editor's blog
Subscribe Now

Algorithms or Methodologies?

You see it two to four times a year from each EDA player: “x% Productivity Gains with y Tool!” Cadence recently had such an announcement with their Incisive tool; Synopsys has just had a similar story with FineSim.

As I was talking with the Cadence folks about this, I wondered: How much of this productivity gain comes as a result of engine/algorithm improvements, and how much as a result of methodology changes? The answer is, of course, that it comes from both.

But there’s a difference in when the benefits accrue. Engine improvements are immediately visible when you run the tool. Methodology changes: not so much. And there are actually two aspects to methodology.

The first is that, of course, a new methodology requires training and getting used to. So the first project done using a new methodology will take longer; the next one should be better because everyone is used to the new way of doing things. This is a reasonably well-known effect.

But there may be an extra delayed benefit: some methodology changes require new infrastructure or have a conversion cost. If, for example, you replace some aspect of simulation with a new formal tool, you have to modify your testbench and create the new test procedure from scratch. There may be, for instance, numerous pieces of IP that need to be changed to add assertions. These are largely one-time investments, with incremental work required on follow-on projects.

In this example, it may be that, even with the conversion work, things go faster even on the first project. But productivity will be even better next time, when much of the infrastructure and changes are ready and waiting.

As to the engines, I was talking to the folks at Mentor yesterday, and wondered whether improvements to the tools themselves become asymptotic: does there come a point when you just can’t go any faster? Their answer was, “No,” since there’s always some bottleneck that didn’t used to be an issue until the other bigger bottlenecks got fixed. The stuff that got ignored keeps bubbling up in priority, the upshot being that there’s always something that can be improved to speed up the tools.

Leave a Reply

featured blogs
Apr 24, 2024
Diversity, equity, and inclusion (DEI) are not just words but values that are exemplified through our culture at Cadence. In the DEI@Cadence blog series, you'll find a community where employees share their perspectives and experiences. By providing a glimpse of their personal...
Apr 23, 2024
We explore Aerospace and Government (A&G) chip design and explain how Silicon Lifecycle Management (SLM) ensures semiconductor reliability for A&G applications.The post SLM Solutions for Mission-Critical Aerospace and Government Chip Designs appeared first on Chip ...
Apr 18, 2024
Are you ready for a revolution in robotic technology (as opposed to a robotic revolution, of course)?...

featured video

MaxLinear Integrates Analog & Digital Design in One Chip with Cadence 3D Solvers

Sponsored by Cadence Design Systems

MaxLinear has the unique capability of integrating analog and digital design on the same chip. Because of this, the team developed some interesting technology in the communication space. In the optical infrastructure domain, they created the first fully integrated 5nm CMOS PAM4 DSP. All their products solve critical communication and high-frequency analysis challenges.

Learn more about how MaxLinear is using Cadence’s Clarity 3D Solver and EMX Planar 3D Solver in their design process.

featured paper

Designing Robust 5G Power Amplifiers for the Real World

Sponsored by Keysight

Simulating 5G power amplifier (PA) designs at the component and system levels with authentic modulation and high-fidelity behavioral models increases predictability, lowers risk, and shrinks schedules. Simulation software enables multi-technology layout and multi-domain analysis, evaluating the impacts of 5G PA design choices while delivering accurate results in a single virtual workspace. This application note delves into how authentic modulation enhances predictability and performance in 5G millimeter-wave systems.

Download now to revolutionize your design process.

featured chalk talk

Maximizing High Power Density and Efficiency in EV-Charging Applications
Sponsored by Mouser Electronics and Infineon
In this episode of Chalk Talk, Amelia Dalton and Daniel Dalpiaz from Infineon talk about trends in the greater electrical vehicle charging landscape, typical block diagram components, and tradeoffs between discrete devices versus power modules. They also discuss choices between IGBT’s and Silicon Carbide, the advantages of advanced packaging techniques in both power discrete and power module solutions, and how reliability is increasingly important due to demands for more charging cycles per day.
Dec 18, 2023
17,428 views