industry news
Subscribe Now

Automotive CoolSiC™ Schottky diodes: combining performance and robustness

Jun 4, 2018 | Market News

Munich, Germany – 4 June 2018 – At this year’s PCIM Europe trade fair in Nuremberg (June 5 to June 7) Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) presents the first products of its automotive Silicon Carbide portfolio: the CoolSiC™ Schottky diode family is now ready for current and future on-board charger (OBC) applications in hybrid and electric vehicles. Infineon has designed the diodes specifically to meet the high requirements of the automotive industry regarding reliability, quality and performance.

“The SiC technology is now mature to be deployed at broad scale in automotive systems“, says Stephan Zizala, Vice President and General Manager for Automotive High Power at Infineon. “The launch of the automotive CoolSiC Schottky diode family is a milestone in the deployment of Infineon’s SiC product portfolio for on-board charger, DC/DC converters and inverter systems”.

The new product family is based on Infineon’s 5th generation Schottky Diode, which has been further improved to meet the reliability requirements demanded by the automotive industry. Thanks to a new passivation layer concept, this is the most robust automotive device available in the market regarding humidity and corrosion. Moreover, because it is based on a 110µm thin wafer technology, it shows one of the best figures of merit (Qc x Vf) in its category. A lower figure of merit implies lower power losses and therefore a better electrical performance.

Compared to the traditional Silicon Rapid diode, the CoolSiC Automotive Schottky Diode can improve the efficiency of an OBC by one percentage point over all load conditions. This leads to a potential reduction of 200kg of CO 2 emissions over the typical lifetime of an electric car, based on the German energy mix.

The first derivate will be available for the open market in September 2018 in the 650V class. Using a standard 3-pinTO247 package, the new products can easily be implemented in an OBC system. They can optimally be used in combination with Infineon’s TRENCHSTOP™ IGBT and CoolMOS™ products.

Infineon at the PCIM 2018

At the PCIM 2018 tradeshow Infineon is presenting leading edge technology for efficient systems in industrial, consumer and automotive applications. Infineon’s demos for empowering a world of unlimited energy are presented at booth #412 in hall 9 (Nuremberg, Germany, 5-7 June 2018). Information about the PCIM show highlights is available at www.infineon.com/pcim.

Leave a Reply

featured blogs
Oct 18, 2018
The IC6.1.8 and ICADVM18.1 production releases are now available for download at Cadence Downloads . IC6.1.8 ICADVM18.1 For information on supported platforms, compatibility with other Cadence tools, and details of key issues reported by our early access partners that have be...
Oct 17, 2018
Samtec offers one of the industry'€™s largest and most flexible lines of two-piece, pin-and-socket board-stacking interconnects. To say it another way, we have more ways to stack two or more boards together than any other connector company.  Also, you can specify a cust...
Oct 16, 2018
  IC Insights has just published the September Update to The 2018 McClean Report, and one figure (reproduced below) puts yet another nail into the coffin for poor old Moore'€™s Law. Now please take care. There'€™s a vertical line between the 200mm wafers on the left ...
Oct 12, 2018
At the end of the day, your products are only as good as their in-the-field performance. It doesn'€™t matter how well they performed in a controlled environment....