industry news
Subscribe Now

New OpenVPX Development Platform from Pixus Features Mix of Conduction and Air Cooled Card Guides

Waterloo, Ontario  —  Mar 20, 2018 –  Pixus Technologies, a provider of embedded computing and enclosure solutions,  offers OpenVPX platforms with a mix of card guides that allow IEEE 1101.10 air cooled and IEEE 1101.2 conduction cooled boards to be tested in the same enclosure.  

The Pixus OpenVPX Development Chassis allows the use of Rear Transition Modules (RTMs) and up to 8 backplane slots at a 1” pitch.  The open frame design provides a convenient approach to attach probes and easily access the plug-in boards.  Pixus offers various slot sizes and profiles of 3U and 6U OpenVPX backplanes compliant to the VITA 65 specification.   A modular power supply allows various modules for +3.3V, +5V, +/- 12V, auxiliary voltages, and other options to be assembled for the ideal power output for each configuration. 

Specialists in OpenVPX, Pixus has developed specialty card guides, threaded inserts, and front/filler panels for the 1/2 HP offset spacing of the architecture.  This allows a precision fit and perfect alignment.  The company has also developed an ultra-rugged rail to handle the high insertion forces of 6U OpenVPX designs.  The rail prevents bowing or cracking. 

Pixus offers OpenVPX chassis in 19” rackmount, development/desktop, Air Transport Rack (ATR), and ruggedized versions.  The company also provides components, chassis platforms, and modular instrumentation cases in various form factors.  

 About Pixus Technologies

Leveraging over 25 years of innovative standard products, the Pixus team is comprised of industry experts in electronics packaging. Founded in 2009 by senior management from Kaparel Corporation, a Rittal company, Pixus Technologies’ embedded backplanes and systems are focused primarily on  ATCA, OpenVPX, MicroTCA, and custom designs.    Pixus also has an extensive offering of VME-based and cPCI-based solutions.   In May 2011, Pixus Technologies became the sole authorized North and South American supplier of the electronic packaging products previously offered by Kaparel Corporation and Rittal.  

Leave a Reply

featured blogs
Mar 28, 2024
The difference between Olympic glory and missing out on the podium is often measured in mere fractions of a second, highlighting the pivotal role of timing in sports. But what's the chronometric secret to those photo finishes and record-breaking feats? In this comprehens...
Mar 26, 2024
Learn how GPU acceleration impacts digital chip design implementation, expanding beyond chip simulation to fulfill compute demands of the RTL-to-GDSII process.The post Can GPUs Accelerate Digital Design Implementation? appeared first on Chip Design....
Mar 21, 2024
The awesome thing about these machines is that you are limited only by your imagination, and I've got a GREAT imagination....

featured video

We are Altera. We are for the innovators.

Sponsored by Intel

Today we embark on an exciting journey as we transition to Altera, an Intel Company. In a world of endless opportunities and challenges, we are here to provide the flexibility needed by our ecosystem of customers and partners to pioneer and accelerate innovation. As we leap into the future, we are committed to providing easy-to-design and deploy leadership programmable solutions to innovators to unlock extraordinary possibilities for everyone on the planet.

To learn more about Altera visit: http://intel.com/altera

featured chalk talk

Accessing AWS IoT Services Securely over LTE-M
Developing a connected IoT design from scratch can be a complicated endeavor. In this episode of Chalk Talk, Amelia Dalton, Harald Kröll from u-blox, Lucio Di Jasio from AWS, and Rob Reynolds from SparkFun Electronics examine the details of the AWS IoT ExpressLink SARA-R5 starter kit. They explore the common IoT development design challenges that AWS IoT ExpressLink SARA-R5 starter kit is looking to solve and how you can get started using this kit in your next connected IoT design.
Oct 26, 2023
19,905 views