February 23, 2017

VadaTech launches a dual-channel IF signal conditioning unit

CEVA Introduces the World’s Most Advanced Communication DSP, Providing Cutting-Edge Performance for Multi-Gigabit Class Connectivity

Sequans and Orion Labs Partner to Develop First LTE-enabled Wearable with Monarch LTE-M Chip

STMicroelectronics Works with Sigfox to Extend Plug-and-Play IoT Security to Industrial and Consumer Device Makers

New Bidirectional Power-Switching Solution is One of the Industry’s Smallest

Waves Nx VR Audio Technology Now Available for Cadence Tensilica HiFi Audio DSPs

Renesas Electronics Europe: Third European MCU Car Rally Competition Showcases Student Creativity with State-of-the-Art Renesas Solutions at Embedded World 2017

February 22, 2017

Tiny fibers open new windows into the brain

Ultrahaptics collaborates with HARMAN to integrate mid-air haptic sensations into connected cars

Lattice Semiconductor Expands CrossLink Programmable ASSP (pASSP) IP Solutions

First Scalable Wi-Fi HaLow MAC from Methods2Business Built with Cadence Tensilica DSP

CUI Successfully Deploys its Software Defined Power Solutions (ICE Block) to Industry-Leading Data Center Operators

LETI TO PRESENT LATEST R&D RESULTS ON Three Alternatives to EUV and 193nm Lithography at SPIE Meeting in US

Sequans Introduces Monarch SX: LTE-M/NB-IoT System-on-Chip for Integrated IoT Devices

STMicroelectronics Extends Flexibility of STM32 Ecosystem with Latest STM32F722 Nucleo board and STM32F723 Discovery kit

EXFO and Rohde & Schwarz accelerate troubleshooting of mobile networks

Xilinx Unveils Disruptive Integration and Architectural Breakthrough for 5G Wireless with RF-Class Analog Technology

February 21, 2017

STMicroelectronics Delivers Superior-Performing NFC Technology for Secure Contactless Payments and IoT Applications

Accellera Day Opens DVCon U.S. on Monday, February 27 with Three Timely Tutorials

Connected cars: Rohde & Schwarz Cybersecurity now provides dedicated security solutions for IoT automotive telematics

KT Chooses Conexant’s Far-Field Voice Input Processor to Boost AI Performance of GiGA Genie Virtual Assistant Media Hub

GLOBALFOUNDRIES Announces Availability of 45nm RF SOI to Advance 5G Mobile Communications

ITTIA Empowers the Development of Intelligent IoT Devices together with Renesas Electronics America by Delivering ITTIA DB SQL Database Software on Power-Efficient RZ/A Microprocessor Series

Synopsys IC Compiler II Sets the Bar in Quality-of-Results

STMicroelectronics and USound Agree to Make World’s First Spectacular-Sounding MEMS Speakers

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