May 18, 2016

The CEA Announces Expanded Collaboration with Intel to Advance Cutting-edge Research and Innovation in Key Digital Areas

FotoNation® Partners With Kyocera to Develop Intelligent Automotive Camera Technology

Triple-Channel Universal PMIC Supports Low Power FPGA and SoC Processors

Gap Wireless Distributing iBwave Wi-Fi® Suite for In-building Network Design

May 17, 2016

Aldec Extends Spectrum of Verification Tools for Use in Digital ASIC Designs

Curtiss-Wright Demonstrates Power® Architecture-based Glass Cockpit Display Solution and Advanced Air-Flow Through (AFT) Cooling for 3U Systems

Fairchild Launches New Discrete and Bare Die IGBTs for Hybrid and All-Electric Vehicles

Xentech Solutions Ltd selects Achronix Speedster22i FPGAs for its Axtrinet™ Ethernet Packet Generators

Arduino Primo base board features native Bluetooth low energy wireless connectivity and NFC Touch-to-Pair using Nordic Semiconductor nRF52832 SoC

Ampleon GaN RF transistor family complements LDMOS portfolio with high-efficiency and wideband solutions for mobile broadband

Latest Synopsys IC Compiler II Release Boosts Quality-of-Results for Performance-Critical Designs

Spectrum launches educational tools teach signal generation, acquisition and analysis

Curtiss-Wright Presents Technical Session on COTS and DO-254 Safety Certifiability in the Defense and Aerospace Industry at NXP FTF 2016 Technology Forum

Imec Expands its Silicon Platform for Quantum Computing Applications

Avnet Expands PicoZed Ecosystem with Updated FMC Carrier Card Kit

Toshiba Expands Synopsys IC Compiler II Usage Across Groups to Shorten Design Cycle

May 16, 2016

Lattice Announces First Programmable ASSP (pASSP) Interface Bridge for Mobile Image Sensors and Displays

Automotive industry qualified power inductors from TT Electronics are robust and efficient

ProTek Devices Beefs Up Circuit Protection Offering Across Networking, Mobile and other Computing Applications

UltraSoC announces significant product update, improved support for analytics and ‘any CPU’ capability

STMicroelectronics Reveals Advanced Silicon-Carbide Power Devices to Accelerate Automotive Electrification

Micronas Deploys ClioSoft SOS Design Collaboration Platform

Uurmi Fog Removal Software Now Available on Cadence Tensilica Vision DSPs

May 13, 2016

Encapsulated DC-DC converters offer chassisor DIN rail mounting

May 12, 2016

IAR Systems Presents How to Get Smaller, Faster and Smarter Code at IoT DevCon in Santa Clara, California

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