industry news
Subscribe to EE Journal Daily Newsletter
4 + 5 =

Bringing an additional layer of fortification to SoCs powering the next trillion connected devices

October 24, 2017

News highlights:

  • Arm announces availability of new on-die technology to protect against attacks seeking to compromise sensitive information through IC power consumption (SPA/DPA) and electromagnetic emission (SEMA/DEMA)
  • Enables simple, scalable, easy to integrate and cost-effective implementation

Last year at Arm TechCon, SoftBank Chairman and President Masayoshi Son laid out an ambitious vision of a trillion connected devices. It’s a vision Arm is aggressively pursuing by working with our ecosystem to invisibly enable those trillion devices to connect securely.

Connecting a trillion devices is no easy task of course but doing it securely is key. Especially when the tools and techniques used by attackers are rapidly evolving to go after every piece of system hardware from foundational SoCs to peripheral components. All are seen as an opportunity to access privileged data. With daily occurrences of cyber-attacks, it’s clear security across the entire device needs to be considered at the design stage, not as an afterthought.

At the SoC level, there are many classes of threats including those where attackers try to take advantage of the physical characteristics of the silicon implementation manifested during algorithmic execution. Today we’re announcing the availability of highly-efficient on-die threat mitigation technology designed to protect against threats including:

  • Simple and Differential Power Analysis (SPA/DPA), where an attacker is trying to compromise confidential information (e.g. a secret cryptographic key) through various analysis methods of the power consumed by an integrated circuit (IC) during operation
  • Simple and Differential Electromagnetic Analysis (SEMA/DEMA), where an attacker is trying to compromise confidential information (e.g. a secret cryptographic key) through various analysis methods of the electromagnetic field created during IC operation

The power and electromagnetic analysis mitigation technology relieves designers of the need to worry about this category of non-invasive attacks, while providing a solution that is easily scalable to cover changes in the protected logic. The resulting system benefit is addressing the leakage source directly and preventing sensitive data leakage through the IC power consumption and electromagnetic emission. From an implementation perspective, the mitigation technology is applicable across the full spectrum of silicon processes used in the semiconductor industry.

Trust between connected devices and their users is a critical factor in the continued growth of the IoT, particularly in applications making use of highly sensitive data, such as autonomous vehicles, mobile payment systems and connected health. Adding this technology to our security IP portfolio will enable the deployment of more secure devices as we drive toward our vision of a truly connected world.

To learn more about our security solutions, be sure to attend the security track at Arm TechCon, (Oct. 24-26 in Santa Clara, CA.) If you are a member of the press or analyst community, you can register for TechCon.

About Arm

Arm technology is at the heart of a computing and connectivity revolution that is transforming the way people live and businesses operate. Our advanced, energy-efficient processor designs are enabling the intelligence in more than 100 billion silicon chips and securely powering products from the sensor to the smartphone to the supercomputer. With more than 1,000 technology partners, including the world’s largest consumer brands, we are driving Arm innovation into all areas compute is happening inside the chip, the network and the cloud.

All information is provided “as is” and without warranty or representation. This document may be shared freely, attributed and unmodified. Arm is a registered trademark of Arm Limited (or its subsidiaries). All brands or product names are the property of their respective holders. © 1995-2017 Arm Group.

Leave a Reply

featured blogs
Nov 17, 2017
CASPA is the Chinese American Semiconductor Professional Association. Once a year they have their annual conference and dinner banquet. I ended up getting involved with them a few years ago when I stepped in with 24-hours' notice to moderate a panel session for them, plu...
Nov 15, 2017
SuperComputing 2017 remains in full force this week from the Colorado Convention Center in Denver.  There are lots of activity in presentations, seminars, demonstrations and exhibits on the tradeshow floor. Stay tuned to the Samtec blog the rest of the week for more highligh...
Nov 16, 2017
“Mommy, Daddy … Why is the sky blue?” As you scramble for an answer that lies somewhere between a discussion of refraction in gasses and “Oh, look—a doggie!” you already know the response to whatever you say will be a horrifyingly sincere “B...
Nov 07, 2017
Given that the industry is beginning to reach the limits of what can physically and economically be achieved through further shrinkage of process geometries, reducing feature size and increasing transistor counts is no longer achieving the same result it once did. Instead the...