Indium Corporation’s Insight on Solder Preforms to Reduce Voiding in Bottom Termination Components
This brief video, which can be found at www.indium.com/blog/phil-zarrow, features Indium Corporation Technical Support Engineer Derrick Herron as he explains to SMT expert Phil Zarrow, President and Principal Consultant for ITM Consulting, how voiding can be consistently reduced to 12 percent with the use of solder preforms.
“Voiding can lead to hot spots in the component, which will eventually lead to a shortened life span,” Herron said. “By limiting voiding, heat is transferred more efficiently into the PCB and away from … Read More → "Indium Corporation’s Insight on Solder Preforms to Reduce Voiding in Bottom Termination Components"