industry news
Subscribe Now

eSilicon at DAC: eSilicon Announces New Networking Platform

Presentations Tuesday, June 26 at Chip Estimate Booth 2:00-2:15 PM; Samsung Theatre 3:00-3:15 PM; Mentor Booth 4:00 – 5:00 PM

Join us at Stars of IP Party for appetizers, hosted bar, prizes and fun

For release on June 19, 2017, San Jose, Calif.

eSilicon, an independent provider of FinFET-class ASICs, custom IP, and advanced 2.5D packaging solutions, will participate at several venues at the 2018 Design Automation Conference (DAC) in San Francisco, California at Moscone Center West, June 24-28, 2018. IP Talks!
New Networking Platform
Learn about eSilicon’s new networking platform.
Presenter: Hugh Durdan, eSilicon’s VP, strategy and products
Tuesday, June 26, 2:00-2:15 PM Booth 2134

Samsung SAFE Partner Theater
eSilicon’s 14LPP IP Platform
Examples of production-qualified HBM/2.5D FinFET networking ASICs, including memory strategies to improve cost, density, power and yield.
Presenter: Mike Gianfagna, eSilicon’s VP, marketing
Tuesday, June 26, 3:00-3:15 PM
Samsung Booth 2635

Mentor Panel Discussion:
Getting Your Tapeout Done on Time isn’t Easy, but It can be Easier
More than 50% of tapeouts don’t occur on schedule. Which 50% do you want to be in? Come listen to Calibre customers talk about the challenges that they face and the steps that they take to get their tapeouts on time.
Panelists: Prasad Subramaniam, eSilicon’s VP, R&D and Design Technology; Bob Stear, Samsung; and Satish Dinavahi, Qualcomm India
Tuesday June 26, 4:00-5:00 PM
Mentor Booth 2161

Stars of IP Party at DAC 2018
Tuesday, June 26, 7:00-11:00 PM
Stars of IP is a private, invitation-only event. eSilicon is proud to be a co-host for this event. Silvaco encourages interested parties to seek eSilicon or other co-hosts on the DAC exhibit floor to connect and inquire about a ticket.

About eSilicon
eSilicon is an independent provider of complex FinFET-class ASICs, custom IP and advanced 2.5D packaging solutions. Our ASIC+IP synergies include complete 2.5D/HBM2 and TCAM platforms for FinFET technology at 7/14/16nm as well as SerDes, specialized memory compilers and I/O libraries. Supported by patented knowledge base and optimization technology, eSilicon delivers a transparent, collaborative, flexible customer experience to serve the high-bandwidth networking, high-performance computing, artificial intelligence (AI) and 5G infrastructure markets.

Leave a Reply

featured blogs
Jul 17, 2018
In the first installment, I wrote about why I had to visit Japan in 1983, and the semiconductor stuff I did there. Today, it's all the other stuff. Japanese Food When I went on this first trip to Japan, Japanese food was not common in the US (and had been non-existent in...
Jul 16, 2018
Each instance of an Achronix Speedcore eFPGA in your ASIC or SoC design must be configured after the system powers up because Speedcore eFPGAs employ nonvolatile SRAM technology to store the eFPGA'€™s configuration bits. Each Speedcore instance contains its own FPGA configu...
Jul 12, 2018
A single failure of a machine due to heat can bring down an entire assembly line to halt. At the printed circuit board level, we designers need to provide the most robust solutions to keep the wheels...