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VIAEden X2 Unveiled at Embedded Word 2011, World’s Most Power-Efficient Dual Core Processor

Taipei, Taiwan, March 1, 2011 – VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced the new VIA Eden X2 processor, the industry’s lowest power dual-core processor, optimized for fanless implementation in a broad range of industrial and commercial embedded systems. VIA Eden X2 will debut at Embedded World 2011, Nuremberg, Hall 12, Booth No. 574

VIA Eden X2 processors combine VIA’s signature ‘Eden’ fanless design principles, in a highly optimized, power-efficient dual-core architecture. This guarantees rock-solid stability for mission critical embedded systems without compromising on performance or features.  Read More → "VIAEden X2 Unveiled at Embedded Word 2011, World’s Most Power-Efficient Dual Core Processor"

Green Hills Software Announces INTEGRITY Support for Power Architecture VLE

NUREMBERG, GERMANY and SANTA BARBARA, CA — March 1, 2011 — Embedded World — Green Hills Software, the largest independent vendor of embedded software solutions, today announced that its INTEGRITY® real-time operating system has been optimized for the Power Architecture® Variable Length Encoded (VLE) Instruction Architecture, available in Freescale Qorivva™ Power Architecture automotive microcontrollers such as the MPC55xx and MPC56xx families. The VLE optimizations enable the INTEGRITY RTOS to achieve a minimum flash footprint of approximately 50 KB while providing total reliability, safety, and security through memory protection and virtual memory for all application and system processes.Read More → "Green Hills Software Announces INTEGRITY Support for Power Architecture VLE"

congatec Presents a New COM Express Compact Module Based on Intel® Atom™ E6xx Processor Series

Nuremberg, Embedded World, March 2, 2011 * * * congatec AG, a leading manufacturer of embedded computer modules, introduces the conga-CA6 module, which is based on the new Intel® Atom™ E6xx processor series and the Intel® Platform Controller Hub EG20 for COM Express Type 2. All components of this embedded design are specified for the industrial temperature range of -40 to +85°C, making the conga-CA6 an ideal solution for extreme applications.

With a power consumption of less than 5 Watts and a compact size of 95 x 95 mm, the new computer-on-modules are an excellent fit for applications in … Read More → "congatec Presents a New COM Express Compact Module Based on Intel® Atom™ E6xx Processor Series"

Synopsys Announces Availability of HAPS-600 High Capacity FPGA-Based Prototyping Solution

MOUNTAIN VIEW, Calif., March 1, 2011 — Synopsys, Inc. (Nasdaq: SNPS), a world leader in software and IP for semiconductor design, verification and manufacturing, today announced the availability of the HAPS®-600 series, the highest capacity extension of the HAPS family of FPGA-based prototyping systems. The HAPS-600 series extends FPGA-based prototyping capacity up to 81 million ASIC gates equivalent, enabling early software development for larger SoC projects. Like the HAPS-60 products, the HAPS-600series is based … Read More → "Synopsys Announces Availability of HAPS-600 High Capacity FPGA-Based Prototyping Solution"

LDRA Tools Integrate IEC 61508 Compliance across the Software Lifecycle

Wirral, UK, 1 March 2011. LDRA, the leading provider of automated software verification, source code analysis, and test tools, launches support for the IEC 61508 and IEC 61508:2010 standards, functional safety standards for electrical/electronic/programmable electronic (E/E/PE) systems, from requirements through design, code, analysis and certification. As a broad … Read More → "LDRA Tools Integrate IEC 61508 Compliance across the Software Lifecycle"

Agilent Technologies’ Advanced Design System 2011 EDA Platform to Debut via YouTube and Webcast

SANTA CLARA, Calif., Feb. 22, 2011 – Agilent Technologies Inc. (NYSE:A) today announced the latest version of its flagship RF and microwave design and simulation platform, Advanced Design System 2011. The new platform will debut on YouTube and in an “Innovations in EDA” webcast with Microwave Journal, scheduled for March 1.

Advanced Design System 2011 delivers exciting new features for new and existing Advanced Design System users, including electromagnetic technologies for faster, more accurate simulations; a new use model that makes electromagnetic simulation … Read More → "Agilent Technologies’ Advanced Design System 2011 EDA Platform to Debut via YouTube and Webcast"

Synopsys Introduces Proteus LRC for Lithography Verification

SAN JOSE, Calif., March 1, 2011 – SPIE Advanced Lithography—Synopsys, Inc. (Nasdaq: SNPS), a world leader in software and IP for semiconductor design, verification and manufacturing, today introduced Proteus LRC for lithography verification. Proteus LRC provides comprehensive, process-window-aware checking features to identify locations in a design that are sensitive to process variations, thereby enabling corrective action to be taken prior to committing a design to manufacture. Proteus LRC is integrated into the Proteus Mask Synthesis flow and is targeted for use by OPC and mask data preparation groups at semiconductor manufacturers like Micron Technology, Inc.

Read More → "Synopsys Introduces Proteus LRC for Lithography Verification"

MOST(R) Forum 2011: MOST Cooperation Demonstrates Readiness to Meet Future Demands

Karlsruhe (Germany) February 28, 2011 – The MOST Cooperation will again participate in the upcoming MOST Forum on April 5, 2011, in Frankfurt (Germany). In the exhibition area, the standardization organization for the leading automotive multimedia network, Media Oriented Systems Transport (MOST), will present new technology highlights based on its latest generation – MOST150 – which meets tomorrow’s multimedia and information network needs in the car. At present, MOST150 is heading towards implementation. “Our newest MOST generation is about to hit the road and we are proud that our core partner members Audi and Daimler will be the first carmakers to integrate MOST150 into series … Read More → "MOST(R) Forum 2011: MOST Cooperation Demonstrates Readiness to Meet Future Demands"

Magma’s Titan and FineSim Validated for LFoundry Interoperable Process Design Kits (iPDKs), Accelerating Turnaround Time for Analog/Mixed-Signal SoCs

February 28th 2011 – SAN JOSE, Calif. and LANDSHUT, Germany, Feb. 28, 2011 – Magma® Design Automation (Nasdaq: LAVA), a provider of chip design software, and LFoundry, the customer-specific manufacturer of choice for analog, mixed-signal and specialized technologies, today announced the LFoundry’s interoperable process design kits (iPDKs) are validated for use with the Titan™ Mixed-Signal Design Platform, Titan Acclerators and FineSim™ circuit simulator for 0.15-micron technology platforms. The combination of Magma’s Titan and FineSim software and LFoundry’s process technology will accelerate development of analog/mixed-signal (AMS) products, especially for European system-on-chip (SoC) developers.

< … Read More → "Magma’s Titan and FineSim Validated for LFoundry Interoperable Process Design Kits (iPDKs), Accelerating Turnaround Time for Analog/Mixed-Signal SoCs"
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