News – Page 1156 – EEJournal

Bosch Sensortec launches vital sensor hubs for wearables at Mobile World Congress 2016

February 22, 2016

Programmable platform for vital sensing, sensor fusion and always-on sensor processing
Ultra-low power consumption for maximum system battery life
Vital analytics software from Firstbeat for enhanced user experience

Today, at the 2016 Mobile World Congress, Bosch Sensortec introduces its first generation of sensor hub products with optimized vital sensing features. These devices fuse photoplethysmography (PPG) signals with the onboard inertial MEMS sensors signals for robust, motion compensated heart rate measurement and provide users with valuable insights about their wellbeing and fitness level using Firstbeat’s field-proven vital analytics algorithms.

Secure Microcontrollers from STMicroelectronics Bring Advanced Cyber Safety to Connected Cars

February 22, 2016

Geneva, February 22, 2016 – The 150-250 million connected cars expected on our roads by 2020 will be kept safe by chips like the latest secure microcontrollers from STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications.

Internet connectivity will bring a multitude of services to vehicles and their owners, such as software updates, service packs, location-based information, social media, streaming entertainment content, and emergency support. This clearly brings forth the need to protect connected cars against Internet-based attacks that can steal personal data or compromise important vehicle systems.

ST’s new secure … Read More → "Secure Microcontrollers from STMicroelectronics Bring Advanced Cyber Safety to Connected Cars"

Cadence Announces the HiFi Integrator Studio

February 22, 2016

SAN JOSE, Calif., 22 Feb 2016

Highlights:

Innovative new technology provides audio framework for HiFi DSP processors
Leverages over 175 existing optimized application software packages
First integration of hardware with the Android Studio development platform

Cadence Design Systems, Inc. (NASDAQ: CDNS), today announced the Cadence® HiFi Integrator Studio, an audio software framework that provides OEMs and application developers faster time to market when integrating Tensilica® HiFi … Read More → "Cadence Announces the HiFi Integrator Studio"

18-Bit, 8-Channel Multiplexed SAR ADC with Independently Configurable Input Ranges

February 22, 2016

MILPITAS, CA – February 22, 2016 – Linear Technology Corporation introduces the LTC2335-18, an 18-bit, 8-channel 1Msps multiplexed input successive approximation register (SAR) ADC with independently configurable input ranges. Each SoftSpan^™ input can be software configured on a conversion-by-conversion basis to accept ±10.24V, 0V to 10.24V, ±5.12V or 0V to 5.12V true bipolar input signals. The on-chip sequencer allows the LTC2335-18 … Read More → "18-Bit, 8-Channel Multiplexed SAR ADC with Independently Configurable Input Ranges"

Renesas Electronics Europe and emtrion Introduce New emCON-RZ/G1E System-On-Module Board for Quick and Easy Evaluation and Production of High-End Industrial Applications

February 19, 2016

Düsseldorf, February 18, 2016 – Renesas Electronics Europe, a premier provider of advanced semiconductor solutions, and emtrion, a company that assists customers during all stages of the development process and integration, today announced the availability of the new emCON-RZ/G1E System-On-Module (SOM) board. The new board is designed for the quick and easy evaluation and production of high-end industrial applications using RZ/G Series of microprocessors (MPUs) from Renesas.

The RZ/G Series extends Renesas’ already very popular family … Read More → "Renesas Electronics Europe and emtrion Introduce New emCON-RZ/G1E System-On-Module Board for Quick and Easy Evaluation and Production of High-End Industrial Applications"

XJTAG® Announces Free DFT Extension for Altium Designer®

February 19, 2016

Key Points:
     New easy to use Design For Test (DFT) tool for Altium Designer
     Free extension available to all Altium Designer users
     Avoid costly re-spins by catching errors at the design stage
     Find errors in a boundary scan chain before producing any hardware
     Harness the full power of boundary scan to improve testability

Cambridge, England, February 18th, 2016 – XJTAG®, a world leading supplier of boundary scan technology, will officially launch the XJTAG DFT Assistant for Altium Designer® at Embedded … Read More → "XJTAG® Announces Free DFT Extension for Altium Designer®"

Fairview Microwave Announces New Lines of Semi-Rigid Test Probes

February 19, 2016

Allen, TX – Fairview Microwave Inc., a supplier of on-demand microwave and RF components, debuts a new family of semi-rigid test probes operating up to 6 GHz. Designed to assist in testing microwave circuits, these test probes are constructed of high quality semi-rigid coax and SMA Female connectors.

The new test probe assemblies from Fairview Microwave come in multiple cable diameters to help when attaching the unterminated end of the probe to a circuit board trace. There are two versions including straight-cut probe ends for those that would like to customize the dimensions of the center … Read More → "Fairview Microwave Announces New Lines of Semi-Rigid Test Probes"

Telit Application Development Environment uses the IoT Module to Run Customer Apps

February 19, 2016

London, February 17, 2016 – Telit , a global enabler of the Internet of Things (IoT), today announced a new generation of the Telit IoT AppZone application development environment (ADE), to include the widely supported Android open source framework. The new ADE will expand from the well-established AppZone C and Python base to deliver the power and ease of use of Android. The newly added framework from Google is becoming increasingly popular with developer communities in a wide range of IoT vertical … Read More → "Telit Application Development Environment uses the IoT Module to Run Customer Apps"

Imec and Vrije Universiteit Brussel Present Breakthrough Towards Compact SAW-less Transmitter for 3G, 4G and Beyond

February 19, 2016

Leuven, Belgium – Feb. 22, 2016 – World-leading nanoelectronics research center imec and Vrije Universiteit Brussel (VUB) have demonstrated a 0.22mm2 CMOS resistive charge-based direct launch digital transmitter with -159dBc/Hz out-of-band noise. The achievement paves the way to small form-factor SAW-less transmitter implementations enabling advanced wireless communication systems including all the cellular standards 3G, 4G and future 5G.

Analog transmitters are less suitable for integration in advanced CMOS nodes. Digital transmitters are more compact and more robust to transistor imperfections and mismatches compared to … Read More → "Imec and Vrije Universiteit Brussel Present Breakthrough Towards Compact SAW-less Transmitter for 3G, 4G and Beyond"

IAR Systems invites visitors of embedded world 2016 to seminars on building a smarter world

February 19, 2016

Uppsala, Sweden—February 19, 2016—IAR Systems®, the world’s leading vendor of development tools for embedded systems, is happy to invite visitors of embedded world 2016 to a series of seminars focused on building a smarter world, while ensuring deliverability and efficient workflows.

The seminars take place in the IAR Connect™ booth 4-102 on Tuesday, February 23 and Wednesday February 24. Visitors have the opportunity to meet leading industry profiles up-close and personal, and hear their views on the future of … Read More → "IAR Systems invites visitors of embedded world 2016 to seminars on building a smarter world"

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