanical Relay Switches"
Tokyo, Japan. February 6, 2015 — eSOL, a leading developer of real-time embedded software solutions, today announced that they have launched the eSOL eMCOS SDK, a software development kit for many-core processors. The eMCOS SDK consists of the eSOL eMCOS many-core real-time operating system (RTOS), its integrated middleware components that offer network, file, and USB services, and the eSOL eMCOS IDE Plug-in development and analysis tools. Developers can immediately execute and evaluate their Linux and TRON software assets on a many-core processor, since eMCOS supports POSIX and T-Kernel APIs … Read More → "eSOL Launches eMCOS SDK for Many-core Processors"
Fairport, NY, USA: Saelig Company, Inc. (Saelig) (www.saelig.com) has introduced the APSIN26G – a new low-noise, ultra-fast-switching … Read More → "Saelig Debuts APSIN26G 26GHz RF Signal Generator"
LISLE, IL – February 5, 2015 – Molex Incorporated, one of the world’s leading electronic connector companies, has launched a new product family of MediSpec™ Non-magnetic RF (radio frequency) Contacts and Modules as an extension to its existing line ofRead More → "MediSpec™ Non-Magnetic RF Contacts and Modules Enhance the Quality and Accuracy of MRI and Other Medical Scans and Imaging"
