industry news
Subscribe Now

SoCIP Road Shows to Stop at Shenzhen, Chengdu and Xi’an

Shanghai, China – Aug 27th, 2010 – SoCIP 2010 Road Show seminars will be making stops at Shenzhen on Sep 7th, Chengdu on Sep 8th and Xi’an on Sep 10th, showcasing the latest SoC design technologies from 2010 SoCIP sponsors: S2C, CAST, Innopower, Chips&Media, Cosmic Circuits, SpingSoft, Tensilica, Innosilicon, IP Goal, IPextreme, Northwest Logic, Renasas and Transwitch.  The Road Show seminars will recap, in shorter time-frame, the SoC design technologies presented at the all-day SoCIP 2010 Symposium held in Shanghai and Beijing in June this year.  The SoCIP 2010 Road Show seminars will be hosted at the local National Integrated Circuit Design Industrialization Center (ICC) in each city. All interested participants should register through socip@s2cinc.com e-mail or contact Michel Cao at +86 21 6887 9287.   

The SoCIP 2010 Road Show seminars are cut down versions of the 3rd annual SoC IP Symposium held in Beijing and Shanghai which attracted over 300 qualified attendees and 14 exhibitors. The Road Show seminars will last about 3 hours and split into 2 sessions with the first session focused on the latest IP technologies and the second session focused on SoC Prototyping and Prototype Ready™ IP technologies.  In the IP technology session, S2C will first introduce all IP technologies of the SoCIP 2010 sponsors, followed by speech given by Justin Yang, China General Manager of Innopower Technology, presenting how Innopower’s proven IP cores can overcome your SoC bottleneck.  Innopower Technology is wholly-owned subsidiary of Faraday Technology Corporation.   

In the SoC Prototyping and Prototype Ready IP technology session, S2C will introduce its 4th generation TAI Logic Modules based on multiple Altera Stratix-4 FPGA devices or Xilinx Virtex-6 FPGA devices. These new TAI Logic Modules enable designers to prototype up to 16.4M ASIC gates on one board.  Besides FPGA prototyping hardware, S2C will also demonstrate TAI Player Pro version 3.3 that enables partitioning of a SoC design to multiple FPGAs and debug concurrently.  Finally, S2C will showcase a number of Prototype Ready IP running on S2C TAI Logic Module as reference designs including DDR2 at 667MHz, PCIe, H.264 Encoder and Gigabit Ethernet.  Prototype Ready IP can be used by SoC designers to quickly determine which IP to use and dramatically shorten IP integration time into the system. 

SoCIP events are organized by S2C Inc., a leading rapid SoC prototyping company, headquartered in San Jose, CA with development and support centers in Shanghai and Beijing. SoCIP mission is to serve the SoC design community by providing technologies and product information that enable precise SoC-first pass success. 

About SoCIP

SoCIP aims to serve the SoC design community by providing technologies and product information that enable precise SoC design resulting if first pass silicon success. Our vision is for a designer to rapidly assemble a SoC prototype by using commercial IP with minimal up-front cost, validate that the function is correct and then find the right services provider to turn the prototype into a real silicon – all this results in maximum return on  your SoC investment. SoCIP is organized by S2C Inc. www.s2cinc.com and sponsored by leading silicon IP and SoC design technologies companies around the world. For more information about SoCIP 2010 or to register, please visit www.socip.org 

About S2C

Founded and headquartered in San Jose, California, S2C has been successfully delivering rapid SoC prototyping tools since 2003.  S2C provides: 

  • Rapid SoC FPGA-based prototyping hardware systems plus design and verification software.
  • Third-party Prototype Ready IP™
  • SoC design, prototype and production services

S2C’s value proposition is our highly qualified engineering team and customer-focused sales force that understands our customers’ commercial SoC development needs.  S2C’s unique FPGA-based electronic system level (ESL) solution, using our patented TAI IP technology, enables designers to quickly assemble FPGA-based SoC prototypes on S2C FPGA boards easily and securely.  This enables customers to start software development, typically the long pole item in development schedules, immediately.  Combining rapid prototyping methodologies with a comprehensive portfolio of Prototype Ready IP and advanced design solutions, S2C can reduce the SoC design cycle by up to nine months.   

S2C currently has 3 direct offices located in Shanghai, Beijing and Shenzhen to meet the demand for accelerated SoC design activities in China. S2C is also the organizer of the annual SoCIP seminar and exhibition in China, which brings SoC designers/professionals from the Asia-Pacific region together with international silicon IP and SoC solution vendors. For more information, visit www.s2cinc.com 

Leave a Reply

featured blogs
Apr 25, 2024
Cadence's seven -year partnership with'¯ Team4Tech '¯has given our employees unique opportunities to harness the power of technology and engage in a three -month philanthropic project to improve the livelihood of communities in need. In Fall 2023, this partnership allowed C...
Apr 24, 2024
Learn about maskless electron beam lithography and see how Multibeam's industry-first e-beam semiconductor lithography system leverages Synopsys software.The post Synopsys and Multibeam Accelerate Innovation with First Production-Ready E-Beam Lithography System appeared fir...
Apr 18, 2024
Are you ready for a revolution in robotic technology (as opposed to a robotic revolution, of course)?...

featured video

MaxLinear Integrates Analog & Digital Design in One Chip with Cadence 3D Solvers

Sponsored by Cadence Design Systems

MaxLinear has the unique capability of integrating analog and digital design on the same chip. Because of this, the team developed some interesting technology in the communication space. In the optical infrastructure domain, they created the first fully integrated 5nm CMOS PAM4 DSP. All their products solve critical communication and high-frequency analysis challenges.

Learn more about how MaxLinear is using Cadence’s Clarity 3D Solver and EMX Planar 3D Solver in their design process.

featured paper

Designing Robust 5G Power Amplifiers for the Real World

Sponsored by Keysight

Simulating 5G power amplifier (PA) designs at the component and system levels with authentic modulation and high-fidelity behavioral models increases predictability, lowers risk, and shrinks schedules. Simulation software enables multi-technology layout and multi-domain analysis, evaluating the impacts of 5G PA design choices while delivering accurate results in a single virtual workspace. This application note delves into how authentic modulation enhances predictability and performance in 5G millimeter-wave systems.

Download now to revolutionize your design process.

featured chalk talk

Introduction to the i.MX 93 Applications Processor Family
Robust security, insured product longevity, and low power consumption are critical design considerations of edge computing applications. In this episode of Chalk Talk, Amelia Dalton chats with Srikanth Jagannathan from NXP about the benefits of the i.MX 93 application processor family from NXP can bring to your next edge computing application. They investigate the details of the edgelock secure enclave, the energy flex architecture and arm Cortex-A55 core of this solution, and how they can help you launch your next edge computing design.
Oct 23, 2023
24,145 views