feature article
Subscribe Now

Chips – Not Just For Kids

Fish Fry - December 10, 2010

In my Fish Fry this week, I examine where our chips come from, the new Xilinx (TI enhanced) DSP kit, statistical variations in semiconductor processes, and some seriously bad movie tech. I’ll also be giving you a chance to win a Texas Instruments Wireless Watch Development Tool.

Join me for this week’s news wrap-up with my unique perspective on the high-tech news of the week…  

If you like the idea of this new series, be sure to drop a comment in the box below. I appreciate all of your comments so far, and we will be working to enhance the Fish Fry each week – as long as you’re watching.

 

Watch More Fish Frys

Leave a Reply

featured blogs
Apr 23, 2024
The automotive industry's transformation from a primarily mechanical domain to a highly technological one is remarkable. Once considered mere vehicles, cars are now advanced computers on wheels, embodying the shift from roaring engines to the quiet hum of processors due ...
Apr 22, 2024
Learn what gate-all-around (GAA) transistors are, explore the switch from fin field-effect transistors (FinFETs), and see the impact on SoC design & EDA tools.The post What You Need to Know About Gate-All-Around Designs appeared first on Chip Design....
Apr 18, 2024
Are you ready for a revolution in robotic technology (as opposed to a robotic revolution, of course)?...

featured video

How MediaTek Optimizes SI Design with Cadence Optimality Explorer and Clarity 3D Solver

Sponsored by Cadence Design Systems

In the era of 5G/6G communication, signal integrity (SI) design considerations are important in high-speed interface design. MediaTek’s design process usually relies on human intuition, but with Cadence’s Optimality Intelligent System Explorer and Clarity 3D Solver, they’ve increased design productivity by 75X. The Optimality Explorer’s AI technology not only improves productivity, but also provides helpful insights and answers.

Learn how MediaTek uses Cadence tools in SI design

featured chalk talk

Maximizing High Power Density and Efficiency in EV-Charging Applications
Sponsored by Mouser Electronics and Infineon
In this episode of Chalk Talk, Amelia Dalton and Daniel Dalpiaz from Infineon talk about trends in the greater electrical vehicle charging landscape, typical block diagram components, and tradeoffs between discrete devices versus power modules. They also discuss choices between IGBT’s and Silicon Carbide, the advantages of advanced packaging techniques in both power discrete and power module solutions, and how reliability is increasingly important due to demands for more charging cycles per day.
Dec 18, 2023
17,298 views