Imec reveals impact of DSA process variations on electrical performance of DSA-formed vias.
Leuven (Belgium) Feb 24, 2016 – Today, at SPIE Advanced Lithography Conference (San Jose, Feb 21-25), world-leading nanoelectronics research center imec will present electrical results of DSA (directed self-assembly)-formed vias, gaining insight in the impact of DSA processing variations on electrical readout. The results accelerate learning towards implementation of DSA for via patterning at the N7 technology node and beyond.
DSA processes with cylinder-forming block copolymers (BCP) have gained attention for contact hole shrink applications with improved contact hole roughness, and for their potential to increase the contact hole density that is obtained with optical lithography. … Read More → "Imec reveals impact of DSA process variations on electrical performance of DSA-formed vias."