MOUNTAIN VIEW, Calif. — August 9, 2010 — Synopsys, Inc. (Nasdaq: SNPS), a world leader in software and IP for semiconductor design, verification and manufacturing, today announced that TSMC has successfully taped out a complex 28 nanometer (nm) Product Qualification Vehicle (PQV) test chip using Synopsys’ Galaxy(tm) Implementation Platform. Key features used to design the PQV test chip include 28nm design rule support for place-and-route, interconnect process modeling, IEEE 1801-2009 (UPF)-based hierarchical low power flow, power-aware design-for-test (DFT) and advanced signoff capabilities. Synopsys tools exercised by TSMC in the RTL-to-GDSII implementation and signoff flow for this test … Read More → "Synopsys Galaxy Implementation Platform used by TSMC for 28nm process"
Bristol, UK and Sunnyvale, Calif. – August 3rd, 2010–XMOS® today announces that its customers, Meridian, Intelligent Media Technologies and High Resolution Technologies, have lowered development costs, shortened time to market and increased design flexibility to produce more differentiated products by using XMOS event-driven processors™. XMOS programmable chips bring together the capabilities of processors, DSPs and FPGAs, to help design economical electronic products at exceptional speed.
“Embedded design and development … Read More → "XMOS Customers Build Better Products, Faster"
MOUNTAIN VIEW, Calif. August 4, 2010 — Synopsys, Inc. (Nasdaq: SNPS), a world leader in software and IP for semiconductor design, verification and manufacturing, and GLOBALFOUNDRIES, a leading provider of advanced semiconductor technology and manufacturing services, today announced an agreement to develop the Synopsys DesignWare®SuperSpeed USB (3.0), USB 2.0, HDMI 1.4 Tx and Rx, DDR3/2, PCI Express® 2.0 and 1.1, SATA 1.5/3 Gbps and 6 Gbps, and XAUI PHY IP for GLOBALFOUNDRIES’ 28 nanometer (nm) “Gate First” High-k Metal Gate (HKMG) process technologies. The collaboration will enable mutual customers to differentiate their 28nm designs with a high quality IP … Read More → "Collaboration enables faster time-to-volume for advanced high performance SoC designs"
Northwich, Cheshire, 2nd August 2010. Kane Computing Ltd (KCL) has signed up to the 3L Affiliate Programme to support the sales of the latest Version 4 3L Diamond Multiprocessor/Multicore Software Tools, that has been launched to coincide with the availability of the new Texas Instruments TMS320C6472 multicore DSP.
Diamond’s proven multiprocessor model now extends to multicore DSPs, bridging the conceptual gap between multi and single-core development. With Diamond, multicore DSPs are available as collections of several independent processors and implied connections between them. Diamond enables development to scale smoothly as cores per DSP and multicore DSPs … Read More → "Kane Computing supports 3L Diamond TI C6000 Multicore Tool Suite"
Virage Logic Continues to Broaden Semiconductor IP Offering with New Portfolio of SoC Infrastructure Solutions
TAIPEI, Taiwan, Jul 27, 2010 — SOC SUMMIT — Virage Logic Corporation (NASDAQ:VIRL), the semiconductor industry’s trusted IP partner, today announced the further broadening of its already extensive System-on-Chip (SoC) infrastructure IP portfolio with its new Integraproduct line. Based on the proven technology that Read More → "Virage Logic Continues to Broaden Semiconductor IP Offering with New Portfolio of SoC Infrastructure Solutions"
MOUNTAIN VIEW, Calif. – July 28, 2010 – Synopsys, Inc. (Nasdaq: SNPS), a world leader in software and IP for semiconductor design, verification and manufacturing, today announced the addition of the DesignWare(r) 96 dB Hi-Fi Audio IP in the 40 nanometer (nm) and 55nm process technologies to its broad portfolio of high quality audio IP solutions. Synopsys is the first IP provider to offer audio codecs, digital to analogue converters (DACs) and analogue to digital converters (ADCs) in these advanced processes. The DesignWare Audio IP portfolio offers performance levels from 80 dB to 103 dB and is available in more than 20 different process nodes, from 180 … Read More → "Synopsys first to deliver high performance audio IP in 40nm and 55nm process technologies"
MOUNTAIN VIEW, Calif, July 26. Synopsys, Inc. (Nasdaq: SNPS), a world leader in software and IP for semiconductor design, verification and manufacturing, today announced that Foveon Inc., a world innovator in the design and development of image sensors and image capture systems, has taped out its newest generation direct image sensor using Synopsys’ Galaxy Custom Designer® solution. The Foveon X3® direct image sensor, used in high end consumer cameras such as Sigma’s SD15 digital SLR camera, has over 14 million pixels and is implemented on a 180 nanometer (nm) CMOS die. Foveon chose Synopsys’ custom design solution … Read More → "Foveon switches to Galaxy Custom Designer solution to accelerate time to tapeout"
MOUNTAIN VIEW, Calif. July 13, 2010 – Synopsys, Inc. (Nasdaq: SNPS), a world leader in software and IP for semiconductor design, verification and manufacturing, today announced that SVTC Technologies, the leading commercialisation service provider for new, emerging silicon based technologies, has chosen Synopsys’ manufacturing tool suite to enable its customers to reduce time to market for a wide variety of innovative products using CMOS processes, MEMS, photovoltaics and other related nanotechnologies.
SVTC offers its customers access to facilities, equipment and services to perform the development, manufacturing and analytical activities required to bring new products to market. By pooling … Read More → "SVTC technologies selects Synopsys’ manufacturing tools to accelerate time to comercialisation"
MicroProbe Tackles Mobile Consumer IC Wafer Test Challenges With New MEMS-Based Multi-DUT, Ultra-Fine-Pitch Probe Card
SAN JOSE, CA–(Marketwire – July 12, 2010) – MicroProbe, Inc., a leading supplier of wafer test technology to the global semiconductor industry, today introduced the MEMS-based Mx-FinePitch (Mx-FP) product. This new class of probe card tackles the ultra-fine-pitch testing needs of leading-edge SoC and logic devices found in applications like digital cameras, set-top boxes and digital TVs. Built for multi-DUT (Devices under Test) testing in high-volume production environments, the product requires no probe positioning adjustments throughout its lifetime. It is highly customizable for diverse application needs, providing unmatched design flexibility for SoC feature integration. Chief advantages include … Read More → "MicroProbe Tackles Mobile Consumer IC Wafer Test Challenges With New MEMS-Based Multi-DUT, Ultra-Fine-Pitch Probe Card"
July 8th, Uppsala, Sweden – IAR Systems today announced that it has incorporated its newly developed power debug and analysis tools within IAR Embedded Workbench for ARM. Bucking the software industry’s trend of charging for new software features, IAR Systems has opted to include its innovative technology as standard.
The new tools provide the capability to correlate current sampling alongside program execution, allowing analysis of the software’s influence on power consumption and providing developers with the means to optimize source code to minimize power consumption.
“We are working with some of the largest suppliers … Read More → "IAR Systems incorporates power debugging as standard in IAR Embedded Workbench"