editor's blog
Subscribe Now

Redpine Gives Makers a “Future-Proof” IoT Platform

Internet of Things (IoT) platforms have been a thing since we started talking about the IoT way back with our coverage of Ayla Networks. The idea is to provide all the pieces necessary for assembling an IoT application.

Problem is, “platform” is an incredibly overloaded term. In our context, it can mean an offering that includes everything you need, or it can mean a framework for interconnecting pieces (pieces not necessarily included). It may even refer only to a portion of an IoT installation, like wireless communication.

Redpine, known generally for its WiFi technology, has recently announced its own platform, which they call WyzBee. They appear to be targeting it largely at the Maker community, which is distinguished by diligent individuals off in garages and sheds with limited resources and negotiating leverage. The platform is being positioned as complete, womb to tomb, soup to nuts.

Not only are there Redpine-originated Things, but it has a design environment where you can create your production design – PC board and all.

What makes this stand out is the level of hardware integration they’ve provided – which they refer to as future-proofing. The platform implements WiFi (“n”, both bands), Bluetooth LE, and ZigBee. The IP commonality afforded by 6LoWPAN in the otherwise non-IP Bluetooth and ZigBee networks helps tie this together into something more than just a board with three random radios on it.

The other integration they’ve provided in their SoC is Twitter and Facebook connectivity. This was apparently a difficult thing to get right. They’ve also implemented direct connectivity to a variety of Cloud services, meaning that applications can access them without a separate external proxy.

Network nodes can communicate using CoAP, MQTT, email, and texts. Security is bolstered by a hardware PUF: a physically unclonable function that establishes the device ID for binding purposes as well as supporting key generation for encryption and authentication.

 Hi-Res-WyzBee-board_red.png

(Image courtesy Redpine)

You can read more about it in their announcement.

Leave a Reply

featured blogs
Apr 18, 2024
Analog Behavioral Modeling involves creating models that mimic a desired external circuit behavior at a block level rather than simply reproducing individual transistor characteristics. One of the significant benefits of using models is that they reduce the simulation time. V...
Apr 16, 2024
Learn what IR Drop is, explore the chip design tools and techniques involved in power network analysis, and see how it accelerates the IC design flow.The post Leveraging Early Power Network Analysis to Accelerate Chip Design appeared first on Chip Design....
Mar 30, 2024
Join me on a brief stream-of-consciousness tour to see what it's like to live inside (what I laughingly call) my mind...

featured video

MaxLinear Integrates Analog & Digital Design in One Chip with Cadence 3D Solvers

Sponsored by Cadence Design Systems

MaxLinear has the unique capability of integrating analog and digital design on the same chip. Because of this, the team developed some interesting technology in the communication space. In the optical infrastructure domain, they created the first fully integrated 5nm CMOS PAM4 DSP. All their products solve critical communication and high-frequency analysis challenges.

Learn more about how MaxLinear is using Cadence’s Clarity 3D Solver and EMX Planar 3D Solver in their design process.

featured chalk talk

FlyOver® Technology: Twinax FlyOver® System for Next Gen Speeds -- Samtec and Mouser
Sponsored by Mouser Electronics and Samtec
In this episode of Chalk Talk, Amelia Dalton and Matthew Burns from Samtec investigate the challenges of routing high speed data over lossy PCBs. They also discuss the benefits that Samtec’s Flyover® cable assembly systems bring to data center and embedded designs and how Samtec is furthering innovation with their high speed interconnect solutions. 
Apr 15, 2024
437 views