SAN JOSE, Calif., November 6, 2017—Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced that HiSilicon, a global fabless semiconductor and IC design company, has selected the Cadence® Tensilica® Vision P6 DSP for its 10nm Kirin 970 mobile application processor, which debuted in Huawei’s new Mate 10 Series mobile phones. In deploying the Vision P6 DSP, HiSilicon added valuable imaging and vision processing capabilities to the Kirin SoC.
The high-performance Vision P6 DSP with increased math throughput and other architecture enhancements sets a new standard in imaging and computer vision benchmarks, increasing performance by up to 4X compared to the previous generation Tensilica Vision P5 DSP. Due to its wide VLIW SIMD architecture, highly optimized instruction set and expertly tuned imaging library, the DSP is an ideal platform for emerging imaging applications such as 3D sensing, human/machine interface, AR/VR and biometric identification for the mobile platform.
“We have a long history of working with the Cadence Tensilica team,” said Yanqiu Diao, deputy general manager, Turing Processor Business Unit at HiSilicon. “The Tensilica Vision P6 DSP provides us with the low energy and high efficiency needed for the most innovative imaging applications designed for the mobile platforms of 2018-2019. The software tools and library offered by Cadence allowed us to reduce our development time and achieve our desired performance target in record time.”
“With the integration of the Vision P6 DSP into their flagship Kirin 970 mobile application processor for Huawei’s latest phone, HiSilicon validates the Vision P6 DSP as their processor of choice when low power and high performance are needed for 3D sensing, human/machine interface and AR/VR applications,” said Pulin Desai, product marketing director for imaging and vision, of Cadence. “We are delighted that our long-term relationship and successes with HiSilicon keep us an integral part of their ongoing innovations in mobile and digital media.”
The Tensilica Vision P6 DSP is based on the Cadence Tensilica Xtensa® architecture and combines flexible hardware options with a library of vision/imaging DSP functions and numerous vision/imaging applications from established ecosystem partners. It also shares the comprehensive Tensilica partner ecosystem for other application software, emulation and probes, silicon and services, and much more. The Xtensa architecture is one of the most popular licensable processor architectures, shipping in products spanning from sensors to supercomputers.
Cadence enables electronic systems and semiconductor companies to create the innovative end products that are transforming the way people live, work and play. Cadence software, hardware and semiconductor IP are used by customers to deliver products to market faster. The company’s System Design Enablement strategy helps customers develop differentiated products—from chips to boards to systems—in mobile, consumer, cloud datacenter, automotive, aerospace, IoT, industrial and other market segments. Cadence is listed as one of Fortune Magazine’s 100 Best Companies to Work For. Learn more at cadence.com.